Han, Cheonan-Si

Byeong Hoon Han, Cheonan-Si KR

Patent application number	Description	Published
20120028963	NOVEL HYDROXAMATE DERIVATIVE, A PRODUCTION METHOD FOR THE SAME, AND A PHARMACEUTICAL COMPOSITION COMPRISING THE SAME - The present invention relates to hydroxamate derivatives, isomers thereof, pharmaceutically acceptable salts thereof, hydrates thereof, or solvates thereof, the use thereof for preparing pharmaceutical compositions, pharmaceutical compositions containing the same, a method of treating disease using the compositions, and a method for preparing the hydroxamate derivatives.	02-02-2012

Byung-Hoon Han, Cheonan-Si KR

Patent application number	Description	Published
20120315345	FUNCTIONAL FOOD AND PHARMACEUTICAL COMPOSITIONS FOR ANTI-OBESITY COMPRISING CAPSANTHIN AND FATTY-ACYL ESTER OF CAPSANTHIN HAVING ANTI-ADIPOGENIC ACTIVITY - One or more embodiments of the present invention describe a novel use of capsanthin and/or fatty-acyl ester of capsanthin to inhibit both the differentiation of pre-adipocytes to adipocytes and the accumulation of fat in the adipocytes. One or more embodiments of the present invention are based on findings that capsanthin contained in some natural products such as red pepper, paprika, bell pepper, etc. have anti-adipogenic activity by inhibiting both the differentiation of pre-adipocyte into adipocyte and the accumulation of fat in adipocytes, Therefore, this findings provide a functional food and a pharmaceutical composition wherein capsanthins and the extract of any natural products containing the same components are included in the functional food and the pharmaceutical composition, to offer obesity prevention and/or treatment effects.	12-13-2012

Byung-Uk Han, Cheonan-Si KR

Patent application number	Description	Published
20120286295	Organic Light-Emitting Display Device - An organic light-emitting display device comprises a substrate including a plurality of light-emitting regions separated by a non-light-emitting region, an organic light-emitting element disposed on each of the light-emitting regions, and a photoactive element disposed on the non-light-emitting region.	11-15-2012
20140307407	DISPLAY APPARATUS - A display apparatus includes a first substrate having a pixel region and a peripheral region surrounding the pixel region, the first substrate including a pixel disposed in the pixel region, a second substrate opposite to the first substrate, and a sealing member including a plurality of seals disposed on the peripheral region, the sealing member encapsulating the pixel region between first substrate and the second substrate.	10-16-2014

Chang-Hoon Han, Cheonan-Si KR

Patent application number	Description	Published
20100237484	Semiconductor package - Provided is a semiconductor package including a first package and a second package. The first package includes a first substrate having a first front side and a first back side opposing the first front side. The first package further includes a first semiconductor chip on the first front side and an external connection member on the first semiconductor chip. The external connection member may be configured to electrically connect the first semiconductor chip to an external device. The second package includes a second substrate having a second back side facing the first back side of the first substrate and a second front surface opposing the second back side. The second package includes a second semiconductor chip on the second front side. The semiconductor package further includes an internal connection member between the first back side and the second back side to electrically connect the first package to the second package.	09-23-2010
20130049221	SEMICONDUCTOR PACKAGE HAVING PLURAL SEMICONDUCTOR CHIPS AND METHOD OF FORMING THE SAME - A semiconductor package includes a first semiconductor chip mounted to a substrate, a first encapsulant covering the first semiconductor chip and have first to fourth sidewall surfaces, and a chip stack mounted to the substrate and disposed on the first encapsulant. The chip stack includes a plurality of second semiconductor chips. A second encapsulant covers the chip stack. The second encapsulant may cover the first sidewall surface of the first encapsulant and expose the third sidewall surface of the first encapsulant.	02-28-2013
20130294778	Optical Connector and Stack Module Including the Same - An optical connector for directly transferring data is disclosed. The optical connector includes a first input device connected to a first data source and to which a first input signal is applied, a first light emitting device connected to the first input device and generating a first optical signal corresponding to the first input signal, a first light receiving device positioned close to the first light emitting device in such a configuration that the first optical signal directly reaches the first light receiving device from the first light emitting device, the first light receiving device generating a first output signal corresponding to the first optical signal, and a first output device connected to the first light receiving device and to a second data source to which the first output signal is transferred. Large-sized data may be transferred at high speed and high reliability without light transfer units.	11-07-2013

