Patent application number | Description | Published |
20080264685 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer. | 10-30-2008 |
20080266018 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency. | 10-30-2008 |
20080266026 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size. | 10-30-2008 |
20080314630 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one end is connected to the first metal plate; a second metal plate connected to the other end of the via; a first metal layer being connected to the second metal layer through a metal line; a first dielectric layer, layer-built between the first metal layer and the first metal plate; a second dielectric layer, layer-built on the first metal plate and the first dielectric layer; and a second metal layer, layer-built on the second dielectric layer. With the present invention, it is possible to solve the aforementioned mixed signal problem by preventing the EM wave of a certain frequency range from being transferred. | 12-25-2008 |
20080314634 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency. | 12-25-2008 |
20080314635 | Printed circuit board having electromagnetic bandgap structure - A printed circuit board solving a mixed signal problem between an analog circuit and a digital circuit is disclosed. In accordance with an embodiment of the present invention, the printed circuit board, having an analog circuit and a digital circuit, includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a ground layer; a third metal layer, layer-built between the first metal layer and the second metal layer; and a mushroom type structure including a via connected to a metal plate, the metal plate being arranged-in a space between circuit patterns of the third metal layer. With the present invention, the printed circuit board can lower the noise level within the same frequency band as compared with other structures having the same size. | 12-25-2008 |
20090015354 | Electromagnetic bandgap structure, printed circuit board comprising this and method thereof - An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in accordance with an embodiment of the present invention can include: a first metal layer; a first dielectric layer, stacked on the first metal layer; a metal plate, stacked on the first dielectric layer; a second dielectric layer, stacked on the metal plate and the first dielectric layer; a second metal layer, stacked on the second dielectric layer; and a via, directed from the metal plate to the first metal layer and the second metal layer. The via can be connected to the first metal layer and is not connected the second metal layer. | 01-15-2009 |
20090038840 | Electromagnetic bandgap structure and printed curcuit board - Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates to each other. The stitching via can pass through the dielectric layer, and a part of the stitching via can be placed in a planar surface that is different from a planar surface in which the conductive plates are placed. With the present invention, the electromagnetic bandgap structure can prevent a signal of a predetermined frequency band from being transferred. | 02-12-2009 |
20090039984 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency. | 02-12-2009 |
20090071603 | Method of manufacturing printed circuit board and electromagnetic bandgap structure - A method of manufacturing a 4-layered printed circuit board by one-time stacking process is disclosed. In particular, the printed circuit board manufacturing method includes adhering copper clad laminates (CCL) to both surfaces of a foam tape; forming an inner layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being not adhered to the foam tape; separating the CCL from the foam tape; arranging the copper thin layer in which the inner layer circuit pattern is formed to face a prepreg; compressing the CCL into the prepreg; and forming an outer layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being in no contact with the prepreg. | 03-19-2009 |
20090071709 | Electromagnetic bandgap structure and printed circuit board including multi-via - An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate. | 03-19-2009 |
20090084582 | Printed circuit board having stepped conduction layer - A printed circuit board having a stepped conduction layer is disclosed. In one embodiment of the invention, a printed circuit board is provided in which at least one conduction layer configured for use as a signal transmission layer is divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, where the connecting region is stepped to a lower height than those of the base regions. The stepped conduction layer in the printed circuit board can be used to resolve the problem of mixed signals in a printed circuit board equipped with various parts and components, including an analog circuit and digital circuit, etc. | 04-02-2009 |
20090084591 | Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor - A cavity capacitor fabrication method and a printed circuit board having an embedded cavity capacitor are disclosed. In accordance with an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor includes two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein the cavity capacitor is placed between the two conductive layers, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped portion than the first dielectric layer, and the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode. | 04-02-2009 |
20090085691 | Printed circuit board with embedded chip capacitor and chip capacitor embedment method - A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board. | 04-02-2009 |
20090086451 | Printed circuit board with embedded cavity capacitor - A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode. | 04-02-2009 |
20090145646 | Electromagnetic bandgap structure and printed circuit board - According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates. | 06-11-2009 |
20090184782 | Electromagnetic bandgap structure and printed circuit board - Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other. | 07-23-2009 |
20090236141 | Electromagnetic bandgap structure and printed circuit board - According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate. | 09-24-2009 |
20090322450 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers. | 12-31-2009 |
20100127790 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure that blocks a noise of a certain frequency band can include 4 or more conductive plates, a first stitching via, which electrically connects any two of the conductive plates with each other by having a part of the first stitching via pass through a planar surface that is different from a planar surface of the conductive plates, a second stitching via, which electrically connects another two of the conductive plates with each other by having a part of the second stitching via pass through a planar surface that is different from a planar surface of the conductive plates, and a stitching via chain, which electrically connects the first stitching via and the second stitching via with each other. | 05-27-2010 |
20100132996 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - In accordance with an embodiment of the present invention, an electromagnetic bandgap structure includes a plurality of conductive plates, and a multi-via connection part, which electrically connects any two of the plurality of conductive plates with each other. Here, the multi-via connection part includes: a first multi-via, including a first via, having one end part connected to one of the two conductive plates, and at least one other via connected in serial to the first via through a conductive trace; a second multi-via, including a second via, having one end part connected to the other of the two conductive plates, and at least one other via connected in serial to the second via through a conductive trace; and a conductive connection pattern, connecting any one of the vias included in the first multi-via and any one of the vias included in the second multi-via with each other. | 06-03-2010 |
