Gruber, NY
Alexander Gruber, Brooklyn, NY US
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20130325728 | SYSTEMS AND METHODS FOR ELECTRONICALLY JOURNALING NOTARIAL ACTS - A system and method is disclosed for electronically journaling notarial acts using a mobile device. The method includes capturing within a mobile application electronic evidence of the notarial act including, for example, date, time, GPS generated location, magnetic stripe reading (or 2d/3d/QR barcode scan) or image of a signer's government issued identification. The method also includes verifying the authenticity of the government identification and verifying the identity and physical presence before the notary of the individual whose signature is being notarized. The method also includes transmitting an encrypted version of the evidence from the mobile device to a web application, and verifying that the evidence has been stored electronically in a database in a non-modifiable, chronological—sequential manner that is retrievable and decryptable by the notary or other officially authorized parties. | 12-05-2013 |
Dale Gruber, East Amherst, NY US
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20090280532 | SERUM-FREE MAMMALIAN CELL CULTURE MEDIUM, AND USES THEREOF - The present invention provides a cell culture medium formulation that supports the in vitro cultivation, particularly in suspension, of mammalian cells, particularly epithelial cells and fibroblast cells, and methods for cultivating mammalian cells in suspension in vitro using these media. The media comprise a basal medium and a polyanionic or polyanionic compound, preferably a polysulfonated or polysulfated compound, and more preferably dextran sulfate. The present invention also provides chemically defined, protein-free eukaryotic cell culture media comprising an iron chelate and zinc, which is capable of supporting the growth (and particularly the high-density growth of mammalian cells) in suspension culture, increasing the level of expression of recombinant protein in cultured cells, and/or increasing virus production in cultured cells. | 11-12-2009 |
20090280533 | SERUM-FREE MAMMALIAN CELL CULTURE MEDIUM, AND USES THEREOF - The present invention provides a cell culture medium formulation that supports the in vitro cultivation, particularly in suspension, of mammalian cells, particularly epithelial cells and fibroblast cells, and methods for cultivating mammalian cells in suspension in vitro using these media. The media comprise a basal medium and a polyanionic or polyanionic compound, preferably a polysulfonated or polysulfated compound, and more preferably dextran sulfate. The present invention also provides chemically defined, protein-free eukaryotic cell culture media comprising an iron chelate and zinc, which is capable of supporting the growth (and particularly the high-density growth of mammalian cells) in suspension culture, increasing the level of expression of recombinant protein in cultured cells, and/or increasing virus production in cultured cells. | 11-12-2009 |
Dale F. Gruber, East Amherst, NY US
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20080286868 | METAL BINDING COMPOUNDS AND THEIR USE IN CELL CULTURE MEDIUM COMPOSITIONS - The present invention is directed generally to metal binding compounds which may be added to cell culture media to replace factors required for cultivation of the cells (e.g. transferrin) which are of animal or human origin. More specifically, the invention is directed to metal binding compounds or complexes thereof comprising one or more transition element cations (such as ferrous or ferric ions), which are added to cell and tissue culture medium compositions. The metal binding compounds may be added to the media alone or may be first complexed with a transition metal ion. The invention is also directed to methods of use of such compositions, including, for example, methods for the cultivation of eukaryotic cells, particularly animal cells, in vitro. The invention also relates to compositions comprising such culture media and one or more cells, and to kits comprising one or more of the above-described compositions. The compositions of the present invention obviate the need for naturally derived metal-binding proteins, such as transferrin and ceruloplasmin, which may contain blood-borne pathogens. | 11-20-2008 |
Franklin A. Gruber, Vestal, NY US
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20080215676 | SHARING A SHARED RESOURCE ACROSS LOGICAL PARTITIONS OR SYSTEMS - An apparatus and method for sharing a resource (such as a modem or virtual private network) allow virtualizing the shared resource in a simple and efficient manner that allows both accepting and initiating virtual or physical connections through the shared resource across logical partitions or systems. An L2TP tunnel is established between the server that owns the shared resource and the client that desires to use the shared resource. Messages are defined that allow the client to initiate an outgoing connection through the shared resource, and that allow the client to accept an incoming connection received from the shared resource. Once the connection is made, the client and ultimate destination communicate through the shared resource via point-to-point communications. | 09-04-2008 |
20080215738 | SHARING A SHARED RESOURCE ACROSS LOGICAL PARTITIONS OR SYSTEMS - An apparatus and method for sharing a resource (such as a modem or virtual private network) allow virtualizing the shared resource in a simple and efficient manner that allows both accepting and initiating virtual or physical connections through the shared resource across logical partitions or systems. An L2TP tunnel is established between the server that owns the shared resource and the client that desires to use the shared resource. Messages are defined that allow the client to initiate an outgoing connection through the shared resource, and that allow the client to accept an incoming connection received from the shared resource. Once the connection is made, the client and ultimate destination communicate through the shared resource via point-to-point communications. | 09-04-2008 |
20080222298 | SHARING A SHARED RESOURCE ACROSS LOGICAL PARTITIONS OR SYSTEMS - An apparatus and method for sharing a resource (such as a modem or virtual private network) allow virtualizing the shared resource in a simple and efficient manner that allows both accepting and initiating virtual or physical connections through the shared resource across logical partitions or systems. An L2TP tunnel is established between the server that owns the shared resource and the client that desires to use the shared resource. Messages are defined that allow the client to initiate an outgoing connection through the shared resource, and that allow the client to accept an incoming connection received from the shared resource. Once the connection is made, the client and ultimate destination communicate through the shared resource via point-to-point communications. | 09-11-2008 |
