Patent application number | Description | Published |
20140151101 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN - There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer. | 06-05-2014 |
20150021079 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN - There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm may be satisfied. | 01-22-2015 |
20150021080 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second external electrodes formed on both end portions of the ceramic body, wherein a first internal electrode positioned at an outermost position among the first electrodes is connected to the first external electrode by at least one first via extended to at least one of first and second main surfaces of the ceramic body, and a second internal electrode positioned at an outermost position among the second internal electrodes is connected to the second external electrode by at least one second via extended to at least one of first and second main surfaces of the ceramic body. | 01-22-2015 |
20150041196 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second internal electrodes, and first and second external electrodes, wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer, and a first terminal electrode, the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer, and a second terminal electrode, the first and second base electrodes include a first conductive metal and glass, and the first and second terminal electrodes are formed of a second conductive metal. | 02-12-2015 |
20150041197 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers; first internal electrodes and second internal electrodes having first and second leads; first dummy electrodes and second dummy electrodes; and first and second external electrodes, wherein when a length from ends of the first and second external electrodes formed on first and second lateral surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is G, a length of the first and second external electrodes formed on the first and second lateral surfaces of the ceramic body up to end surfaces of the ceramic body is BW, and a length from the end surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is M, 30 μm≦G02-12-2015 | |
20150041198 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via. | 02-12-2015 |
20150053471 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - A multilayer ceramic electronic part to be embedded in a board includes a ceramic body including dielectric layers and having main surfaces, side surfaces, and end surfaces; first and second internal electrodes including first and second leads exposed to the main surfaces; and first and second external electrodes formed on the end surfaces and extending to the main surfaces, wherein when a length from one of ends of the first or second external electrode formed on the main surfaces to a point at which the first or second external electrode contacts the first and second leads is G, a length from one of the ends of the first or second external electrode to the end surfaces is BW, and a length from the end surfaces to a point at which the first or second external electrode contacts the first and second leads is M, 30 μm≦G02-26-2015 | |
20150053472 | EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0. | 02-26-2015 |
20150060121 | MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN - There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers; first and second internal electrodes having first and second leads; and first and second external electrodes, wherein when lengths from edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to points at which the first or second external electrode contacts the first and second leads are G1, lengths from the edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to a corresponding end surface of the ceramic body are BW1, and lengths from the corresponding end surface of the ceramic body to points at which the first or second external electrode contacts the first and second leads are M1, 30 μm≦G103-05-2015 | |
20150075853 | MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING THE SAME - There is provided a multilayer ceramic electronic component embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes, having the dielectric layer therebetween, to thereby form capacitance; upper and lower cover layers formed in upper and lower portions of the active layer; and first and second external electrodes formed in both ends of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, and in the case that a thickness of the upper cover layer is tc1 and a thickness of the lower cover layer is tc2, 0.10≦tc1/tc2≦1.00 is satisfied. | 03-19-2015 |