Chang Sung Han, Cheonan-Si KR

Patent application number	Description	Published
20110003769	ANTI-AGING COMPOSITION FOR EXTERNAL USE COMPRISING LOW AND HIGH MOLECULAR WEIGHT HYALURONIC ACIDS AND THE POLYSACCHARIDES EXTRACTED FROM ROOT BARK OF ULMUS DAVIDIANA - Disclosed is an anti-aging composition for external use on skin, which includes low-molecular weight hyaluronic acids, high-molecular weight hyaluronic acids and polysaccharides extracted from root bark of	01-06-2011
20110207830	COMPOSITION FOR TREATING OR PREVENTING AMYLOID-RELATED DISEASES COMPRISING 4-O-METHYLHONOKIOL - Disclosed is a composition for treating or preventing amyloid-related diseases including 4-O-methylhonokiol as an active ingredient. More specifically, a pharmaceutical composition including 4-O-methylhonokiol, which is effective for treating or preventing amyloid-related diseases such as Alzheimer's disease, cognitive disorder, defective memory, amyloidosis, etc. is disclosed. The inventors of the present disclosure have found out for the first time that 4-O-methylhonokiol inhibits the production of β-amyloid. It has been confirmed to be useful in treating or preventing amyloid-related diseases. Through animal tests including water maze test and passive avoidance test on mice, 4-O-methylhonokiol has been confirmed to be effective for amyloid-related diseases such as Alzheimer's disease, defective memory, cognitive disorder, and the like. It was further confirmed through acetylcholinesterase activity inhibition test using mouse brain cortex and hippocampus tissue that they are particularly effective in treating or preventing Alzheimer's disease among the amyloid-related diseases.	08-25-2011

Chul-Woong Han, Cheonan-Si KR

Patent application number	Description	Published
20150147680	HIGHLY FUNCTIONAL COMPOSITE NANOPARTICLES AND METHOD FOR PRODUCING SAME - The present invention relates to highly functional composite nanoparticles including a support body formed of nanoparticles and first phase nanoparticles which are condensed on the surfaces of the support body particles after being evaporated through a physical vapor deposition process, and to a method for producing same. According to the present invention, a physical vapor deposition process is used instead of a wet process so as to produce eco-friendly composite nanoparticles that do not emit hazardous chemicals while having high economic feasibility and process reproducibility.	05-28-2015

Dongchul Han, Cheonan-Si KR

Patent application number	Description	Published
20110171338	APPARATUS AND METHOD FOR MOLDING COMPOUND - Provided are a device and method for molding a compound. The device for molding a compound may include a lower mold, an upper mold, and a cull degating unit. The lower mold may be configured to support a substrate and attach to a compound injector and the upper mold may be configured to cover the lower mold to form a space between the lower mold and the upper mold for receiving a compound from the compound injector. The cull degating unit may be in the upper mold and the cull degating unit may be configured to separate a cull of the compound in an injection passage from the compound molded on the substrate. The compound injector may be configured to inject a compound into the device such that a least a portion of the compound is molded on the substrate.	07-14-2011

Dong-Chul Han, Cheonan-Si KR

Patent application number	Description	Published
20100119350	CLAMPING APPARATUS INCLUDING MOVABLE GRIPPER AND A SEMICONDUCTOR DEVICE FABRICATION PROCESS USING THE SAME - A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.	05-13-2010
20120194214	EQUIPMENT AND METHOD TO CLASSIFY SEMICONDUCTOR PACKAGES - An equipment and method to classify semiconductor packages diced on a substrate into defective and non-defective semiconductor packages includes a loading preparation table to receive a plurality of semiconductor packages to be inspected, a first inspection unit to inspect and classify the semiconductor packages received at the loading preparation table into normal semiconductor packages and defective semiconductor packages, a temporary loading table to temporarily receive at least a portion of the normal semiconductor packages, a first loading picker to transfer the defective semiconductor packages from the loading preparation table to a defective package loading tray and to transfer the normal semiconductor packages from the temporary loading table to the loading preparation table, and a second loading picker to transfer the normal semiconductor packages from the loading preparation table to a normal package loading tray.	08-02-2012
20120205795	STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME - A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.	08-16-2012
20120225150	MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE - A molding apparatus for semiconductor package includes: a lower mold supporting a first semiconductor chip; a middle mold positioned over the lower mold and supporting a second semiconductor chip, and having a first cavity for molding the first semiconductor chip on a lower surface facing the lower mold; an upper mold positioned over the middle mold and having a second cavity for molding the second semiconductor chip on a lower surface facing the middle mold; a first supply port penetrating the lower mold and connected to the first cavity; a second supply port penetrating the lower and middle molds and connected to the second cavity; and a pressure unit positioned under the lower mold and including first and second transfer rams provided respectively in the first and second supply ports to pressure molding compound therein to supply the molding compound into the first and second cavities.	09-06-2012
20140015129	STACKED PACKAGE INCLUDING SPACERS AND METHOD OF MANUFACTURING THE SAME - A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.	01-16-2014

