Patent application number | Description | Published |
20080300126 | LOW-MELTING LEAD-FREE SOLDER GLASS AND USES THEREOF - The low melting solder glass contains, in wt. % on an oxide basis, >1-2, SiO | 12-04-2008 |
20090011917 | LEAD-FREE GLASS COMPOSITES WITH A LOW THERMAL EXPANSION COEFFICIENT - The glass composite has a linear thermal expansion coefficient α | 01-08-2009 |
20100240514 | Granulate, Process for the Production and Use Thereof - The invention relates to granulates, a process for the production thereof, in particular a process for the continuous production of these granulates, and use of the granulates for the manufacture of green compacts or compacts and further processing thereof into corresponding products, whereby the granulates have spherical particles with a smooth or smoothed, in particular fire-polished, surface. | 09-23-2010 |
20110312482 | CRYSTALLIZING GLASS SOLDER AND USE THEREOF - A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO | 12-22-2011 |
20120057337 | CONVERSION MATERIAL, PARTICULARLY FOR A WHITE OR COLORED LIGHT SOUCE COMPRISING A SEMICONDUCTOR LIGHT SOURCE, A METHOD FOR THE PRODUCTION THEREOF, AS WELL AS A LIGHT SOURCE COMPRISING SAID CONVERSION MATERIAL - The invention relates to a conversion material, in particular for a white or colored light source comprising a semiconductor light source as primary light source, comprising a matrix glass that, as bulk material, for a thickness d of about 1 mm, has a pure transmission τ | 03-08-2012 |
20120065049 | Crystallizing glass solders and uses thereof - A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO | 03-15-2012 |
20140179507 | Crystallizing glass solders and uses thereof - A crystallizing glass solder for high-temperature applications, which is free of PbO and contains, in % by weight on an oxide basis: 45% to 60% of BaO; 25% to 40% of SiO | 06-26-2014 |
Patent application number | Description | Published |
20130272774 | BARIUM- AND STRONTIUM-FREE VITREOUS OR GLASS-CERAMIC JOINTING MATERIAL AND ITS USE - A vitreous or glass-ceramic jointing material, which has a coefficient of thermal expansion α | 10-17-2013 |
20130294818 | GLASS-CERAMIC JOINING MATERIAL AND USE THEREOF - The glass-ceramic joining material, which is suitable for bonding or joining at low processing temperatures, especially less than 800° C., is composed of a BaO—SiO | 11-07-2013 |
20130316218 | ELECTROCHEMICAL ENERGY ACCUMULATOR - A glass-based material is disclosed, which is suitable for the production of a separator for an electrochemical energy accumulator, in particular for a lithium ion accumulator, wherein the glass-based material comprises at least the following constituents (in wt.-% based on oxide): SiO | 11-28-2013 |
20130330599 | FEED-THROUGH - A feed-through, for example a battery feed-through for a lithium-ion battery or a lithium ion accumulator, has at least one base body which has at least one opening through which at least one conductor, for example a pin-shaped conductor, embedded in a glass material is guided. The base body contains a low melting material, for example a light metal, such as aluminum, magnesium, AlSiC, an aluminum alloy, a magnesium alloy, titanium, titanium alloy or steel, in particular special steel, stainless steel or tool steel. The glass material consists of the following in mole percent: 35-50% P | 12-12-2013 |
20130330600 | GLASS, IN PARTICULAR SOLDER GLASS OR FUSIBLE GLASS - A glass, for example a glass solder, includes the following components in mole percent (mol-%): P | 12-12-2013 |
20130330603 | FEED-THROUGH - A feed-through has a base body, for example in the form of a disk-shaped metal part. The base body includes at least one opening through which at least one conductor, for example an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body includes a material having a low melting point, such as a light metal, and the glass or glass ceramic material is selected in such a manner that the melting temperature thereof is lower than the melting temperature of the material of the base body. | 12-12-2013 |
20130330604 | FEED-THROUGH AND METHOD FOR INTEGRATING THE FEED-THROUGH IN A HOUSING BY ULTRASONIC WELDING - A feed-through, in particular a feed-through which passes through a housing component of a housing, for example a battery housing, such as a battery cell housing. The housing component includes at least one opening through which at least one conductor, for example an essentially pin-shaped conductor, is guided. The pin-shaped conductor is at least partially surrounded by an insulator, for example made of a glass or a glass ceramic material. The at least one conductor connection, for example of the essentially pin-shaped conductor and/or of the housing component with the insulator, which is a glass or a glass ceramic material, is formed, the connection being an ultrasonic welding. | 12-12-2013 |
20130330605 | FEED-THROUGH COMPONENT - A feed-through component for a conductor feed-through which passes through a part of a housing, for example a battery housing, is embedded in a glass or glass ceramic material and has at least one conductor, for example an essentially pin-shaped conductor, and a head part. The surface, in particular the cross-sectional surface, of the head part is greater than the surface, in particular the cross-sectional surface, of the conductor, for example of the essentially pin-shaped conductor. The head part is embodied such that is can be joined to an electrode-connecting component, for example an electrode-connecting part, which may be made of copper, a copper alloy CuSiC, an aluminum alloy AlSiC or aluminum, with a mechanically stable and non-detachable connection. | 12-12-2013 |
