Patent application number | Description | Published |
20080210007 | Angular velocity sensor - An angular velocity sensor includes: a first tuning-fork vibrator having a first base and first aims extending from the first base in a first direction; a second tuning-fork vibrator having a second bass and second arms extending from the second base in a second direction; and a double gimbal portion mat has a drive gimbal portion vibrating about an axis extending in a fourth direction, and a sense gimbal portion vibrating about an axis extending in a fifth direction and senses an angular velocity about an axis extending in a third direction. | 09-04-2008 |
20080237757 | MICRO MOVABLE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER - A micro movable device is made by processing a material substrate of a multilayer structure including a first layer, a second layer having a finely rough region on its surface on the side of the first layer, and an intermediate layer provided between the first and the second layer. The micro movable device includes a first structure formed in the first layer and a second structure formed in the second layer. The second structure includes a portion opposing the first structure via a gap and having a finely rough region on the side of the first structure, and being relatively displaceable with respect to the first structure. | 10-02-2008 |
20080316187 | Touch panel device and method for manufacturing touch panel devices - Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion. | 12-25-2008 |
20090139328 | Packaged micro movable device and method for making the same - A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products. | 06-04-2009 |
20100024547 | ANGULAR SPEED SENSOR AND ELECTRONIC APPARATUS - An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation. | 02-04-2010 |
20100067208 | Packaged device and method of fabricating packaged-device - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 03-18-2010 |
20100085332 | TOUCH PANEL DEVICE AND CONTACT POSITION DETECTION METHOD - A burst wave is applied to an excitation element of a touch panel main body from an oscillation section so as to excite surface acoustic waves, and the excited surface acoustic waves are received by a receiving element of the touch panel main body. The received signals are A/D converted by a receiving section, and a control section calculates the contact position and the contact width of the object in contact with the touch panel main body, based on time-series changes in the received strength. Based on the received strength of surface acoustic waves, the control section controls the wave number of the burst wave to be applied to the excitation element. | 04-08-2010 |
20100218977 | PACKAGED DEVICE AND PRODUCING METHOD THEREOF - A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface. | 09-02-2010 |
20110187348 | POWER STRIP AND ELECTRIC POWER MEASUREMENT SYSTEM - The following disclosure provides a power strip including: a busbar electrically connected to a power source; multiple electrical outlets allowing multiple power plugs to be inserted thereinto, respectively; distribution bars which are branched out from the busbar and respectively supply the electrical outlets with electric currents of the power source; and a plurality of electric current measurement units each configured to measure the electric current flowing through a corresponding one of the distribution bars. | 08-04-2011 |
20130010447 | PACKAGED DEVICE AND METHOD OF FABRICATING PACKAGED-DEVICE - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 01-10-2013 |
20130060494 | METHOD OF CALCULATING CURRENT CORRECTION FORMULA FOR POWER STRIP, CURRENT MEASURING METHOD, AND POWER STRIP - A method of calculating a current correction formula may include first measuring voltage values at each of current measuring parts configured to measure currents in socket parts of a power strip in a state in which no current flows in the socket parts, second measuring the voltage values at each of the current measuring parts in a state in which a current flows in one of the socket parts, and calculating a correction formula formed by a inverse matrix of a matrix having as its elements differences between the voltage values measured by the second measuring and the voltage values measured by the first measuring. | 03-07-2013 |