Gi Youl Han, Cheonan-Si KR

Patent application number	Description	Published
20150107750	METHOD AND APPARATUS FOR LAMINATING SCINTILLATOR PANEL AND IMAGING DEVICE PANEL - An apparatus for laminating a scintillator panel and an imaging device panel includes a chamber, a membrane, a first vacuum pump, a second vacuum pump, a heater plate, and a heater power supply. The chamber includes a chamber cover, defining a sealed space. The membrane defines the sealed space in the bottom of the chamber cover by being coupled to the bottom surface of the chamber cover and is made of a contractable and expandable material. The first vacuum pump is coupled to the chamber cover and vents vacuum in the sealed space between the bottom surface of the chamber cover and the membrane. The second vacuum pump vents vacuum in the chamber by being coupled to one side of the chamber. The heater plate is coupled into the chamber to support and heat the panel assembly with an adhesive interposed between the scintillator panel and the imaging device panel.	04-23-2015

Ho Seok Han, Cheonan-Si KR

Patent application number	Description	Published
20140027861	INTEGRATED CIRCUIT AND DISPLAY DEVICE INCLUDING THE SAME - An integrated circuit that includes a substrate, a semiconductor layer arranged on the substrate and an insulating layer arranged on an upper portion of the semiconductor layer and including a bump provided on an upper surface thereof, wherein the semiconductor layer includes a main semiconductor area and an including an internal alignment mark including a p-type semiconductor that is overlapped by a metallic external alignment mark arranged on the upper surface of the insulating layer. The p-type semiconductor internal alignment mark can be viewed by an infrared camera during a mounting process of the integrated circuit.	01-30-2014
20160063948	DISPLAY DRIVER INTEGRATED CIRCUIT, DISPLAY MODULE AND DISPLAY SYSTEM INCLUDING THE SAME - A display driver integrated circuit includes a first slave module and a second slave module. The first slave module is initially set as a primary module to receive a mode conversion command, and is disabled based on the mode conversion command. The second slave module is initially set as a secondary module that does not receive the mode conversion command, and is set as the primary module instead of the first slave module when the first slave module is disabled. The first and second slave modules control processing or transfer of data through a channel included in or coupled to a display according to a predetermined protocol.	03-03-2016

In Young Han, Cheonan-Si KR

Patent application number	Description	Published
20150220191	DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes: a lower substrate; a display layer disposed on the lower substrate and including an electro-optical active layer; a touch electrode layer disposed on the display layer and including first touch electrodes arranged in columns and second touch electrodes arranged in rows intersecting the columns; connections connecting adjacent first electrodes in each of the columns, connections each including islands disposed on the second electrodes, and bridges connecting the first electrodes to the islands; and an insulating layer electrically separating the second touch electrodes and the bridges. The bridges each include a first end that is directly connected to one of the first electrodes and a second end that is indirectly connected to another one of the first electrodes.	08-06-2015

Jae-Lyong Han, Cheonan-Si KR

Patent application number	Description	Published
20120038561	METHOD AND APPARATUS FOR DISPLAYING - A display method, which recognizes touch input information input to respective displays as multi-touch input, includes: displaying an image on a plurality of touch screens; receiving a plurality of pieces of touch input information from the plurality of touch screens; if respective pieces of the plurality of pieces of touch input information are received from different touch screens among the plurality of touch screens, performing a multi-touch operation with respect to the image.	02-16-2012

