Groenhuis
Magne Roar Groenhuis, Groningen NL
Patent application number | Description | Published |
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20090254515 | SYSTEM AND METHOD FOR PRESENTING GALLERY RENDITIONS THAT ARE IDENTIFIED FROM A NETWORK - A presentation system provided for use on a network. The presentation system includes an index and one or more modules. The index that stores gallery information, the gallery including (i) information that identifies a plurality of galleries, and (ii) data corresponding to renditions of individual media objects that comprise at least a portion of each of the plurality of galleries. The one or more modules may be configured to (i) receive a selection criteria, (ii) use the selection criteria to identify, from the index, one or more galleries from the index, and (iii) generate a presentation that includes renditions of at least some of the plurality of media objects that comprise the identified one or more galleries. | 10-08-2009 |
20090254643 | SYSTEM AND METHOD FOR IDENTIFYING GALLERIES OF MEDIA OBJECTS ON A NETWORK - Collections of media objects may be aggregated from network resources available over a network. An embodiment provides that a network resource is accessed at each of a plurality of network locations. The network resource is analyzed at each network location to determine whether the network resource includes, or provides access to, any or all media objects in a set of multiple media objects that collectively satisfy one or more editorial criteria for being deemed a gallery, as presented at the network location or network locations where the multiple media objects are provided. The information about the set of media objects may be stored. | 10-08-2009 |
Roelf Groenhuis, Nijmegen NL
Patent application number | Description | Published |
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20080230926 | Surface Treatments for Contact Pads Used in Semiconductor Chip Packagages and Methods of Providing Such Surface Treatments - An inorganic solder mask ( | 09-25-2008 |
Roelf A.j. Groenhuis, Nijmegen NL
Patent application number | Description | Published |
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20150162298 | PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS - Embodiments of a packaged semiconductor device with interior polygon pads are disclosed. One embodiment includes a semiconductor chip and a package structure defining a rectangular boundary and having a bottom surface that includes interior polygonal pads exposed at the bottom surface of the package structure and located on a centerline of the bottom surface of the package structure and edge polygonal pads exposed at the bottom surface of the package structure, located at an edge of the rectangular boundary, and including one edge polygonal pad in the vicinity of each corner of the rectangular boundary. The interior polygonal pads are configured such that a line running between at least one vertex of each of the interior polygonal pads is parallel to an edge of the rectangular boundary of the package structure. | 06-11-2015 |
Roelf Anco Jacob Groenhuis, Nijmegen NL
Patent application number | Description | Published |
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20080272475 | Air Cavity Package for a Semiconductor Die and Methods of Forming the Air Cavity Package - A die package ( | 11-06-2008 |
20080277772 | Methods of Packaging a Semiconductor Die and Package Formed by the Methods - A method of packaging a semiconductor die ( | 11-13-2008 |
20090162791 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF - The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer. | 06-25-2009 |
20100117171 | SENSOR PACKAGE - Sensor package | 05-13-2010 |
20110198738 | METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LEAST ONE MICROELECTRONIC DEVICE - A method for manufacturing a microelectronic package ( | 08-18-2011 |
20120112351 | SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE - Disclosed is a method of manufacturing a discrete semiconductor device package ( | 05-10-2012 |
20120181678 | LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY - Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A second contact is relative to the first contact; the second contact has a split therein to provide first and second portions of the second contact arranged relative to one another to lessen tilting of a soldering condition involving attachment of the chip carrier to a printed circuit board. | 07-19-2012 |
20120286399 | LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE - In one embodiment, a method is provided for packaging a semiconductor die. A leadframe having a die-pad and one or more lead-pads is placed ( | 11-15-2012 |
20120286410 | SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE - Disclosed is a discrete semiconductor device package ( | 11-15-2012 |
20130140705 | Circuit connector apparatus and method therefor - Aspects of the present invention are directed to circuits, circuit packages and related methods. In accordance with various example embodiments, respective electrodes are implemented to facilitate contact to a semiconductor device via different surfaces and/or sidewalls, as may be useful in connecting the device to an external package having a plurality of semiconductor devices in which same-surface connections to the devices are spatially restricted. The semiconductor device has opposing surfaces and sidewalls connecting the surfaces, and contacts to respective different regions in the device. Respective electrodes are coupled to the respective contacts and extend along/around the device to provide access to the contacts via different surfaces. | 06-06-2013 |
20130320551 | DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD - Disclosed is a discrete semiconductor device package ( | 12-05-2013 |
20130334695 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE - The invention relates to an electronic device ( | 12-19-2013 |
20140130346 | SENSOR PACKAGE - Sensor package | 05-15-2014 |
20150140739 | DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD - Disclosed is a discrete semiconductor device package ( | 05-21-2015 |
Roelf Anco Jacob Groenhuis, Niijmegen NL
Patent application number | Description | Published |
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20150287666 | LEAD FOR CONNECTION TO A SEMICONDUCTOR DEVICE - There is disclosed a lead for connection to a semiconductor device die, the lead comprising a clip portion. The clip portion comprises a major surface having two or more protrusions extending therefrom for connection to a bond pad of the semiconductor device die. | 10-08-2015 |