Patent application number | Description | Published |
20090320592 | MULTISTAGE PROOF-MASS MOVEMENT DECELERATION WITHIN MEMS STRUCTURES - A micro-electromechanical systems (MEMS) device includes a substrate comprising at least one anchor, a proof mass having first and second deceleration extensions extending therefrom, a motor drive comb, a motor sense comb, a plurality of suspensions configured to suspend the proof mass over the substrate and between the motor drive comb and the motor sense comb. The suspensions are anchored to the substrate. A body is attached to the substrate. At least one deceleration beam extends from a first side of said body. The at least one deceleration beam is configured to engage at least one of the first and second deceleration extensions and slow or stop the proof mass before the proof mass contacts the motor drive comb and the motor sense comb. | 12-31-2009 |
20100019364 | SAW DEBRIS REDUCTION IN MEMS DEVICES - An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area. | 01-28-2010 |
20100020517 | MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS - A Leadless Chip Carrier (LCC) device and method of attaching a Microelectromechanical (MEMS) device into an LCC package. An alignment plate is die bonded into the bottom of an LCC. The alignment plate includes fiducials fabricated into top and bottom metal layers, thus producing a tolerance that will be an order of magnitude better than the tolerance of fiducials included in the LCC. A bump pattern and MEMS die are attached based on the alignment plate and fiducials giving a much improved die to bump alignment. | 01-28-2010 |
Patent application number | Description | Published |
20080271532 | FREQUENCY SHIFTING OF ROTATIONAL HARMONICS IN MEMS DEVICES - Structures and methods for frequency shifting rotational harmonics in MEMS devices are disclosed. An illustrative MEMS device can include a substrate, a sense electrode coupled to the substrate, and a proof mass adjacent to the sense electrode. A number of non-uniformly dispersed holes or openings on the proof mass can be configured to alter the distribution of mass within the proof mass. During operation, the presence of the holes or openings alters the frequency at which the proof mass rotates about a centerline in a rotational mode, reducing the introduction of harmonics into the drive and sense systems. | 11-06-2008 |
20100139373 | MEMS SENSOR PACKAGE - Methods and apparatus for a MEMS sensor package are provided. In one embodiment, a MEMS sensor package comprises a MEMS sensor; a sensor body permeable to gas leakage at a first leak rate; a backfill gas that pressurizes the sensor body to a backfill pressure; wherein the backfill pressure provides a dampening of the MEMS sensor; and wherein the backfill pressure is set such than any increase in pressure within the sensor body due to gas leakage will not cause a deviation in a Q value of the MEMS sensor beyond a predefined range for at least a specified design service life for the MEMS sensor package. | 06-10-2010 |
20100252899 | PACKAGE INTERFACE PLATE FOR PACKAGE ISOLATION STRUCTURES - A package assembly comprises a package base, a sensor die, an isolation plate, and a package interface plate. The isolation plate is bonded to the sensor die and has a plurality of flexible beams. Each flexible beam is configured to deflect under stress such that effects on the sensor die of a thermal mismatch between the package base and the sensor die are reduced. The package interface plate is bonded to the isolation plate and the package base. The package interface plate is configured to limit the maximum distance each flexible beam is able to deflect. | 10-07-2010 |
20140065770 | PACKAGE INTERFACE PLATE FOR PACKAGE ISOLATION STRUCTURES - A package assembly comprises a package base, a sensor die, an isolation plate, and a package interface plate. The isolation plate is bonded to the sensor die and has a plurality of flexible beams. Each flexible beam is configured to deflect under stress such that effects on the sensor die of a thermal mismatch between the package base and the sensor die are reduced. The package interface plate is bonded to the isolation plate and the package base. The package interface plate is configured to limit the maximum distance each flexible beam is able to deflect. | 03-06-2014 |
20150033849 | MEMS DEVICE MECHANISM ENHANCEMENT FOR ROBUST OPERATION THROUGH SEVERE SHOCK AND ACCELERATION - A micro-electro-mechanical systems (MEMS) device comprises at least one proof mass configured to have a first voltage and a motor motion in a first horizontal direction. At least one sense plate is separated from the proof mass by a sense gap, with the sense plate having an inner surface facing the proof mass and a second voltage different than the first voltage. A set of stop structures are on the inner surface of the sense plate and are electrically isolated from the sense plate. The stop structures are configured to prevent contact of the inner surface of the sense plate with the proof mass in a vertical direction. The stop structures have substantially the same voltage as that of the proof mass, and are dimensioned to minimize energy exchange upon contact with the proof mass during a shock or acceleration event. | 02-05-2015 |