Jae-Ryong Han, Cheonan-Si KR

Patent application number	Description	Published
20140340337	DISPLAY APPARATUS AND CONTROL METHOD THEREOF - A display apparatus includes a display configured to display a plurality of objects, a sensor configured to detect a touch input on the display, and a controller configured to set a control region based on a plurality of touch inputs detected at different locations of the display and perform a function with respect to at least one object included in the control region according to an additional operation of at least one touch input among the plurality of touch inputs.	11-20-2014
20150077357	DISPLAY APPARATUS AND CONTROL METHOD THEREOF - Disclosed are a display apparatus and a control method thereof, the display apparatus including: a display section which displays an image; a touch detecting section which receives a plurality of touch inputs from a user; an image input section which receives an image; and a controller which performs operations corresponding to the plurality of received touch inputs using information of the touch inputs received through the touch detecting section and eye-gaze information of the user received through the image input section. Thus it is possible to identify a user using an eye-gaze direction of the user for plural touch inputs to perform an operation corresponding to a touch input of the identified user, to thereby provide a display apparatus capable of distinguishing plural touch inputs of plural users.	03-19-2015

Jeongwon Han, Cheonan-Si KR

Patent application number	Description	Published
20140209025	DEPOSITION MASK AND DEPOSITION APPARATUS HAVING THE SAME - A deposition apparatus includes a deposition chamber, a deposition source, and a deposition mask. The deposition source is disposed in the deposition chamber and provides a deposition material to a deposition substrate. The deposition mask includes a body portion and a carbon layer. The carbon layer is disposed on a first surface making contact with the deposition mask and includes at least one of carbon nanotube or graphene.	07-31-2014

Jeong Won Han, Cheonan-Si KR

Patent application number	Description	Published
20150044930	APPARATUS AND METHOD FOR FABRICATING ORGANIC LIGHT EMITTING DISPLAY - An apparatus for fabricating an organic light emitting display includes a chamber, a stage having a hollow portion, a displacement sensor on the stage and configured to measure a distance between the stage and a measurement target that is on or over an upper part of the stage, and a controller. The controller includes an input unit configured to receive distance information obtained by the displacement sensor, a memory unit configured to store reference distance information, a determination unit configured to compare the distance information received by the input unit with the reference distance information, and an output unit configured to output a variable control signal according to whether or not the determination unit determines that the distance information between the stage and the measurement target corresponds to the reference distance information. A method for fabricating an organic light emitting display using the apparatus is also provided.	02-12-2015
20150068023	ALIGNING METHOD OF MASK ASSEMBLY USING DEPOSITION APPARATUS - A method of aligning a mask assembly includes: providing a mask assembly including a mask and a mask frame; and adjusting the mask frame by independently moving at least a position of a lower portion of the mask frame and an upper portion of the mask frame.	03-12-2015

Jong-Won Han, Cheonan-Si KR

Patent application number	Description	Published
20100117670	CONNECTING UNIT TO TEST SEMICONDUCTOR CHIPS AND APPARATUS TO TEST SEMICONDUCTOR CHIPS HAVING THE SAME - A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.	05-13-2010
20140262928	TRAY FOR ALIGNING SEMICONDUCTOR PACKAGES AND TEST HANDLER USING THE SAME, AND METHOD OF ALIGNING SEMICONDUCTOR PACKAGES AND TEST METHOD USING THE SAME - Disclosed are a tray for aligning semiconductor packages, a test handler using the same, and a method of aligning the semiconductor packages, and a test method using the same. According to the present inventive concept, the tray for aligning the semiconductor packages includes a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. The semiconductor package is aligned at the package pocket portion.	09-18-2014
20160061861	TEST SOCKET FOR SEMICONDUCTOR DEVICE AND TEST DEVICE INCLUDING THE SAME - Provided are a test socket for a semiconductor device and a test device including the test socket. The test device includes a test socket including terminals arranged in a two-dimensional array and corresponding to terminals of the semiconductor device and a ground line extending along at least one row of two-dimensional array; and a substrate electrically connected to the test socket so as to transmit and receive a test signal. The test socket includes a ground line extending along at least one row of the two-dimensional array.	03-03-2016
20160109480	TEST SOCKET FOR TESTING SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A test socket is provided that includes a base material including an insulating elastic material and a conductive portion extending through the base material in a thickness direction of the base material, wherein the conductive portion includes a plurality of conductive particle structures arranged in the thickness direction of the base material, and each of the plurality of conductive particle structures includes a plurality of conductive particles having at least one insulating wire and/or at least one conductive wire extending from a surface of the conductive particle, bonded with a material having a functional group.	04-21-2016

Jongwong Han, Cheonan-Si KR

Patent application number	Description	Published
20100164525	TEST SOCKET, TEST APPARATUS WITH TEST SOCKET - A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.	07-01-2010