20100134200 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from that of the dielectric layer, vias, of which each is connected to each of the conductive plates, respectively, and penetrates through the dielectric layer from one end part that is connected to the conductive plates, and a conductive trace, which connects the other end parts of the vias with each other such that all of the conductive plates are electrically connected. | 06-03-2010 |
20100134212 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface; second conductive plates, placed on a second planar surface; a first conductive trace, electrically connecting any two adjacent first conductive plates with each other on the first planar surface, in which the two adjacent first conductive plates are in a first direction; a second conductive trace, electrically connecting any two adjacent second conductive plates with each other on the second planar surface, in which the two adjacent second conductive plates are in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the first planar surface with each other; and a second stitching via, electrically connecting any two adjacent conductive portions lined up in a direction different from the first direction on the second planar surface with each other. | 06-03-2010 |
20100134213 | ELECTROMAGNETIC BANDGAP STRUCTURE AND CIRCUIT BOARD - An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface. | 06-03-2010 |
20100212951 | Electromagnetic interference noise reduction board using electromagnetic bandgap structure - An EMI noise reduction board using an electromagnetic bandgap structure is disclosed. In the EMI noise reduction board according to an embodiment of the present invention, an electromagnetic bandgap structure having band stop frequency properties can be inserted into an inner portion of the board so as to shield an EMI noise, in which the portion corresponds to an edge of the board and in which the EMI noise is conducted from the inside to the edge of the board and radiates to the outside of the board. | 08-26-2010 |
20110026234 | Printed circuit board and electro application - A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing. | 02-03-2011 |
20110031007 | Electromagnetic interference noise reduction board using electromagnetic bandgap structure - As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates. | 02-10-2011 |
20110061925 | Printed circuit board having electromagnetic bandgap structure - Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element. | 03-17-2011 |
20110067914 | Printed circuit board having electromagnetic bandgap structure - Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged. | 03-24-2011 |
20110067915 | Electromagnetic interference noise reduction board using electromagnetic bandgap structure - An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate. | 03-24-2011 |
20110067916 | Printed circuit board having electromagnetic bandgap structure - Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a planar surface that is different from that of the second conductive plate, a connection pattern arranged on a planar surface that is different from that of the second conductive plate, a first stitching via unit configured to connect the first conductive plate to one end of the connection pattern through the planar surface where the second conductive plate is arranged, and a second stitching via unit configured to connect the third conductive plate to the other end of the connection pattern through the planar surface where the second conductive plate is arranged. | 03-24-2011 |
20110067917 | Printed circuit board having electromagnetic bandgap structure - Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate. | 03-24-2011 |
20110069470 | Electromagnetic interference noise reduction board using electromagnetic bandgap structure - An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes a first area having a ground layer and a power layer, a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes a plurality of first conductive plates placed along the side portion of the first area, a plurality of second conductive plates placed on a planar surface that is different from the first conductive plates so as to overlap with the first conductive plates, and a via configured to connect the first conductive plate and the second conductive plate. | 03-24-2011 |
20110163823 | ELECTROMAGNETIC BANDGAP STRUCTURE AND CIRCUIT BOARD - In an electromagnetic bandgap structure including a plurality of conductive plates and a stitching via part, in which the plurality of conductive plates are placed on a first planar surface, the stitching via part includes a first via having one end part connected to one of the two conductive plates, a second via having one end part connected to the other of the two conductive plates, a spiral connector forming a spirally-shaped serial link structure on at least one vertical planar surface that is perpendicular to the first planar surface, a first conductive pattern connecting one end part of the spiral connector and the other end part of the first via with each other and a second conductive connecting pattern connecting the other end part of the spiral connector and the other end part of the second via with each other. | 07-07-2011 |
20110179642 | Chip capacitor embedment method - A method of embedding a chip capacitor in a printed circuit board including a first conductive layer and a dielectric layer placed on the first conductive layer includes removing the dielectric layer to form a cavity exposing the first conductive layer; seating a chip capacitor in the cavity; filling a filled material at a space excluding a space occupied by the chip capacitor in the cavity; forming a via penetrating the filled material and being connected to the chip capacitor; and stacking a conductive material to constitute a second conductive layer in surfaces of the via and the dielectric layer and in an surface of the filled material filled in the cavity. | 07-28-2011 |
20110180312 | Printed circuit board with embedded chip capacitor - A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor. | 07-28-2011 |
20110197409 | Method of fabricating cavity capacitor embedded in printed circuit board - A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor. | 08-18-2011 |
20110299264 | EMI NOISE SHIELD BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE - The present invention provides an EMI noise shield board in which an EBG structure is inserted. The EMI noise shield board in accordance with an embodiment of the present invention can include: a first board portion, an electronic part being mounted on an upper surface of the first board portion, a circuit for transferring a signal and power to the electronic part being in the first board portion; and
| 12-08-2011 |
20110303452 | Electromagnetic bandgap structure and printed circuit board - An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line. | 12-15-2011 |
20120138338 | PRINTED CIRCUIT BOARD HAVING STEPPED CONDUCTION LAYER - A printed circuit board having stepped conduction layer includes at least one conduction layer configured for use as a signal transmission layer, the at least one conduction layer being divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, and the connecting region being stepped to a lower height than those of the base regions. A lower surface of the connecting region lies on a same plane as a lower surface of the base region, or an upper surface of the connecting region lies on a same plane as an upper surface of the base region. A bridge connecting structure between the connecting regions and the base regions is disposed in possible noise transfer paths between a noise source and a noise attenuation target positioned on the printed circuit board. | 06-07-2012 |
20120162934 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer. | 06-28-2012 |
20120234591 | ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD - An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates. | 09-20-2012 |
20130229779 | PRINTED CIRCUIT BOARD AND ELECTRO APPLICATION - An electronic product includes a case; a first board placed inside the case; and a second board having an Electromagnetic Band Gap (EBG) structure inserted therein. The second board is coupled to an inside of the case facing the first board so as to shield a noise radiated from the first board. | 09-05-2013 |