Patent application number | Description | Published |
20080217773 | Removal of integrated circuits from packages - Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously. | 09-11-2008 |
20090250249 | INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME - Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate. | 10-08-2009 |
20090250823 | Electronic Modules and Methods for Forming the Same - Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. | 10-08-2009 |
20090251879 | DIE THINNING PROCESSES AND STRUCTURES - Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning. | 10-08-2009 |
20110309528 | Electronic Modules and Methods for Forming the Same - Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. | 12-22-2011 |
20120086135 | INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME - In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity. | 04-12-2012 |
20130329376 | ELECTRONIC MODULES - Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. | 12-12-2013 |
20150181709 | ELECTRONIC MODULE SUBASSEMBLIES AND METHODS FOR FABRICATING THE SAME - An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate. The middle laminate has a plurality of web areas, each web area defining at least one hole. The defines a planar top surface and a plurality of open areas corresponding to and aligned with the plurality of web areas. First components have a first thickness. At least one first component is in each of the open areas. Second components have a second thickness relatively larger than the first thickness. At least one second component is in each of the open areas. The second components extend into the respective at least one hole of the web areas. Encapsulant fills in the open areas and the web areas. | 06-25-2015 |