Patent application number | Description | Published |
20080261818 | Methods of Identifying Pancreatic Cancer Cells - Methods that identify cells as pancreatic cancer cells based on assessing the expression of combinations of target molecules expressed preferentially on pancreatic cancer cells are disclosed. Combinations were initially discovered by microarray analysis and selected based upon tumor specificity, relative lack of cross-reactivity with normal tissues, and applicability as targets of multispecific ligands. The claimed methods encompass measuring the expression of three or more specific target molecules in combination and correlating positive expression of the combination with an identification of the cell as a pancreatic cancer cell. | 10-23-2008 |
20090099165 | Protein Kinase Inhibitors - Protein kinase inhibitors are disclosed having utility in the treatment of protein kinase-mediated diseases and conditions, such as cancer. The compounds of this invention have the following structure: | 04-16-2009 |
20090137420 | METHODS, COMPOUNDS AND COMPOSITIONS WITH GENOTYPE SELECTIVE ANTICANCER ACTIVITY - This invention is directed to methods for screening and identification of compounds capable of selectively eliminating cancer cells with specific loss-of-function alterations, including but not limited to mutations, deletions, hypermethylations, and other types of gene silencing. This invention is also directed to novel compounds that selectively eliminate cancer cells with specific loss-of-function alterations. Furthermore, this invention is directed to methods for production and therapeutic use of compounds that selectively eliminate cancer cells with specific loss-of-function alterations. | 05-28-2009 |
20090143399 | Protein Kinase Inhibitors - Protein kinase inhibitors are disclosed having utility in the treatment of protein kinase-mediated diseases and conditions, such as cancer. The compounds of this invention have the following structure: | 06-04-2009 |
20110212929 | Protein Kinase Inhibitors - Protein kinase inhibitors are disclosed having utility in the treatment of protein kinase-mediated diseases and conditions, such as cancer. The compounds of this invention have the following structure: | 09-01-2011 |
20130273063 | METHODS AND KITS TO PREDICT THERAPEUTIC OUTCOME OF BTK INHIBITORS - Methods of tests that assess the expression of DPC4 (SMAD4) to identify subjects with pancreatic cancer that are likely or unlikely to respond to treatment with BTK inhibitors; methods of treating subjects based on identification of said subjects as likely to respond to treatment with BTK inhibitors; therapeutic targets for cancers, particularly cancers with inactivated DPC4 gene or protein; methods of screening of new therapeutic agents using the target; pharmaceutical composition comprising BTK inhibitors, such as PCI-32765 or derivatives thereof, for cancer treatment; and kits that facilitate the performance of the methods are disclosed. | 10-17-2013 |
Patent application number | Description | Published |
20090098343 | EPITAXIAL METHODS AND TEMPLATES GROWN BY THE METHODS - This invention provides methods for fabricating substantially continuous layers of a group III nitride semiconductor material having low defect densities and optionally having a selected crystal polarity. The methods include epitaxial growth nucleating and/or seeding on the upper portions of a plurality of pillars/islands of a group III nitride material that are irregularly arranged on a template structure. The upper portions of the islands have low defect densities and optionally have a selected crystal polarity. The invention also includes template structures having a substantially continuous layer of a masking material through which emerge upper portions of the pillars/islands. The invention also includes such template structures. The invention can be applied to a wide range of semiconductor materials, both elemental semiconductors, e.g., combinations of Si (silicon) with strained Si (sSi) and/or Ge (germanium), and compound semiconductors, e.g., group II-VI and group III-V compound semiconductor materials. | 04-16-2009 |
20100133548 | METHODS FOR IMPROVING THE QUALITY OF EPITAXIALLY-GROWN SEMICONDUCTOR MATERIALS - The invention provides methods which can be applied during the epitaxial growth of two or more layers of semiconductor materials so that the qualities of successive layer are successively improved. In preferred embodiments, surface defects present in one epitaxial layer are capped with a masking material. A following layer is then grown so it extends laterally above the caps according to the known phenomena of epitaxial lateral overgrowth. The methods of the invention can be repeated by capping surface defects in the following layer and then epitaxially growing a second following layer according to ELO. The invention also includes semiconductor structures fabricated by these methods. | 06-03-2010 |
20110212603 | METHODS FOR IMPROVING THE QUALITY OF STRUCTURES COMPRISING SEMICONDUCTOR MATERIALS - Methods which can be applied during the epitaxial growth of semiconductor structures and layers of III-nitride materials so that the qualities of successive layers are successively improved. An intermediate epitaxial layer is grown on an initial surface so that growth pits form at surface dislocations present in the initial surface. A following layer is then grown on the intermediate layer according to the known phenomena of epitaxial lateral overgrowth so it extends laterally and encloses at least the agglomerations of intersecting growth pits. Preferably, prior to growing the following layer, a discontinuous film of a dielectric material is deposited so that the dielectric material deposits discontinuously so as to reduce the number of dislocations in the laterally growing material. The methods of the invention can be performed multiple times to the same structure. Also, semiconductor structures fabricated by these methods. | 09-01-2011 |
