Han Hyoung
Han Hyoung Kim, Ansan-Si KR
Patent application number | Description | Published |
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20130240946 | METHOD OF BONDING LIGHT EMITTING DIODE (LED) FOR LED MODULE AND LED MANUFACTURED THEREBY - A method for bonding a light emitting diode (LED) for an LED module and a resulting LED structure are provided. The method may include preparing an LED comprising a first semiconductor layer, an active layer, and a second semiconductor layer on a substrate, applying a liquid on a mounting substrate which is oxidizable, and bonding a surface of the LED, on which a substrate is disposed, onto the mounting substrate during oxidation of the mounting substrate by the liquid. The resulting LED structure features substantially reduced thickness in a smaller overall package and one or more oxidized metallic layers exhibiting lower thermal insulation for better LED optical efficiency. | 09-19-2013 |
20160099391 | LIGHT EMITTING DEVICE - A light emitting device includes: a mounting board; an adhesive member disposed on the mounting board and having a first surface adjacent to the mounting board and a second surface opposing the first surface; and a light emitting element disposed on the second surface of the adhesive member. The second surface of the adhesive member may have a first region on which the light emitting element is disposed and a second region on which a scattering pattern is provided to scatter light emitted by the light emitting element. | 04-07-2016 |
Han Hyoung Kim, Gyeonggi-Do KR
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20130087822 | LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - There is provided a light emitting diode (LED) package including: a package main body; an LED chip mounted on the package main body; and a hydrophobic pattern formed on the package main body spaced apart from the LED chip; and a resin unit encapsulating the LED chip and the resin unit is defined by the hydrophobic pattern. The LED package and a fabrication thereof which incur less production costs and have various patterns and enhanced intensity of illumination can be provided. | 04-11-2013 |
Han Hyoung Lee, Seoul KR
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20160108444 | Strain having enhanced L-valine productivity and L-valine production method using the same - The present invention relates to a novel L-valine-producing strain which is transformed so as to strengthen the expression of L-valine operon by having a nucleotide sequence, for coding a leader peptide in a regulatory region of ilvBN operon, entirely deleted, or partially deleted or substituted. In addition, the present invention relates to a method for producing L-valine using the novel L-valine-producing strain. According to the novel valine-producing strain and the L-valine production method of the present invention using the strain, there is an advantageous effect of producing L-valine at high efficiency and high yield. | 04-21-2016 |