Jack Gruber, Great Neck, NY US
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20120266401 | TOOTH CLEANING DEVICE - A tooth cleaning device comprising a handle, and a pad coupled to the handle, wherein the pad has a front face, a back face and a plurality of side walls. There are a plurality of different areas disposed on the front face of the pad comprising a first area comprising a first set of protrusions, in a substantially semi-spherical shape, and a second area comprising a second set of protrusions in a substantially conical shape. There is also a third area of protrusions formed as a substantially conical shape, and a fourth area of protrusions formed as a substantially semi-spherical shape. The device can be formed as a pad which collapses voluntarily under pressure. The pad can be made from any suitable material such as any type of rubber or plastic. | 10-25-2012 |
20130198988 | TOOTH CLEANING DEVICE - A tooth cleaning device comprising a handle, and a pad coupled to the handle, wherein the pad has a front face, a back face and a plurality of side walls. There are a plurality of different areas disposed on the front face of the pad comprising a first area comprising a first set of protrusions, in a substantially semi-spherical shape, and a second area comprising a second set of protrusions in a substantially conical shape. There is also a third area of protrusions formed as a substantially conical shape, and a fourth area of protrusions formed as a substantially semi-spherical shape. The device can be formed as a pad which collapses voluntarily under pressure. The pad can be made from any suitable material such as any type of rubber or plastic. | 08-08-2013 |
Nanette Gruber, Clifton Park, NY US
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20120105262 | MULTICHANNEL DIGITIZER AND METHOD OF DIGITIZING - A multichannel digitizer and method of digitizing are provided. One digitizer includes an analog to digital convertor (ADC) having a plurality of channels receiving input analog signals; an operational amplifier in each channel and a comparator connected to the operational amplifier. The ADC further includes a logic circuit in each channel connected to the comparator and configured to generate an output based on a comparator signal received from the comparator. The ADC also includes a ramp generator connected to the plurality of channels and configured to provide a time varying reference signal. | 05-03-2012 |
Peter A. Gruber, Armonk, NY US
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20110097892 | Sprocket Opening Alignment Process and Apparatus for Multilayer Solder Decal - A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process. | 04-28-2011 |
Peter A. Gruber, Yorktown Heights, NY US
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20110079632 | MULTISTACK SOLDER WAFER FILLING - A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes. | 04-07-2011 |
20110233762 | WAFER LEVEL INTEGRATED INTERCONNECT DECAL AND MANUFACTURING METHOD THEREOF - A wafer level integrated interconnect decal manufacturing method and wafer level integrated interconnect decal arrangement. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming and utilization, in the present instance there are employed underfills which consist of a solid film material and which are applied between a semiconductor chip and the substrate in order to enhance the reliability of a flip chip package. In particular, the underfill material increases the resistance to fatigue of controlled collapse chip connect (C4) bumps. | 09-29-2011 |
20110237030 | DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND APPARATUS - A die level integrated interconnect decal manufacturing method and apparatus for implementing the method. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming and utilization, in the present instance there are employed underfills which consist of a solid film material and which are applied between a semiconductor chip and the substrate in order to enhance the reliability of a flip chip package. In particular, the underfill material increases the resistance to fatigue of controlled collapse chip connect (C4) bumps. | 09-29-2011 |
Peter Alfred Gruber, Mohegan Lake, NY US
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20090039140 | Solder Mold With Venting Channels - A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities. | 02-12-2009 |
20090039142 | Method for Forming a Solder Mold with Venting Channels and Method for Using the Same - A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities. | 02-12-2009 |
20100025862 | Integrated Circuit Interconnect Method and Apparatus - Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure. | 02-04-2010 |
20100025863 | Integrated Circuit Interconnect Method and Apparatus - Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure. | 02-04-2010 |
20100028612 | Method and Apparatus for Forming Planar Alloy Deposits on a Substrate - A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas. | 02-04-2010 |
20100072263 | Method and Apparatus for Forming Planar Alloy Deposits on a Substrate - A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas. | 03-25-2010 |
20140262113 | FORMING CONSTANT DIAMETER SPHERICAL METAL BALLS - A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas. | 09-18-2014 |
Peter Alfred Gruber, Mohengan Lake, NY US
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20100086739 | MICROCAVITY STRUCTURE AND PROCESS - A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging. | 04-08-2010 |
Simon Joseph Gruber, Brooklyn, NY US
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20150204847 | HIGH-THROUGHPUT, HIGH-PRECISION METHODS FOR DETECTING PROTEIN STRUCTURAL CHANGES IN LIVING CELLS - Methods for identifying a compound that alters fluorescence resonance energy transfer (FRET) of a protein. The methods include use of a genetically engineered cell that includes a target protein. The target protein includes one or more heterologous domains. In one embodiment, a target protein includes two heterologous domains, and in another embodiment, the target protein includes a heterologous domain and the cell further includes a second protein that includes a heterologous domain. A heterologous domain may include a chromophore or an amino acid to which a fluorescent dye attaches. The fluorescence lifetime of one or more chromophore, one or more fluorescent dye, or the combination thereof, is measured after contacting the cell with a compound A difference between the fluorescence lifetime in the presence of the test compound and the fluorescence lifetime in the absence of the test compound indicates that the test compound alters the FRET of the target protein. | 07-23-2015 |