Patent application number | Description | Published |
20100317502 | SINTERED MATERIAL FOR DIELECTRIC SUBSTANCE AND PROCESS FOR PREPARING THE SAME - The present invention relates to a sintered material for a dielectric substance and a process for preparing the same. Particularly, the present invention is directed to a sintered material for a dielectric substance comprising a core-shell microstructure including a core of a first material and a shell of a second material, wherein a relative dielectric constant of said first material is larger that a relative dielectric constant of said second material. | 12-16-2010 |
20110015079 | METHOD OF FORMING PRECURSOR SOLUTION FOR METAL ORGANIC DEPOSITION AND METHOD OF FORMING SUPERCONDUCTING THICK FILM USING THE SAME - The present invention relates to a method of forming a precursor solution for metal organic deposition and a method of forming a superconducting thick film using the same. A first precursor comprising one rare earth element, a second precursor comprising barium, and a third precursor comprising copper are dissolved into acid to form a compound solution, the compound solution is dissolved into solvent to form a pre-precursor solution, and the solvent of the pre-precursor solution is evaporated to form a precursor solution with the increased viscosity. A sufficiently thick film can be formed without any cracking through only one-time coating. | 01-20-2011 |
20130089961 | Methods of Forming Semiconductor Devices Including an Epitaxial Layer and Semiconductor Devices Formed Thereby - Methods of forming a semiconductor device are provided. The methods may include forming an epitaxial layer by growing a crystalline layer using a semiconductor source gas in a reaction chamber, and by etching the crystalline layer using an etching gas in the reaction chamber. | 04-11-2013 |
20140138745 | SEMICONDUCTOR DEVICES INCLUDING A STRESSOR IN A RECESS AND METHODS OF FORMING THE SAME - Semiconductor devices including a stressor in a recess and methods of forming the semiconductor devices are provided. The methods may include forming a trench in an active region and the trench may include a notched portion of the active region. The methods may also include forming an embedded stressor in the trench. The embedded stressor may include a lower semiconductor layer and an upper semiconductor layer, which has a width narrower than a width of the lower semiconductor layer. A side of the upper semiconductor layer may not be aligned with a side of the lower semiconductor layer and an uppermost surface of the upper semiconductor layer may be higher than an uppermost surface of the active region. | 05-22-2014 |
20150214051 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device includes partially removing an upper portion of an active fin of a substrate loaded in a chamber to form a trench; and forming a source/drain layer in the trench, which includes providing a silicon source gas, a germanium source gas, an etching gas and a carrier gas into the chamber to perform a selective epitaxial growth (SEG) process using a top surface of the active fin exposed by the trench as a seed so that a silicon-germanium layer is grown; and purging the chamber by providing the carrier gas into the chamber to etch the silicon-germanium layer. | 07-30-2015 |
20150214329 | SEMICONDUCTOR DEVICES INCLUDING A STRESSOR IN A RECESS AND METHODS OF FORMING THE SAME - Semiconductor devices including a stressor in a recess and methods of forming the semiconductor devices are provided. The methods may include forming a trench in an active region and the trench may include a notched portion of the active region. The methods may also include forming an embedded stressor in the trench. The embedded stressor may include a lower semiconductor layer and an upper semiconductor layer, which has a width narrower than a width of the lower semiconductor layer. A side of the upper semiconductor layer may not be aligned with a side of the lower semiconductor layer and an uppermost surface of the upper semiconductor layer may be higher than an uppermost surface of the active region. | 07-30-2015 |
20150221654 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - A semiconductor device includes: a substrate including a plurality of first active regions and a plurality of second active regions; a plurality of first gate structures formed above the first active regions, respectively, and a plurality of second gate structures formed above the second active regions, respectively; and a plurality of first source/drain layers corresponding to the first gate structures, respectively, and a plurality of second source/drain layers corresponding to the second gate structures, respectively, wherein a width of each of the first source/drain layers is smaller than a width of each of the second source/drain layers. | 08-06-2015 |
20150318399 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device includes a first multi-channel active pattern defined by a field insulating layer and extending along a first direction, the first multi-channel active pattern including a first portion having a top surface protruding further in an upward direction than a top surface of the field insulating layer and a second portion on both sides of the first portion, the second portion having sidewalls with a continuous profile and a top surface protruding further in the upward direction than the top surface of the field insulating layer and protruding in the upward direction less than the top surface of the first portion, a gate electrode on the first portion of the first multi-channel active pattern and extending along a second direction different from the first direction, and a first source/drain region on the second portion of the first multi-channel active pattern and contacting the field insulating layer. | 11-05-2015 |