Patent application number | Description | Published |
20080208065 | Perivascular pressure sensor and sensing system - An embodiment of the invention is an in-vivo blood pressure sensor device including a strain transducer and flexible biocompatible material that carries the strain transducer. The flexible biocompatible material is configured to encircle the outside of a blood vessel when surgically installed. A preferred embodiment in-vivo blood pressure sensor device of the invention includes a strain transducer carried by a flexible biocompatible ring that is configured to be surgically installed to encircle a blood vessel. The device also includes passive circuitry encased in biocompatible material for sensing strain in the strain transducer and for providing data to an external reader. The passive circuitry is also configured to be surgically installed in a subject. The device further includes a telemetry coil encased in biocompatible material and configured to be surgically installed in a subject, to receive power via inductive coupling to an external reader, to supply power to the passive circuitry and to act as an antenna for communications with an external reader. | 08-28-2008 |
20120034695 | TISSUE/CELL CULTURING SYSTEM AND RELATED METHODS - A system for culturing cells and/or tissue includes a tissue/cell culture chamber including a tissue/cell culture membrane, at least one collapsible valve fluidly coupled with the tissue/cell culture chamber, a pump fluidly coupled with the tissue/cell culture chamber, and a flow loop including the pump, chamber, and collapsible valve fluidly coupled together. | 02-09-2012 |
20120059395 | ENDOSCOPIC CLOSURE DEVICE - An endoscopic closure device comprises: a coupling member; a helical needle mounted to the coupling member and carrying a suture; and a plurality of grasping needles, each of said plurality of grasping needles moveable between a storage position and a deployed position. The plurality of grasping needles is configured to be (a) advanced in the storage position into a luminal defect, (b) moved into the deployed position, and (c) then refracted from the luminal defect, thus pulling and drawing tissue surrounding the luminal defect together. Then, upon rotation of the coupling member and the helical needle, the helical needle is driven into and pierces the tissue, carrying the suture through the tissue. | 03-08-2012 |
20140364866 | ENDOSCOPIC SNARE DEVICE - Embodiments of this invention relate to endoscopic and laparoscopic surgical instruments. More specifically, embodiments of this invention relate to an open loop snare device including a means for securely closing the loop. In some embodiments, a snare device comprises a snare wire and a capture mechanism wherein, when the snare wire is advanced, the snare wire extends from a distal portion of the device along an arcuate path curving back toward the capture mechanism such that, after the snare wire is advanced, activation of the capture mechanism captures the snare wire, creating a formed loop around a target tissue. Retraction of at least one of the snare wire and capture mechanism contracts the formed loop, resecting the target tissue. | 12-11-2014 |
20150250482 | ATRIAL APPENDAGE CLOSURE DEVICE AND RELATED METHODS - An atrial appendage closure device is provided that includes an insertion rod having a first end and a second end. An occluding member having an outer surface and an inner surface is connected to the first end of the insertion rod. The occluding member is moveable between a retracted position and a deployed position such that, in the deployed position, the occluding member is configured to provide a seal between a left atrial appendage and a left atrium of a heart. An anchoring member is further connected to the insertion rod and is configured to slide along the insertion rod to secure the device to a wall of a left atrial appendage. Methods for occluding a left atrial appendage that make use of the closure devices are also provided. | 09-10-2015 |
Patent application number | Description | Published |
20090114151 | Apparatuses and Methods for Maskless Mesoscale Material Deposition - Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible. | 05-07-2009 |
20110129615 | Apparatuses and Methods for Maskless Mesoscale Material Deposition - Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible. | 06-02-2011 |
20130260056 | Apparatuses and Methods for Maskless Mesoscale Material Deposition - Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible. | 10-03-2013 |