Jung-Mok Han, Cheonan-Si KR

Patent application number	Description	Published
20140340381	DISPLAY APPARATUS - A display apparatus is disclosed. In one aspect, the apparatus includes a display panel including pixels connected to gate lines and data lines, a gate driver driving the gate lines, a data driver driving the data lines, and a control circuit controlling the gate driver and the data driver to display an image on the display panel. The control circuit applies a common voltage to the display panel. The control circuit compares the common voltage applied to the display panel and a feedback common voltage fedback from the display panel and applies a gate-on voltage having a voltage level corresponding to the compared result to the gate driver.	11-20-2014

Junsoo Han, Cheonan-Si KR

Patent application number	Description	Published
20120087099	Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Package Including The Same, And Method Of Fabricating The Board-On-Chip Package - Provided is a printed circuit board for a board-on-chip package prepared with a strip level of a plurality of unit substrates and including a reject marking portion for determining whether there is a defective unit substrate, wherein the reject marking portion is in each unit substrate.	04-12-2012

Jun-Soo Han, Cheonan-Si KR

Patent application number	Description	Published
20110024919	WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE - A wiring substrate for a semiconductor chip includes a substrate having a first face and a second face opposite to the first face. The substrate has a window from the first face to the second face that exposes chip pads of a semiconductor chip adherable to the first face. A first bonding pad is arranged on the second face along a side portion of the window. The first bonding pad is connected to a bonding wire drawn from the chip pad through the window at a predetermined angle with respect to the side portion. A second bonding pad is adjacent to the first bonding pad on the second face. The second bonding pad includes an end portion having an inclined side portion at an angle corresponding to the drawn angle of the first bonding wire for avoiding an overlap of the second bonding pad with the first bonding wire.	02-03-2011
20110124273	WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP - In a wafer polishing apparatus, the height of the wheel tip can be adjusted. The wafer polishing apparatus includes a wheel tip constructed and arranged to be in direct contact with a wafer; a spindle shaft configured to receive power to enable rotation of the wheel tip; a wheel shank positioned at a lower part of the spindle shaft and supporting the wheel tip, the wheel tip not being directly fixed thereto; and a moving shaft having a first side on which the wheel tip is mounted and an opposite side to which the spindle shaft is connected, and relatively movable with respect to the spindle shaft.	05-26-2011
20120013007	PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BETWEEN TWO PACKAGE SUBSTRATES - A Package-on-Package (POP) semiconductor package has a structure in which a second semiconductor package is stacked on a first semiconductor package. A plurality of spacers are disposed between a first substrate of the first semiconductor package and a second substrate of the second semiconductor package so as to maintain a gap between the first substrate and the second substrate. The plurality of spacers may project from a bottom surface of the second substrate toward the first substrate, or may project from a top surface of the first substrate toward the second substrate. When an upper molding layer is formed on the second substrate so as to cover a second semiconductor chip, the plurality of spacers may be connected to the upper molding layer via through holes that vertically pass through the second substrate. When a first semiconductor chip is adhered to the top surface of the first substrate with an adhering layer, the plurality of spacers may be connected to the adhering layer on the top surface of the first substrate.	01-19-2012

Min-Suk Han, Cheonan-Si KR

Patent application number	Description	Published
20110108415	APPARATUS AND METHOD FOR PLATING A SUBSTRATE - An apparatus for electroplating a substrate includes a substrate supporting member that supports the substrate such that a plating surface of the substrate faces upwardly, an anode electrode disposed at an upper part of the substrate supporting member, a power source for applying a voltage to the anode electrode and the substrate, and a plating solution supply member for supplying a plating solution onto the substrate.	05-12-2011

Moon-Soo Han, Cheonan-Si KR

Patent application number	Description	Published
20090123695	Cover tape and electronic component packaging system using the cover tape - Provided are a cover tape and an electronic component packaging system using the cover tape. According to example embodiments, a cover tape may include a core cover part configured to cover a core upper part of a structure with a serial insertion of a plurality of parts, a periphery junction part on both sides of the core cover part configured to adhere to an upper periphery of the structure, and a cut part between the core cover part and the periphery junction part configured to lie over the upper periphery of the structure.	05-14-2009

