Gwo-Chyuan
Gwo-Chyuan Chen, Taipei City TW
Patent application number | Description | Published |
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20100123663 | Wireless keyboard base and portable electronic device - A wireless keyboard base includes a base, a wireless keyboard and a plurality of magnets. The base has a groove to accommodate an edge of an electronic device. The wireless keyboard is disposed on the base and has a wireless communication module to exchange information data with the electronic device. The plurality of magnets are disposed within the groove to magnetically attract the edge of the electronic device. | 05-20-2010 |
20100182745 | Thin notebook computer - A thin notebook computer is disclosed, which includes a first casing, a LCD panel disposed in the first casing, a second casing, a hinge for connecting the first casing and the second casing, a battery, and a keyboard. The battery and the keyboard are disposed in the second casing. The battery is disposed on one side of the keyboard and is not arranged under the keyboard. | 07-22-2010 |
20120229962 | PORTABLE ELECTRICAL DEVICE - A portable electrical device includes an upper unit, a lower unit and a connection unit having a first end and a second end opposite with each other. The upper unit is pivoted on the first end of the connection unit with a first pivotal portion having a first elastic member. The lower unit is pivoted on the second end of the connection unit with a second pivotal portion having a second elastic member. Therefore, by releasing the first elastic member and the second elastic member, the connection unit is rotated to leave the lower unit, and the upper unit is rotated to contact with the lower unit. | 09-13-2012 |
20140185218 | TABLET COMPUTER - A tablet computer includes a housing, a cover, and a keyboard. The housing has an opening and an accommodating trough inwardly recessed from the opening. The accommodating trough has a groove having an inlet section and an engaging section. The inlet section is communicated between the opening and the engaging section. Widths of the inlet section are larger than widths of the engaging section. The cover is pivotally connected to the housing. The cover covers the opening when rotated to a covering position, and supports the housing in a standing position when rotated to an extended position. The keyboard is detachably accommodated in the accommodating trough and includes at least one engaging structure. The engaging structure is located at the peripheral edge of the keyboard and engaged with the engaging section. | 07-03-2014 |
Gwo-Chyuan Kuo, Hsinchu City TW
Patent application number | Description | Published |
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20150279769 | CHIP PACKAGE, USE AND METHOD OF MAKING THEREO - A method of forming a chip package portion having a reduced loading effect between various metal lines during a leveling process comprises forming a first layer, a passivation layer over the first layer, a second layer over the passivation layer, and a third layer over the second layer. The method also comprises forming a patterned opening having multiple depths by removing portions of the first layer, the passivation layer, the second layer, and the third layer by way of one or more removal processes that remove portions of the first layer, the passivation layer, the second layer, and the third layer in accordance with one or more patterned photoresist depositions. The method further comprises depositing a material into the patterned opening, and leveling the material deposited into the patterned opening | 10-01-2015 |
Gwo-Chyuan Kuoh, Hsinchu City TW
Patent application number | Description | Published |
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20140374832 | BEOL SELECTIVITY STRESS FILM - The present disclosure relates to an integrated chip having one or more back-end-of-the-line (BEOL) selectivity stress films that apply a stress that improves the performance of semiconductor devices underlying the BEOL selectivity stress films, and an associated method of formation. In some embodiments, the integrated chip has a semiconductor substrate with one or more semiconductor devices having a first device type. A stress transfer element is located within a back-end-of-the-line stack at a position over the one or more semiconductor devices. A selectivity stress film is located over the stress transfer element. The selectivity stress film induces a stress upon the stress transfer element, wherein the stress has a compressive or tensile state depending on the first device type of the one or more semiconductor devices. The stress acts upon the one or more semiconductor devices to improve their performance. | 12-25-2014 |
20150255394 | SEMICONDUCTOR DEVICE WITH SELF-PROTECTING FUSE AND METHOD OF FABRICATING THE SAME - A semiconductor device with the metal fuse and a fabricating method thereof are provided. The metal fuse connects an electronic component (e.g., a transistor) and a existing dummy feature which is grounded. The protection of the metal fuse can be designed to start at the beginning of the metallization formation processes. The grounded dummy feature provides a path for the plasma charging to the ground during the entire back end of the line process. The metal fuse is a process level protection as opposed to the diode, which is a circuit level protection. As a process level protection, the metal fuse protects subsequently-formed circuitry. In addition, no additional active area is required for the metal fuse in the chip other than internal dummy patterns that are already implemented. | 09-10-2015 |