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Gregg B.

Gregg B. Baumbaugh, Noblesville, IN US

Patent application numberDescriptionPublished
20110318983FIRE RETARDANT PANEL COMPOSITIONS - A fire retardant structural board is provided that includes a body of fibrous material, a triglycidyle polyester binder, a sodium borate pentahydride fire retardant, and a sodium borate pentahydride fire retardant. The body of fibrous material has a weight, first and second surfaces, first and second sides, and a thickness. The fibrous material and triglycidyle polyester are dispersed throughout the thickness of the body. The sodium borate pentahydride fire retardant is dispersed between individual fibers of the fibrous material and throughout the thickness of the body. A sodium borate pentahydride fire retardant composition also coats at least the first surface of the body.12-29-2011
20120064329Methods of Making Fire Retardant Panel Compositions - A fire retardant structural board is provided that includes a body of fibrous material, a triglycidyle polyester binder, a sodium borate pentahydride fire retardant, and a sodium borate pentahydride fire retardant. The body of fibrous material has a weight, first and second surfaces, first and second sides, and a thickness. The fibrous material and triglycidyle polyester are dispersed throughout the thickness of the body. The sodium borate pentahydride fire retardant is dispersed between individual fibers of the fibrous material and throughout the thickness of the body. A sodium borate pentahydride fire retardant composition also coats at least the first surface of the body.03-15-2012

Gregg B. Kruaval, Fernley, NV US

Patent application numberDescriptionPublished
20080265444THIN-FILM ALUMINUM NITRIDE ENCAPSULANT FOR METALLIC STRUCTURES ON INTEGRATED CIRCUITS AND METHOD OF FORMING SAME - An aluminum nitride (AlN) thin-film is applied over thin-film metallic circuitry such as an environmental sensor, on the side edges of electrode pads, and/or over some or all of the surface area of a substrate. The thin-film acts to protect the encapsulated structures from exposure to oxidation and from reducing and vacuum environments, electrically insulates the encapsulated structures from other structures, and helps to securely adhere the structures to the substrate surface. The AlN thin-film can also enable multiple IC layers to be stacked on top of each other, with AlN thin-film interlayers employed between IC layers such that each IC layer is separated and electrically insulated from adjacent layers.10-30-2008

Gregg B. Lesartre, Ft. Collins, CO US

Patent application numberDescriptionPublished
20130142195COMPUTER SYSTEM FABRIC SWITCH - A fabric switch includes ports, a location function, component, and a routing function component. Packets are received and forwarded via the ports. The location function component provides for determining a location of routing information within a received packet of rooting information based at least in part on the input port at which said packet was received. The routing function component provides for determining an output port as a routing function based at least in part on the contents of said location.06-06-2013

Gregg B. Lesartre, Fort Collins, CO US

Patent application numberDescriptionPublished
20100082912SYSTEMS AND METHODS FOR RESOURCE ACCESS - Systems and methods are provided to manage access to computing resources. More specifically, certain embodiments are described in which a resource or resource consumer can engage access controls or request that access controls be engaged if the age of a request exceeds one or more thresholds. For example, a requester may, after the age of a request meets or exceeds a threshold, indicate to a destination that a control should be engaged.04-01-2010
20100153799METHOD AND APPARATUS FOR LOOPBACK SELF TESTING - A system and method for loopback self testing. A system includes a host device and an endpoint device. The host device transmits unencoded test symbols. The endpoint device loops back the unencoded test symbols to the host device. The host device drives at least some bits of each unencoded test symbol onto host device data signals and drives at least some bits of each unencoded test symbol onto host device control signals.06-17-2010
20110179423MANAGING LATENCIES IN A MULTIPROCESSOR INTERCONNECT - In a computing system having a plurality of transaction source nodes issuing transactions into a switching fabric, an underserviced node notifies source nodes in the system that it needs additional system bandwidth to timely complete an ongoing transaction. The notified nodes continue to process already started transactions to completion, but stop the introduction of new traffic into the fabric until such time as the underserviced node indicates that it has progressed to a preselected point.07-21-2011
20130188647COMPUTER SYSTEM FABRIC SWITCH HAVING A BLIND ROUTE - A fabric switch includes ports, a blind route determination function component, a location function component, and a routing function component. Packets are received and forwarded via the ports. The blind route determination function component determines whether a port at which a packet is received is configured for a blind route, the location function component provides for determining a location of routing information within the packet based at least in part on the input port at which the packet was received if a blind route is not defined for the port. The routing function component provides for determining an output port as a routing function based at least in part on the contents of the location, or the existence of a blind route.07-25-2013
20140324746TRAINING SEQUENCE - A computing system can include a memory controller and a first storage device. The first storage device is to receive a serially encoded request and forward the serially encoded request to a second storage device before deserializing the serially encoded request. The first storage device is also to return a training sequence from the target storage device to the memory controller. The first storage device is additionally to return a response from the target storage device to the memory controller.10-30-2014
20150039873PROCESSOR PROVIDING MULTIPLE SYSTEM IMAGES - An example processor includes a plurality of processing core components, one or more memory interface components, and a management component, wherein the one or more memory interface components are each shared by the plurality of processing core components, and wherein the management component is configured to assign each of the plurality of processing core components to one of a plurality of system images.02-05-2015

Patent applications by Gregg B. Lesartre, Fort Collins, CO US

Gregg B. Monjeau, Hopewell Junction, NY US

Patent application numberDescriptionPublished
20110180923RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE - A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.07-28-2011

Gregg B. Monjeau, Wallkill, NY US

Patent application numberDescriptionPublished
20120070940FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY - A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.03-22-2012
20120187180FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY - A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.07-26-2012
20140197228FIXTURE TO CONSTRAIN LAMINATE AND METHOD OF ASSEMBLY - A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.07-17-2014
20150077944MULTICHIP MODULE WITH STIFFENING FRAME AND ASSOCIATED COVERS - A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.03-19-2015

Patent applications by Gregg B. Monjeau, Wallkill, NY US

Gregg B. Thorkelson, Saint Anthony, ID US

Patent application numberDescriptionPublished
20090211104SYSTEM AND METHOD FOR CREATING PURPORTIONATELY ACCURATE FIGURES - A system and method for producing proportionately accurate likenesses in an artwork is presented. The system uses a grid or other distance markers on a transparent surface of a card. By observing a measurement of a feature of a subject with the distance markers and transcribing the measurement of the feature on the artwork an accurate likeness of the subject may be made.08-27-2009
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