20130337316 | FEED-THROUGH - A feed-through, in particular a feed-through which passes through part of a housing, in particular a battery housing, for example made of metal, in particular light metal, for example aluminum, an aluminum alloy, AlSiC, magnesium, an magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor, in particular an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body is, for example, an essentially annular-shaped base body. | 12-19-2013 |
Patent application number | Description | Published |
20100041978 | CONTROLLING TELEMETRY DURING MAGNETIC RESONANCE IMAGING - The invention is directed techniques for coordinating telemetry of medical devices with magnetic resonance imaging (MRI) techniques. By coordinating telemetry of a medical device with the performance of MRI techniques with, the use of telemetry during MRI may be facilitated. In one example, information indicative of electromagnetic radiation bursts in MRI techniques can be communicated to the medical device prior to execution. In another example, the medical device may identify the electromagnetic radiation bursts, e.g., by measuring for the presence of such bursts. In either case, the medical device can adjust its telemetry to improve communication during MRI. | 02-18-2010 |
20100106006 | TIMING TECHNIQUES FOR MAGNETIC RESONANCE IMAGING - The disclosure is directed to techniques in which magnetic resonance imaging (MRI) is coordinated with the operation of an implantable medical device (IMD). By using an IMD to sense conditions, MRI can be improved because the sensed conditions can accurately define timing for application of electromagnetic radiation bursts. Moreover, by applying stimulation pulses specifically to coordinate the electromagnetic radiation bursts, the MRI may also be improved. | 04-29-2010 |
20110270362 | ACTIVE CIRCUIT MRI/EMI PROTECTION POWERED BY INTERFERING ENERGY FOR A MEDICAL STIMULATION LEAD AND DEVICE - An implantable lead for use with a medical device (IMD) includes active circuits incorporated into the lead to reduce the creation of an induced current, or dissipate the induced current and heat created due to an induced current in the lead. The active circuits are powered by the magnetic resonant imaging energy or interfering magnetic or electrical fields. According to various embodiments, the lead and/or its components can be provided to reduce or dissipate a current and heat induced by various external magnetic or electrical fields. | 11-03-2011 |
20120109261 | PROTECTING AN IMPLANTABLE MEDICAL DEVICE FROM EFFECTS CAUSED BY AN INTERFERING RADIATION FIELD - Techniques are described for protecting an implantable medical device (IMD) from effects caused by interfering radiated fields. An IMD incorporating these techniques may include a telemetry conduction path that includes a first end electrically coupled to a telemetry antenna and a second end electrically coupled to a telemetry circuit disposed within a housing of the IMD. The IMD may further include a stub filter electrically coupled to the telemetry conduction path and configured to attenuate an interfering signal induced in the telemetry conduction path. The stub filter may include a dielectric and a conductor disposed within the dielectric. The conductor may include a first end electrically coupled to the telemetry conduction path and a second end configured in an open circuit configuration. The conductor may have an electrical length approximately equal to one-quarter wavelength of the interfering signal when propagating through the stub filter. | 05-03-2012 |
20120316427 | TIMING TECHNIQUES FOR MAGNETIC RESONANCE IMAGING - The disclosure is directed to techniques in which magnetic resonance imaging (MRI) is coordinated with the operation of an implantable medical device (IMD). By using an IMD to sense conditions, MRI can be improved because the sensed conditions can accurately define timing for application of electromagnetic radiation bursts. Moreover, by applying stimulation pulses specifically to coordinate the electromagnetic radiation bursts, the MRI may also be improved. | 12-13-2012 |
20130149352 | APPARATUS AND METHOD FOR THE TREATMENT OF ABNORMAL UTERINE BLEEDING - Method and apparatus are disclosed for applying a therapeutic amount of a vasoconstrictor within the vaginal canal to control abnormal uterine bleeding. The abnormal bleeding can be due to excessive menstrual blood flow, bleeding from a surgical procedure, postpartum bleeding or any other acute or chronic condition. The vasoconstrictor includes topical agents such as an alpha-adrenergic agonist, for example oxymetazoline. The vasoconstrictor can be applied within the vaginal canal using any of many delivery apparatus. The vasoconstrictor can be included on a carrier member that is positioned in the vaginal canal and remains in place for a period of time, such as a tampon. In some embodiments, the carrier member can be a polymer ring or other shape that is inserted in the upper portion of the vaginal canal, such as the formix area. | 06-13-2013 |
20130150418 | APPARATUS AND METHOD FOR THE TREATMENT OF ABNORMAL UTERINE BLEEDING - Method and apparatus are disclosed for applying a therapeutic amount of a non-systemic vasoconstrictor inside the uterus to control abnormal uterine bleeding. The abnormal bleeding can be due to excessive menstrual blood flow, bleeding from a surgical procedure, postpartum bleeding or any other acute or chronic condition. The vasoconstrictor includes topical agents such as an alpha-adrenergic agonist, for example oxymetazoline. The delivery system can include a catheter having means for retaining position of a distal portion within the uterus. A proximal portion can extend outside of the body for coupling to a vasoconstrictor source, or alternatively, the proximal portion can terminate within the vaginal canal and include a docking port for coupling to a source of vasoconstrictor that is inserted therein. In other embodiments, an applicator is disclosed that is positioned in fluid communication with the lumen of the cervix and allows application of a vasoconstrictor therein. | 06-13-2013 |