20140217553 | TEMPLATE LAYERS FOR HETEROEPITAXIAL DEPOSITION OF III NITRIDE SEMICONDUCTOR MATERIALS USING HVPE PROCESSES - Methods of depositing III-nitride semiconductor materials on substrates include depositing a layer of III-nitride semiconductor material on a surface of a substrate in a nucleation HVPE process stage to form a nucleation layer having a microstructure comprising at least some amorphous III-nitride semiconductor material. The nucleation layer may be annealed to form crystalline islands of epitaxial nucleation material on the surface of the substrate. The islands of epitaxial nucleation material may be grown and coalesced in a coalescence HVPE process stage to form a nucleation template layer of the epitaxial nucleation material. The nucleation template layer may at least substantially cover the surface of the substrate. Additional III-nitride semiconductor material may be deposited over the nucleation template layer of the epitaxial nucleation material in an additional HVPE process stage. Final and intermediate structures comprising III-nitride semiconductor material are formed by such methods. | 08-07-2014 |
Patent application number | Description | Published |
20090248928 | Integrating non-peripheral component interconnect (PCI) resources into a personal computer system - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 10-01-2009 |
20090249098 | Power management for a system on a chip (SoC) - In one embodiment, the present invention includes a method for sending a first link handshake signal between a first subsystem and a power management unit (PMU) of a system on a chip (SoC) to request entry into a power saving state for the first subsystem, sending a second link handshake signal between the first subsystem and the PMU to acknowledge the request, and placing the first subsystem into the power saving state without further signaling between the PMU and the first subsystem. Other embodiments are described and claimed. | 10-01-2009 |
20090300245 | Providing a peripheral component interconnect (PCI)-compatible transaction level protocol for a system on a chip (SoC) - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn via one or more physical units to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 12-03-2009 |
20100287325 | INTEGRATING NON-PERIPHERAL COMPONENT INTERCONNECT (PCI) RESOURCES INTO A PERSONAL COMPUTER SYSTEM - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 11-11-2010 |
20110078356 | Providing A Peripheral Component Interconnect (PCI)-Compatible Transaction Level Protocol For A System On A Chip (SoC) - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn via one or more physical units to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 03-31-2011 |
20110271021 | Integrating Non-Peripheral Component Interconnect (PCI) Resources Into A Personal Computer System - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 11-03-2011 |
20110320673 | Providing A Peripheral Component Interconnect (PCI)-Compatible Transaction Level Protocol For A System On A Chip (SoC) - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn via one or more physical units to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 12-29-2011 |
20120233366 | Integrating Non-Peripheral Component Interconnect (PCI) Resources Into A Personal Computer System - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 09-13-2012 |
20120239839 | Providing A Peripheral Component Interconnect (PCI)-Compatible Transaction Level Protocol For A System On A Chip (SoC) - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn via one or more physical units to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 09-20-2012 |
20130061077 | Power Management For A System On A Chip (SoC) - In one embodiment, the present invention includes a method for sending a first link handshake signal between a first subsystem and a power management unit (PMU) of a system on a chip (SoC) to request entry into a power saving state for the first subsystem, sending a second link handshake signal between the first subsystem and the PMU to acknowledge the request, and placing the first subsystem into the power saving state without further signaling between the PMU and the first subsystem. Other embodiments are described and claimed. | 03-07-2013 |
20130290756 | Power Management For A System On A Chip (SoC) - In one embodiment, the present invention includes a method for sending a first link handshake signal between a first subsystem and a power management unit (PMU) of a system on a chip (SoC) to request entry into a power saving state for the first subsystem, sending a second link handshake signal between the first subsystem and the PMU to acknowledge the request, and placing the first subsystem into the power saving state without further signaling between the PMU and the first subsystem. Other embodiments are described and claimed. | 10-31-2013 |
20130297843 | Integrating Non-Peripheral Component Interconnect (PCI) Resources Into A Computer System - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 11-07-2013 |
20130297846 | Providing A Peripheral Component Interconnect (PCI)-Compatible Transaction Level Protocol For A System On A Chip (SoC) - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn via one or more physical units to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 11-07-2013 |
20140237154 | Integrating Non-Peripheral Component Interconnect (PCI) Resources Into A Computer System - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 08-21-2014 |
20140237155 | Providing A Peripheral Component Interconnect (PCI)-Compatible Transaction Level Protocol For A System On A Chip (SoC) - In one embodiment, the present invention includes an apparatus having an adapter to communicate according to a personal computer (PC) protocol and a second protocol. A first interface coupled to the adapter is to perform address translation and ordering of transactions received from upstream of the adapter. The first interface is coupled in turn via one or more physical units to heterogeneous resources, each of which includes an intellectual property (IP) core and a shim, where the shim is to implement a header of the PC protocol for the IP core to enable its incorporation into the apparatus without modification. Other embodiments are described and claimed. | 08-21-2014 |
20140365796 | Power Management For A System On A Chip (SoC) - In one embodiment, the present invention includes a method for sending a first link handshake signal between a first subsystem and a power management unit (PMU) of a system on a chip (SoC) to request entry into a power saving state for the first subsystem, sending a second link handshake signal between the first subsystem and the PMU to acknowledge the request, and placing the first subsystem into the power saving state without further signaling between the PMU and the first subsystem. Other embodiments are described and claimed. | 12-11-2014 |