Sang-Do Han, Cheonan-Si KR

Patent application number	Description	Published
20110115517	BUILT-OFF TEST DEVICE AND TEST SYSTEM INCLUDING THE SAME - A built-off test (BOT) device includes a signal processing block, an output selection block and a signal control block. The signal processing block duplicates a test signal to apply a plurality of duplicated test signals to each of a plurality of devices under test (DUTs) through each of corresponding channels, and the signal processing block provides a plurality of decision signals based upon a plurality of test result signals received from each of the DUTs. The output selection block merges the decision signals as a final decision signal or sequentially outputs the decision signals as the final decision signal, in response to an output mode selection signal. The signal control block provides the test signal to the signal processing block or provides the final decision signal externally, in response to a first switching control signal.	05-19-2011

Sang-Go Han, Cheonan-Si KR

Patent application number	Description	Published
20140074423	BUILT-OFF TEST DEVICE AND TEST SYSTEM INCLUDING THE SAME - A built-off test (BOT) device includes a signal processing block, an output selection block and a signal control block. The signal processing block duplicates a test signal to apply a plurality of duplicated test signals to each of a plurality of devices under test (DUTs) through each of corresponding channels, and the signal processing block provides a plurality of decision signals based upon a plurality of test result signals received from each of the DUTs. The output selection block merges the decision signals as a final decision signal or sequentially outputs the decision signals as the final decision signal, in response to an output mode selection signal. The signal control block provides the test signal to the signal processing block or provides the final decision signal externally, in response to a first switching control signal.	03-13-2014

Sang-Sun Han, Cheonan-Si KR

Patent application number	Description	Published
20080303978	BACKLIGHT ASSEMBLY, LIQUID CRYSTAL DISPLAY APPARATUS HAVING THE SAME AND METHOD OF MANUFACTURING LAMP-FIXING MEMBER - A backlight assembly includes a receiving container, lamps, a diffusion plate and a lamp-fixing member. The receiving container includes a bottom plate and sidewalls together providing a receiving space. The lamps are arranged substantially parallel to each other on the bottom plate. The diffusion plate is disposed over the lamps. The lamp-fixing member includes a body portion extending substantially perpendicular to the lamps, a buffer protruding upwardly from the body portion, a diffusion plate supporting portion protruding from the buffer to support the diffusion plate and a lamp-fixing portion formed at the body portion to fix the lamps. Therefore, the buffer having elasticity is formed at an area at which the diffusion plate supporting portion is formed, so that rubbing between the diffusion plate and the diffusion plate supporting portion may be reduced.	12-11-2008
20090027584	LIQUID CRYSTAL DISPLAY WITH A BACKLIGHT ASSEMBLY HAVING AN IMPROVED STRUCTURE - A liquid crystal display with improved backlight structure is presented. The liquid crystal display includes a liquid crystal (LC) panel for displaying image, a backlight assembly for providing light to the LC panel and a top frame combined with the bottom frame to complete LCD assembling. The backlight assembly includes a bottom frame, light source, and optical member. The bottom frame includes a light source receiving part, a side wall and a optical member receiving part which extends inwardly to the inner side of the backlight assembly. Thus, the overall size of the LCD can be reduced.	01-29-2009
20100073596	BACKLIGHT ASSEMBLY HAVING AN ELASTIC SUPPORTING MEMBER FOR SUPPORTING OPTICAL MEMBER AND A DISPLAY APPARATUS HAVING THE SAME - A backlight assembly which includes a light source generating light supplied to the liquid crystal panel, optical members controlling characteristics of the light provided from the light source, a receiving container including a receiving area receiving the light source and the optical members, a rear surface defining a plane, and a first recess protruding toward the receiving area from an exterior of the receiving container and an elastic supporting member assembled to the first recess of the receiving container, and supporting the optical members. The first recess has a depth from the plane of the rear surface, such that the supporting member does not protrude past the plane of the rear surface of the receiving container.	03-25-2010
20110187961	DISPLAY APPARATUS - A display apparatus includes a display module and a front case. The display module displays images. The display module includes a boss fixing member having a combination hole. The front case covers a first surface of the display module and has a first boss that is inserted into the combination hole to combine the front case to the display module. The first boss is formed at inside edges of the display module. The boss fixing member is positioned within the edges of the display module which define the outdimension of the display module.	08-04-2011

