Patent application number | Description | Published |
20110115717 | TOUCH SENSITIVE DEVICE USING THRESHOLD VOLTAGE SIGNAL - A touch sensitive apparatus having a plurality of drive electrodes and a plurality of receive electrodes, the drive electrodes and receive electrodes capacitively coupled to each other. A touch measurement circuit configured to identify touch events on the touch sensitive device by comparing a first time period to a second time period. The first time period can be, for example, representative of a length of time a periodic receive signal carried by a receive electrode is above or below a threshold voltage level. | 05-19-2011 |
20120062497 | TOUCH SENSITIVE DEVICE WITH STYLUS SUPPORT - A touch-sensitive device with stylus includes a touch panel, a stylus drive unit, a stylus sense unit, a touch panel drive unit, and a measurement unit. A touch by a stylus proximate to a touch panel electrode changes a capacitive coupling between the touch panel electrode and a stylus electrode. The amplitude of the response signal is responsive to the capacitive coupling between the touch panel electrode and the stylus electrode, and is measured to provide an indication of the position of the stylus electrode relative to the touch panel. | 03-15-2012 |
20120062498 | TOUCH SENSITIVE DEVICE WITH STYLUS SUPPORT - A touch-sensitive device with stylus includes a touch panel, a stylus drive unit, a touch panel sense unit, and a measurement unit. A touch by a stylus proximate to a touch panel electrode changes a capacitive coupling between the touch panel electrode and a stylus electrode. The amplitude of the response signal is responsive to the capacitive coupling between the touch panel electrode and the stylus electrode, and is measured to provide an indication of the position of the stylus electrode relative to the touch panel. | 03-15-2012 |
20120062499 | TOUCH SENSITIVE DEVICE WITH STYLUS SUPPORT - A touch-sensitive device with stylus includes a touch panel, a touch panel drive unit, a stylus sense unit, and a measurement unit. A touch by a stylus proximate to a touch panel electrode changes a capacitive coupling between the touch panel electrode and a stylus electrode. The amplitude of the response signal is responsive to the capacitive coupling between the touch panel electrode and the stylus electrode, and is measured to provide an indication of the position of the stylus electrode relative to the touch panel. | 03-15-2012 |
20120125882 | METHOD OF MAKING TOUCH-SENSITIVE DEVICE WITH ELECTRODES HAVING LOCATION PATTERN INCLUDED THEREIN - A method of patterning a conductor on a substrate, the conductor including a unique location indicia that may be sensed with a sensing device, and the location on the substrate determined therefrom. | 05-24-2012 |
20120127114 | TOUCH-SENSITIVE DEVICE WITH ELECTRODES HAVING LOCATION PATTERN INCLUDED THEREIN - A conductive element in a touch sensitive device, such as an electrode in a mutual capacitive touch sensor, that includes conductors arranged in a location pattern that may be sensed and analyzed, and a position on the touch sensor determined therefrom. | 05-24-2012 |
20130207911 | MESH PATTERNS FOR TOUCH SENSOR ELECTRODES - An electrode for a touch sensitive device includes micro-wire conductors arranged to define an electrically continuous area and to include interior regions that are electrically discontinuous. The electrically continuous area may be patterned according to a one pattern, and the interior pattern may be patterned according to another pattern. | 08-15-2013 |
20140152580 | MESH PATTERNS FOR TOUCH SENSOR ELECTRODES - An electrode for a touch sensitive device includes micro-wire conductors arranged to define an electrically continuous electrode trunk area, and including branching elements which extend outward from the electrode trunk area. The electrically continuous trunk area is patterned coincident an underlying reference mesh pattern, as are the branching elements. | 06-05-2014 |
20140347076 | TOUCH SENSOR ELECTRODE WITH PATTERNED ELECTRICALLY ISOLATED REGIONS - An electrode layer has a plurality of substantially parallel electrodes disposed along a first direction. At least one electrode has a length along the first direction and a width from a first edge to a second edge along a second direction transverse to the first direction. At least one electrode comprises across its width at least one edge section, at least one intermediate section, and at least one central section, wherein an intermediate section is disposed along the electrode width between an edge section and the central section. At least one electrode edge section and intermediate section includes a plurality of electrically isolated regions arranged in a pattern along the electrode length. An electrode conductive area of the edge section is less than an electrode conductive area of the intermediate section. | 11-27-2014 |
Patent application number | Description | Published |
20080254214 | ADHESIVE MATERIALS, ADHESIVE PARTS FORMED THEREWITH AND THEIR USES - Adhesive material and adhesive parts are formed according to the present invention along with used therefore. The adhesive parts typically include a handling layer. | 10-16-2008 |
20080308212 | TOUGHENED ADHESIVE MATERIAL - An adhesive material and articles incorporating the same is disclosed. The adhesive material includes at least three of epoxy resin; impact modifier; flexibilizer, blowing agent; curing agent; and filler. The adhesive material is preferably used for structural adhesion but may be used for sealing, baffling or reinforcing an article of manufacture such as an automotive vehicle. | 12-18-2008 |
20120009427 | SOLVENT CAST FLAME RETARDANT POLYCARBONATE COATINGS, FILMS AND LAMINATES - Solvent cast polycarbonate-based films for use in laminates with flame retardance, low heat release and low smoke production, and methods of manufacture. Polycarbonate resin or polymer blends of polycarbonate resin and one or more polymer resins are solvent cast and incorporated into decorative, fire retardant and protective laminates. | 01-12-2012 |
20120111488 | HANDLING LAYER AND ADHESIVE PARTS FORMED THEREWITH - A handling layer and adhesive parts having the handling layer are formed according to the present invention along with used therefore. | 05-10-2012 |
Patent application number | Description | Published |
20120075812 | MULTI-CHIP PACKAGE - In various embodiments, a chip module may include a substrate; electronic components, the electronic components being arranged on a first side of the substrate; and an insulating layer, which is applied to the first side of the substrate and to the electronic components, contact openings being arranged in the insulating layer which permit electrical contacting of the electronic components; and an electrically conducting layer being arranged on the insulating layer and in the contact openings, which connects the electronic components electrically to one another. | 03-29-2012 |
20140197552 | CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT - A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material. | 07-17-2014 |
20140327127 | Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip - According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid. | 11-06-2014 |
20140353818 | Power module comprising two substrates and method of manufacturing the same - A method of manufacturing a power module comprising two substrates is provided, wherein the method comprises disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer | 12-04-2014 |
20150085446 | SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME - In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer. | 03-26-2015 |