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Happ, DE

Andreas Happ, Karlsruhe DE

Patent application numberDescriptionPublished
20110099784METHOD FOR APPLYING A SURFACE STRUCTURE TO A SOLID BODY AND SOLID BODY PROVIDED WITH SUCH A SURFACE STRUCTURE - A method for applying a surface structure to a solid body, wherein a structured surface is placed directly or indirectly onto the surface of the solid body and the structure of this structured surface is reproduced in the surface of the solid body, in that 05-05-2011

Bobby Happ, Jena DE

Patent application numberDescriptionPublished
20140171536Dental Restorative Materials Based on Polymerizable Azides and Alkynes - The invention relates to a dental restorative material on the basis of at least one compound of Formula I06-19-2014

Matthias Happ, Erfurt-Niedernissa DE

Patent application numberDescriptionPublished
20110199200Method and Device for Automatic Direction Indication - The invention relates to a method for automatic direction indication, comprising the following steps: 08-18-2011

Thomas Happ, Munich DE

Patent application numberDescriptionPublished
20100293350METHOD OF OPERATING AN INTEGRATED CIRCUIT, INTEGRATED CIRCUIT AND MEMORY MODULE - According to one embodiment of the present invention, a method of operating an integrated circuit including a plurality of resistance changing memory cells grouped into physical memory units is provided. The method includes: Monitoring writing access numbers assigned to the physical memory units, each writing access number reflecting the number of writing accesses to the physical memory unit to which the writing access number is assigned; if the value of a writing access number assigned to a first physical memory unit exceeds a writing access threshold value, a data exchange process is carried out during which the data content stored within the first physical memory unit is exchanged with the data content of a second physical memory unit having a writing access number of a lower value.11-18-2010
20120285512SOLAR CELL ARRAY AND THIN-FILM SOLAR MODULE AND PRODUCTION METHOD THEREFOR - A solar cell array is described which can be designed in particular as a thin-film solar module. A production method for a solar cell array is further described.11-15-2012

Thomas Happ, Muenchen DE

Patent application numberDescriptionPublished
20100290277RESISTIVE MEMORY CELL ACCESSED USING TWO BIT LINES - An integrated circuit includes a first bit line and a resistance changing memory element coupled to the first bit line. The integrated circuit includes a second bit line and a heater coupled to the second bit line. The integrated circuit includes an access device coupled to the resistance changing memory element and the heater.11-18-2010
20130045558DEVICE AND METHOD FOR PRECIPITATING A LAYER ON A SUBSTRATE - A device for depositing a layer containing at least two components on an object, including: a deposition chamber; a source containing a material to be deposited; and a control device, which controls the deposition process, implemented such that a concentration of the component of the material can be modified in its gas phase prior to deposition on the object by selective binding a specified quantity of the component, wherein the selectively bound quantity of the component is controlled by modifying a control parameter that is actively coupled to a binding rate or the component, and wherein the control device contains a gettering element containing a reactive material containing copper and/or molybdenum. Also, a method for depositing a layer containing at least two components on an object, wherein a selectively bound quantity of a component is controlled by modifying a binding rate of the component of the control device.02-21-2013
20130319518SOLAR MODULE WITH A CONNECTING ELEMENT - A solar module having a connecting element is described. The solar module has a substrate, a back electrode layer, a photovoltaically active absorber layer, and a cover pane disposed one over the other, at least one prefabricated conductive film at least one connection housing.12-05-2013
20140216527FRAMELESS SOLAR MODULE WITH MOUNTING HOLES - A frameless solar module having a carrier substrate and a top layer connected thereto, between which there is a layer structure which forms a plurality of solar cells connected in series for the photovoltaic generation of power is described. The carrier substrate and/or the top layer of the frameless solar module is/are provided with mounting holes for mounting the solar module on a module bracket or for connection to at least one further solar module. The mounting holes are produced in a coating-free zone within a photovoltaically active region. Mounting arrangements having such a solar module which contain fixing elements which pass through the mounting holes are also described. Furthermore, a method for producing such a solar module in which the mounting holes are produced in the carrier substrate and/or in the top layer is also described.08-07-2014
20140246074SOLAR MODULE WITH RIBBON CABLE, AND A METHOD FOR THE MANUFACTURE OF SAME - A solar module, more particularly a thin-film solar module having a plurality of solar cells connected in series for the photovoltaic generation of power, is described. The solar module has two voltage terminals of opposite polarity, which are each connected to an external surface of the module. Each of the two leads is electrically connected to a separate terminal device. Each of the two terminal housings is attached to the outer surface of the module. The two leads are electrically interconnected through a flyback diode, and the two terminal devices are electrically connected by a ribbon cable that is arranged between the two terminal housings and attached to the external surface of the module. A manufacturing method for the solar module is also described.09-04-2014
20150072460DEVICE AND METHOD FOR PRECIPITATING A LAYER ON A SUBSTRATE - The invention relates to a device for depositing a layer made of at least two components on an object, with a deposition chamber for disposing the object, at least one source with material to be deposited, as well as at least one device for controlling the deposition process, implemented such that the concentration of at least one component of the material to be deposited can be modified in its gas phase prior to deposition on the substrate by selective binding of a specified quantity of the at least one component, wherein the selectively bound quantity of the at least one component can be controlled by modifying at least one control parameter that is actively coupled to a binding rate or the component. It further relates to a device for depositing a layer made of at least two components on an object, wherein a device for controlling the deposition process has at least one gettering element made of a reactive material, wherein the reactive material includes copper and/or molybdenum. It further relates to a method for depositing a layer made of at least two components on an object, wherein a selectively bound quantity of at least one component is controlled by modifying a binding rate of a device for controlling the deposition process.03-12-2015