Sang-Woo Han, Cheonan-Si KR

Patent application number	Description	Published
20150103263	DISPLAY DEVICE - In an aspect, a display device including: an entire window, said entire window including a display area and a non-display area outside the display area; a display panel; a first adhesive layer disposed on the display panel; a touch screen panel disposed on the first adhesive layer; a first light blocking member disposed on the touch screen panel; a second adhesive layer disposed on the touch screen panel and the first light blocking member; and a protection window disposed on the second adhesive layer is provided.	04-16-2015
20150346388	OPTICAL MULTILAYERED UNIT AND DISPLAY DEVICE INCLUDING THE SAME - An optical multilayered unit including a base material; a first refractive layer on at least one surface of the base material, the first refractive layer including a fluorine-containing compound; and a second refractive layer on one surface of the first refractive layer, the second refractive layer having a refractive index that is 0.01 to 0.3 higher than a refractive index of the first refractive layer.	12-03-2015

Sang-Youn Han, Cheonan-Si KR

Patent application number	Description	Published
20090167703	DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - A display panel and a method for manufacturing the same are disclosed. The display panel includes: a first substrate, a touch spacer formed on a first substrate, a common electrode formed on the touch spacer, a second substrate opposing the first substrate, a sensing electrode facing the touch spacer on the second substrate and an alignment layer on the sensing electrode or the touch spacer, wherein the alignment layer has a thickness equal to or less than 500 Å.	07-02-2009
20090237365	DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - A display panel and a method for manufacturing the same are disclosed. The display panel includes: a first substrate, a touch spacer formed on a first substrate, a second substrate opposing the first substrate, a sensing electrode facing the touch spacer in the second substrate wherein the sensing electrode has a concave surface.	09-24-2009
20090309101	THIN FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - A thin film transistor array substrate and its manufacturing method are disclosed. A thin film transistor (TFT) includes a gate electrode formed on a substrate, and source and drain electrodes formed on the gate electrode and separated from each other. A common line made of the same material as the gate electrode is formed on the substrate. A storage capacitor includes a storage electrode connected with a storage electrode line and a pixel electrode formed on the storage electrode. The storage electrode and the pixel electrode are formed by patterning a transparent conductive film, and accordingly, light can be transmitted through the region where the storage capacitor is formed to thus increase an aperture ratio.	12-17-2009
20100149128	LIQUID CRYSTAL DISPLAY PANEL HAVING INTEGRATED PRESSURE SENDING UNITS - Capacitively actuated touch sensor units are integrated between subpixel light emitters of a liquid crystal display panel. In one embodiment, a sensor unit is monolithically integrated on a same substrate as are a plurality of associated subpixel units and the sensor unit includes a variable capacitor and a reference capacitor connected to define a voltage splitting circuit having a split voltage generating node. The sensor unit also includes a sensing transistor operatively coupled to the split voltage generating node and a voltage resetting transistor operatively coupled to the split voltage generating node. In one embodiment, one plate of the variable capacitor is defined by a touchwise flexed portion of a common electrode of the display and an opposed plate is defined by a spaced apart facing electrode provided on a TFT array substrate of the liquid crystal display.	06-17-2010
20110012115	DISPLAY DEVICE WITH IMPROVED SENSING MECHANISM - A display panel that includes: a substrate, a sensing transistor disposed on the substrate, and a readout transistor connected to the sensing transistor and transmitting a detecting signal is presented. The sensing transistor includes a semiconductor layer disposed on the upper substrate, a source electrode and a drain electrode disposed on the semiconductor layer, and a gate electrode overlapping the semiconductor layer on the source electrode and the drain electrode. Accordingly, in a display device and a manufacturing method thereof, an infrared sensing transistor, a visible light sensing transistor, and a readout transistor are simultaneously formed with a top gate structure such that the number of manufacturing processes and the manufacturing cost may be reduced.	01-20-2011
20120200815	DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - A display panel and a method for manufacturing the same are disclosed. The display panel includes: a first substrate, a touch spacer formed on a first substrate, a common electrode formed on the touch spacer, a second substrate opposing the first substrate, a sensing electrode facing the touch spacer on the second substrate and an alignment layer on the sensing electrode or the touch spacer, wherein the alignment layer has a thickness equal to or less than 500Å.	08-09-2012

