Patent application number | Description | Published |
20090162975 | Method of forming a wafer level package - A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive layer. A pattern of holes can be formed through the compliant dielectric layer and the conductive layer which corresponds to the pattern of electrical contacts. The compliant dielectric layer can be contacted with the semiconductor wafer surface so that the pattern of holes is in an aligned position with the pattern of contacts and the compliant dielectric layer and the semiconductor wafer surface then bonded in the aligned position to unite the semiconductor wafer and the interposer component to form a wafer level semiconductor package. The wafer level semiconductor package can be diced to form individual semiconductor chip packages. | 06-25-2009 |
20100230812 | Microelectronic Assemblies Having Compliancy and Methods Therefor - A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. The compliant bumps have planar top surfaces which are accessible through the dielectric layer. Conductive traces may be electrically connected with contacts and extend therefrom to overlie the planar top surfaces of the compliant bumps. Conductive elements may overlie the planar top surfaces in contact with the conductive traces. | 09-16-2010 |
20110265832 | ELECTRODE CONDITIONING IN AN ELECTROHYDRODYNAMIC FLUID ACCELERATOR DEVICE - Conditioning an electrode is performed with a cleaning device for removing detrimental material from forming electrode surfaces of an electrohydrodynamic device or other ion flow generating device. A conditioning material is deposited on the electrode to at least partially mitigate erosion, corrosion, oxidations, dendrite formation on the electrode or ozone production. The conditioning material can be deposited by a wearable portion of one or more cleaning blocks or wipers. The cleaning blocks may have a composition selected to be hard enough to remove detrimental material under a selected pressure, while soft enough to be wearable to deposit a conditioning layer on the electrode surface. The conditioning material can be applied as a solid or liquid. The applied conditioning material can include at least one of silver, palladium, platinum, manganese, nickel, zirconium, titanium, tungsten, aluminum, oxides or alloys thereof, carbon, and organometallic materials that decompose under plasma conditions. | 11-03-2011 |
20110308773 | GRANULAR ABRASIVE CLEANING OF AN EMITTER WIRE - An apparatus for cleaning an emitter electrode in electrohydrodynamic fluid accelerator and precipitator devices via movement of a cleaning device including granular abrasives positioned to frictionally engage the emitter electrode. The cleaning device causes the granular abrasives to travel along a longitudinal extent of the emitter electrode to remove detrimental material accumulated on the electrode. The granular abrasives can be retained in housing, on opposed cleaning surfaces, and can be compressed by the housing or an applied force to abrade detrimental material from the electrode surface. | 12-22-2011 |
20120000486 | EMITTER WIRE CLEANING DEVICE WITH WEAR-TOLERANT PROFILE - An apparatus for cleaning an emitter electrode in electrohydrodynamic fluid accelerator and precipitator devices via movement of a cleaning device including complementary contoured cleaning surfaces positioned to frictionally engage and elastically deform the emitter electrode. The opposing cleaning surfaces laterally distort an otherwise linear longitudinal extent of the electrode under tension. The opposing cleaning surfaces are subject to wear, but maintain frictional engagement despite wear depths that exceed a radius of the electrode due at least in part to the at least partially complementary surface contours engaging the electrode under tension. The cleaning device causes respective cleaning surfaces to travel along a longitudinal extent of the emitter electrode to remove detrimental material and optionally to condition the electrode to at least partially mitigate ozone, erosion, corrosion, oxidation, or dendrite formation on the electrode. | 01-05-2012 |
20120091582 | MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY AND METHODS THEREFOR - A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. The compliant bumps have planar top surfaces which are accessible through the dielectric layer. Conductive traces may be electrically connected with contacts and extend therefrom to overlie the planar top surfaces of the compliant bumps. Conductive elements may overlie the planar top surfaces in contact with the conductive traces. | 04-19-2012 |
20120103568 | Layered Emitter Coating Structure for Crack Resistance with PDAG Coatings - A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. The emitter electrode is a layered structure including an electrode core material and an outermost coating that is susceptible to micro-cracking or corona erosion. A barrier material is provided in a sublayer to protect the underlying electrode core material. An adhesion promoting layer may be used between the barrier material and the electrode core material or between other layers of the structure. solid solution. A method of making an EHD product includes positioning the layered electrode relative to another electrode to motivate fluid flow when energized. | 05-03-2012 |
20120113590 | ELECTRONIC SYSTEM WITH EHD AIR MOVER VENTILATION PATH ISOLATED FROM INTERNAL AIR PLENUM - An electronic system including an enclosure and an internal air plenum within the enclosure. At least one component of the electronic system within the enclosure evolves heat and has a surface exposed to the internal air plenum. The enclosure has inlet and outlet ventilation boundaries together with an EHD air mover disposed therein to motivate airflow along a flow path between the inlet and outlet ventilation boundaries, wherein the flow path is substantially excluded from the internal air plenum by a barrier. | 05-10-2012 |
20120126407 | WAFER LEVEL CHIP PACKAGE AND A METHOD OF FABRICATING THEREOF - Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies. | 05-24-2012 |
20130021715 | SYSTEM AND METHOD FOR IN-SITU CONDITIONING OF EMITTER ELECTRODE WITH SILVER - Cleaning and/or conditioning electrode surfaces can provide significant performance and operational benefits in EHD devices. In particular, conditioning of emitter electrode surfaces with silver (Ag), silver compositions or silver preparations applied in situ at successive times throughout the operating lifetime of an EHD air mover has been found to significantly reduce ozone production. Structures and techniques are described for in situ conditioning electrode surfaces and, in particular, emitter electrode surfaces of an EHD device such as an air mover or precipitator, with a conditioning material that includes silver. | 01-24-2013 |
20130056241 | EMITTER WIRE WITH LAYERED CROSS-SECTION - By selecting different materials for each layer, a multi-layered electrode structure can be made with superior performance characteristics. For example, a multilayered electrode can include a high tensile strength tungsten core, a conductive intermediate palladium, palladium-nickel, or other platinum group metal layer for generating a corona discharge, and a hardened layer comprising rhodium or other platinum group metal or alloy of the same to resist frictional abrasion during removal of silica dendrites that accumulate on the electrode surface during operation. | 03-07-2013 |
20140003964 | ELECTROHYDRODYNAMIC (EHD) FLUID MOVER WITH FIELD BLUNTING STRUCTURES IN FLOW CHANNEL FOR SPATIALLY SELECTIVE SUPPRESSION OF ION GENERATION | 01-02-2014 |