Geffken
Andrew S. Geffken, Haverford, PA US
Patent application number | Description | Published |
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20100180631 | TURBO-COMPRESSOR-CONDENSER-EXPANDER - This invention provides an isothermal turbocompressor and a combined turbo-compressor-condenser-expander arrangement, which includes heat-transferring blades that are mounted on, or surround, individual conduits to promote air exchange and heat transfer. In operation, the open framework rotates in free air to promote heat exchange. This optimizes contact with free air during rotation. The assembly includes a first plurality of spokes extending radially outwardly from a first central hub to an outer perimeter with first radial conduits that transport refrigerant under centrifugal force and compression from the hub to the outer perimeter. The first radial conduits include heat exchanging blades. A second plurality of spokes extend radially outwardly from a second central hub at an axial spacing from the first central hub. This second plurality of spokes each includes a second thermally-insulated conduit that transports refrigerant from the outer perimeter to the second central hub. Axial conduits extend axially at the outer perimeter, and each interconnects each first radial conduit and each second radial conduit. At least some of the plurality of axial conduits include an axial blade in thermal communication with the conduit that promotes heat exchange radially. A motor rotates a central axis of the turbo-compressor-condenser-expander. | 07-22-2010 |
20140069138 | TURBO-COMPRESSOR-CONDENSER-EXPANDER - An isothermal turbo-compressor-condenser-expander arrangement includes heat-transferring blades that are mounted on, or surround, individual conduits to promote air exchange and heat transfer. In operation, the open framework rotates in free air to promote heat exchange. The assembly includes a first plurality of spokes extending radially outwardly from a first central hub to an outer perimeter with first radial conduits that transport refrigerant under centrifugal force and compression from the hub to the outer perimeter. The first radial conduits include heat exchanging blades. A second plurality of spokes extend radially outwardly from a second central hub that each includes a second thermally-insulated conduit that transports refrigerant from the outer perimeter to the second central hub. Axial conduits extend axially at the outer perimeter. At least some of the axial conduits include an axial blade in thermal communication with the conduit that promotes heat exchange radially. | 03-13-2014 |
Robert M. Geffken, Burlington, VT US
Patent application number | Description | Published |
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20080203579 | SACRIFICIAL METAL SPACER DUAL DAMASCENE - A method and structure for a dual damascene interconnect structure comprises forming wiring lines in a metallization layer over a substrate, shaping a laminated insulator stack above the metallization layer, patterning a hardmask over the laminated insulator stack, forming troughs in the hardmask, creating sacrificial tungsten sidewall spacers in the troughs, patterning the laminated insulator stack, removing the sacrificial sidewall spacers, forming vias in the patterned laminated insulator stack, and depositing a metal liner and conductive material into the vias and troughs, wherein the laminated insulator stack comprises a dielectric layer further comprising oxide and polyarylene. The step of depositing prevents the laminated insulator stack from sputtering into the vias. Moreover, the step of depositing comprises cleaning the vias and troughs, optionally performing a reactive ion etching or argon sputter cleaning, depositing a plurality of metal layers over the vias and troughs, and depositing copper in the vias and troughs. | 08-28-2008 |
20080293242 | METAL SPACER IN SINGLE AND DUAL DAMASCENE PROCESSING - A method and structure for a single or dual damascene interconnect structure comprises forming wiring lines in a metallization layer over a substrate, shaping a laminated insulator stack above the metallization layer, patterning a hardmask over the laminated insulator stack, forming troughs in the hardmask, patterning the laminated insulator stack, forming vias in the patterned laminated insulator stack, creating sidewall spacers in the bottom portion of the vias, depositing an anti-reflective coating on the sidewall spacers, etching the troughs, removing the anti-reflective coating, depositing a metal layer in the troughs, vias, and sidewall spacers, and applying conductive material in the troughs and the vias. The laminated insulator stack comprises a dielectric layer further comprising oxide and polyarylene. | 11-27-2008 |
Robert Michael Geffken, Burlington, VT US
Patent application number | Description | Published |
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20090186482 | METHOD OF FORMING CAPPING STRUCTURES ON ONE OR MORE MATERIAL LAYER SURFACES - Methods of forming capping structures on one or more different material surfaces are provided. One embodiment includes disposing a semiconductor structure in a reduced pressure chamber, forming a capping GCIB within the reduced pressure chamber, and directing the capping GCIB onto at least one of the one or more different material surfaces, so as to form at least one capping structure on the one or more surfaces onto which the capping GCIB is directed. | 07-23-2009 |