Seongchan Han, Cheonan-Si KR

Patent application number	Description	Published
20100225439	ARRAY RESISTOR AND METHOD OF FABRICATING THE SAME - An array resistor may include a body, a first resistor, and a second resistor. The body may have a front surface, a rear surface opposite to the front surface, and side surfaces connecting the front surface and the rear surface. The first resistor may be disposed on the front surface, the first side surface, and the second side surface opposite to the first side surface. The second resistor may be disposed on the rear surface, the third side surface, and the fourth side surface opposite to the third side surface.	09-09-2010
20120058650	SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - Example embodiments relate to semiconductor modules and semiconductor devices including the same. The semiconductor module may include a board, a plurality of semiconductor chips, a plurality of first taps, and a plurality of second taps. The board may include a chip region, a first tap region, and a second tap region. The first tap region of the board may have a first width that extends in a thickness direction of the board. The second tap region may have a second width that is less than the first width. The second tap region may be disposed under the first tap region. The semiconductor chips may be mounted in the chip region of the board. The first taps may be disposed in the first tap region, and the second taps may be disposed in the second tap region. The first and second taps may be configured to transmit/receive an electric signal to/from the plurality of semiconductor chips.	03-08-2012

Seungchan Han, Cheonan-Si KR

Patent application number	Description	Published
20130200524	PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME - A method of forming a semiconductor package may include providing a first package including a first semiconductor chip mounted on a first package substrate having a via-hole and molded by a first mold layer, providing a second package including a second semiconductor chip mounted on a second package substrate having a connection pad and molded by a second mold layer, stacking the first package on the second package to vertically align the via-hole with the connection pad, forming a through-hole penetrating the first and second packages and exposing the connection pad, and forming an electrical connection part in the through-hole. The electrical connection part may electrically connect the first package and the second package to each other.	08-08-2013

Seung Ho Han, Cheonan-Si KR

Patent application number	Description	Published
20150125133	METHOD FOR TRANSCODING MULTIMEDIA, AND HADOOP-BASED MULTIMEDIA TRANSCODING SYSTEM FOR PERFORMING THE METHOD - A multimedia transcoding method and a system for performing the multimedia transcoding are provided. A hadoop-based multimedia transcoding system may include a video and image data collection domain (VIDCD) to collect original encoded media data sets, and to store the collected original encoded media data sets, a hadoop distributed file system (HDFS)-based splitting and merging domain (HbSMD) to split the original encoded media data sets into first blocks, and to automatically distribute the first blocks to a plurality of data nodes of an HDFS, by using the HDFS, and a MapReduce-based transcoding domain (MbTD) to transcode second blocks distributed to the plurality of data nodes, through distributed and parallel processing, using a MapReduce framework.	05-07-2015
20150154288	METHOD AND SYSTEM FOR PROCESSING LOG DATA - Provided is a method of processing log data and a system for operating the method, in which the log data processing system may include a first storage module, a second storage module, a log collection module configured to collect log data generated by a task process associated with a customer, classify the log data into first log data and second log data based on a type of the log data, and transmit the first log data to the first storage module and the second log data to the second storage module, and a log graph generation module configured to generate a log data graph of at least one of data stored in the first storage module and data stored in the second storage module.	06-04-2015

Seung Shin Han, Cheonan-Si KR

Patent application number	Description	Published
20160124414	PLC SYSTEM - A programmable logic controller (PLC) system is provided. The programmable logic controller (PLC) system includes a storage unit storing a user program; a main control unit performing a scan operation based on the user program, measuring a scan time required for the scan time, and determining whether there is a need to process a web based service; and a web based service control unit processing the service data based on the scan time service request details, and service data that are transmitted from the main control unit, according to a result of the determination on whether there is a need to process the web based service.	05-05-2016

Won-Chull Han, Cheonan-Si KR

Patent application number	Description	Published
20150130424	BATTERY PACK AND PROTECTION METHOD USING THE SAME - A method for protecting batteries with consideration for the influence of a load coupled to a battery pack is provided. The battery pack includes a terminal to be coupled to a capacitor of the load, and a battery management system for controlling a protection operation according to a voltage of the terminal, counting a number of protection operation executions after the load is coupled to the battery pack, and differently controlling a deactivation time of the protection operations depending on whether or not the number of executions is greater than or equal to a reference count.	05-14-2015

Young-Hong Han, Cheonan-Si KR

Patent application number	Description	Published
20130161891	DIE ATTACH APPARATUS - A die attach apparatus includes a stage, a collet member that is movable to apply load to the stage, a load measuring member that is arranged between the collet member and the stage and that measures load between the collet member and the stage, the load measuring member is divided into a plurality of loading measuring regions and the plurality of load measuring regions measure loads within the plurality of load measuring regions, respectively, and a controller member that determines whether the collet member is in a tilted state or a non-tilted state based on the loads measured within the plurality of load measuring regions by the load measuring member.	06-27-2013