Patent application number | Description | Published |
20090309236 | Package on Package Structure with thin film Interposing Layer - The invention relates to microelectronic semiconductor device assemblies having vertically stacked semiconductor device layers. In a disclosed example of a preferred embodiment, a semiconductor device includes a base substrate, an interposing layer, and a second semiconductor device. The interposing layer features a thin insulating film with numerous electrical contacts on its surfaces for electrically coupling with electrical contacts on the adjacent layers. The interposing layer further includes electrical contacts for coupling with one or more non-adjacent layers. Particular examples of preferred embodiments of the invention disclose the use of polyimide film for the interposing layer material and metal studs for non-adjacent layer contacts. | 12-17-2009 |
20100084755 | Semiconductor Chip Package System Vertical Interconnect - Stacked semiconductor chip package system vertical interconnects and related methods are disclosed. A preferred embodiment of the invention includes a first semiconductor chip with a surface bearing a plurality of first fusible metallic coupling elements. A second semiconductor chip has a plurality of second fusible metallic coupling elements. The first and second fusible metallic coupling elements correspond at the adjoining surfaces of the first and second semiconductor chips when stacked, and are fused to form a gold-tin eutectic alloy fused metallic coupling vertically interconnecting the stacked chips. | 04-08-2010 |
20110011424 | Method for Cleaning Insulating Coats from Metal Contact Surfaces - A process flow employing a liquid cleaning agent ( | 01-20-2011 |
20140211439 | CIRCUIT ASSEMBLY - A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole. | 07-31-2014 |
20140211444 | DISCRETE COMPONENT ASSEMBLY - A discrete component assembly includes a discrete component having a central longitudinal axis and having an outer surface with a laterally outermost point positioned at a first radial distance from the central longitudinal axis. The assembly includes a support structure mounted on the discrete component. The assembly also includes a plurality of contact pads electrically connected to the discrete component and mounted on the support structure at radial distances from the central longitudinal axis greater than the first radial distance. | 07-31-2014 |
20150041994 | SEMICONDUCTOR PACKAGE HAVING RECESSED SOLDER TERMINALS - A semiconductor device ( | 02-12-2015 |
Patent application number | Description | Published |
20110019205 | Apparatus and method for implementing a touchless slider - A method for gesture recognition in an optical system using a touchless slider is shown. The touchless slider has first and second reference points positioned along an axis in an optical system. The method includes obtaining a plurality of first and second reflectance values by measuring an amplitude of light reflected from an object relative to the first and second reference points, respectively, wherein each first and second reflectance value corresponds to a different point in time. The plurality of first and second reflectance values are compared to identify a plurality of ratio values between the first and second reflectance values, wherein each of the plurality of ratio values corresponds to one of the points in time. At least one of a position and a direction of movement of the object relative to the first and second reference points is determined based on the identified plurality of ratio values. | 01-27-2011 |
20110157068 | TOUCH SCREEN POWER-SAVING SCREEN SCANNING ALGORITHM - A method for detecting touch locations on a capacitive array includes the steps of scanning for at least one touch location on an entire capacitive array using a first sensing circuitry and detecting the at least one touch location with the first sensing circuitry. A smaller portion of the capacitive array is determined responsive to the detection of the at least one touch location. The at least one touch location is scanned only within smaller portion of the capacitive array using a second sensing circuitry. The at least one touch location is detected with the second sensing circuitry and output for use. | 06-30-2011 |
20110248649 | SYSTEMS AND METHODS FOR A DIGITAL-TO-CHARGE CONVERTER (DQC) - Systems and methods for a digital-to-charge converter (“DQC”) are disclosed. A DQC may include a converting circuit configured to receive a first digital signal indicative of a voltage across a capacitor coupled to an output pin of the digital-to-charge converter and to determine a present charge of the capacitor based at least in part on the first digital signal. The DQC may also include an error determining circuit coupled to the converting circuit, wherein the error determining circuit is configured to receive a second digital signal indicative of a target charge via an input pin of the digital-to-charge converter and to determine a difference between the target charge and the present charge. The DQC may further include a correction circuit coupled to the error determining circuit and configured to control a programmable current source to produce an analog signal at the output pin in response to the determined difference. | 10-13-2011 |