Patent applications by Thomas Happ, Muenchen DE

Thomas Happ, Munchen DE

Patent application numberDescriptionPublished
20150295105LAYER SYSTEM FOR THIN-FILM SOLAR CELLS HAVING AN NaxIn1SyClz BUFFER LAYER - The present invention relates to a layer system (10-15-2015

Thomas D. Happ, Dresden DE

Patent application numberDescriptionPublished
20090242865MEMORY ARRAY WITH DIODE DRIVER AND METHOD FOR FABRICATING THE SAME - A method of fabricating a memory array. The method begins with a structure, generally composed of dielectric fill material and having conductive lines formed at its lower portion, and a sacrificial layer formed on its upper surface. Diodes are formed in the fill material, each diode having a lightly-doped first layer of the same conductivity type as the conductive lines; a heavily doped second layer of opposite conductivity type; and a conductive cap. Self-aligned vias are formed over the diodes. Self-aligned, and self-centered spacers in the self-aligned vias define pores that expose the conductive cap. Memory material is deposited within the pores, the memory material making contact with the conductive cap. A top electrode is formed in contact with the memory material.10-01-2009
20090251944MEMORY CELL HAVING IMPROVED MECHANICAL STABILITY - Memory cells are described along with methods for manufacturing. A memory cell described herein includes a bottom electrode comprising a base portion and a pillar portion on the base portion, the pillar portion and the base portion having respective outer surfaces and the pillar portion having a width less than that of the base portion. A memory element is on a top surface of the pillar portion of the bottom electrode, and a top electrode is on the memory element. A dielectric spacer contacts the outer surface of the pillar portion, the outer surface of the base portion of the bottom electrode self-aligned with an outer surface of the dielectric spacer.10-08-2009
20090267042Integrated Circuit and Method of Manufacturing an Integrated Circuit - According to one embodiment of the present invention, an integrated circuit including a plurality of resistance changing memory cells is provided. Each memory cell includes: a semiconductor substrate; a select device arranged within the semiconductor substrate; and a memory element being arranged above the semiconductor substrate. The select device is a diode comprising a first semiconductor area of a first conductive type and a second semiconductor area of a second conductive type which are arranged adjacent to each other such that a lateral pn-junction is formed. The first semiconductor area is connected to a word line arranged on or above the semiconductor substrate. The second semiconductor area is connected to the memory element via a conductive connection element.10-29-2009
20090315090Isolation Trenches with Conductive Plates - Methods of forming isolation trenches, semiconductor devices, structures thereof, and methods of operating memory arrays are disclosed. In one embodiment, an isolation trench includes a recess disposed in a workpiece. A conductive material is disposed in a lower portion of the channel. An insulating material is disposed in an upper portion of the recess over the conductive material.12-24-2009
20100019215MUSHROOM TYPE MEMORY CELL HAVING SELF-ALIGNED BOTTOM ELECTRODE AND DIODE ACCESS DEVICE - Memory devices are described along with methods for manufacturing. A memory device as described herein includes a plurality of word lines extending in a first direction, and a plurality of bit lines overlying the plurality of word lines and extending in a second direction. A plurality of memory cells are at cross-point locations. Each memory cell comprises a diode having first and second sides aligned with sides of a corresponding word line. Each memory cell also includes a bottom electrode self-centered on the diode, the bottom electrode having a top surface with a surface area less than that of the top surface of the diode. Each of the memory cells includes a strip of memory material on the top surface of the bottom electrode, the strip of memory material underlying and in electrical communication with a corresponding bit line.01-28-2010
20100054029CONCENTRIC PHASE CHANGE MEMORY ELEMENT - The present invention in one embodiment provides a memory device including a first electrode; a second electrode; and a memory cell positioned between the first electrode and the second electrode, the memory cell including a core of a first phase change material and a cladding of a second phase change material, wherein the first phase change material has a lower crystallization temperature than the second phase change material. The present invention also provides methods of forming the above described memory device.03-04-2010

Thomas D. Happ, Dresdan DE

Patent application numberDescriptionPublished
20120134204CONCENTRIC PHASE CHANGE MEMORY ELEMENT - The present invention in one embodiment provides a memory device including a first electrode; a second electrode; and a memory cell positioned between the first electrode and the second electrode, the memory cell including a core of a first phase change material and a cladding of a second phase change material, wherein the first phase change material has a lower crystallization temperature than the second phase change material. The present invention also provides methods of forming the above described memory device.05-31-2012
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