20140240280 | TOUCH PANEL SENSOR HAVING DUAL-MODE CAPACITIVE SENSING FOR DETECTING AN OBJECT - An apparatus configured to determine an approximate position of an object utilizing mutual-capacitance sensing capabilities during a first mode of operation and determining one or more attributes of the object utilizing self-capacitance sensing capabilities during a second mode of operation is disclosed. The apparatus includes a touch panel controller configured to operatively couple to a touch panel sensor. The touch panel sensor includes a plurality of drive electrodes and at least one sense electrode. A plurality of nodes are formed at the intersections of the plurality of drive electrodes and the at least one sense electrode. The touch panel controller is configured to determine an approximate position of an object performing a touch event over the touch panel sensor during the first mode of operation and to determine one or more attributes of the object during the second mode of operation. | 08-28-2014 |
Patent application number | Description | Published |
20100283760 | METHOD AND APPARATUS FOR SCANNING A TOUCHSCREEN WITH MULTI-TOUCH DETECTION USING MASTER/SLAVE DEVICES - A touch panel scan system is disclosed for detecting a change in mutual capacitance on the surface of a touch panel. A first touch detect device is provided having a transmitter for transmitting a transmit signal to a select one of a plurality of first lines on a first edge of a touch panel to facilitate a single line scan operation. A second touch detect device is interfaced with a select one or ones of second lines on a second edge of the touch panel having a receiver for receiving therefrom and processing thereof transmit signals coupled thereto from the select one or ones of the first lines to detect changes in a mutual capacitance associated with the select one or ones of the second lines and the first line. At least one of the first or second touch detect devices functions as a master and the other functions as a slave, with the master coupled to the slave and generating a SYNC signal to initiate a single scan operation of a select one of the first lines. | 11-11-2010 |
20110248961 | Device Including Multi-Function Circuitry Having Optical Detectors and Method of Flip-Chip Assembly Therefor - A device includes a substrate is substantially transparent and includes a contact surface and an interface surface. The interface surface includes a plurality of electrical contacts. The device further includes a semiconductor die, which includes a plurality of connections, a first photo detector and a second photo detector. Each of the plurality of connections includes a connection bump formed thereon to couple to the plurality of electrical contacts of the interface surface of the substrate. The plurality of connections positioned relative to the first and second photo detectors to alter a directional response of at least one photo detector of the plurality of photo detectors. | 10-13-2011 |
20110266128 | Keypad System and Keypad with Enhanced Secutiry - In one form, a keypad includes a substrate and a flexible membrane disposed above a top surface of the substrate. The substrate has the top surface, a first conductor below the top surface, an insulator layer separating the first conductor from the top surface, and a second conductor disposed in proximity to the first conductor and to the top surface and coupled to a voltage terminal. The flexible membrane is disposed above the top surface of the substrate and has a third conductor forming a key. The third conductor is movable relative to the top surface. In another form, a keypad system includes such a keypad and a capacitive sensing circuit coupled to the first conductor for sensing a change in capacitance between the first conductor and the voltage terminal when the third conductor moves relative to the top surface. | 11-03-2011 |
20110273189 | SENSING APPARATUS FOR AND ASSOCIATED METHODS - An apparatus includes an integrated circuit (IC) configured to sense capacitance, and two or more capacitive elements coupled to the IC. The capacitive elements each have a first section, and one capacitive element has a second section. The first sections of the capacitive elements have the same or substantially the same lengths, shapes, and/or capacitance values. | 11-10-2011 |
20110273190 | Sensing Apparatus and Associated Methods - An apparatus includes an integrated circuit (IC) configured to sense capacitance, and two or more capacitive elements coupled to the IC. The capacitive elements each have a first section, and one capacitive element has a second section. The first sections of the capacitive elements have the same or substantially the same lengths, shapes, and/or capacitance values. | 11-10-2011 |