Patent application number | Description | Published |
20090028580 | Optical reception apparatus and controlling method thereof - The optical reception apparatus of the invention branches into two an RZ-DQPSK optical signal input from an optical transmission path via an optical amplifier, respectively sends this to delay interferometers and photoelectric converters on a pair of arms, separately detects a number of generated errors for the signals propagating through the arms in an error-number detection circuit, obtains a difference in the respective number of generated errors in an error-number detector, and controls phase shift in the delay interferometers so that the difference is within a preset tolerance. By so doing, it is possible to realize excellent reception performance by suppressing the occurrence of the burst error. | 01-29-2009 |
20090257756 | Optical receiver and optical phase control method thereof - An optical receiver includes: delay interferometers respectively provided in at least two branches that branch a reception signal; a phase shift amount control device that controls a phase shift amount of the delay interferometer in accordance with an optical phase control value; a balanced optical detecting section that respectively photoelectrically converts respective branch signals output from the delay interferometers; a data regenerating section that regenerates transmission data from the photoelectrically converted branch signals output from the balanced optical detecting section; a control section that outputs the optical phase control value based on a signal of the data regenerating section; and a memory that stores therein the optical phase control value output from the control section at the time of signal communication, as a history of control values, wherein the control section refers to the history of control values during a signal communication operation to determine the optical phase control value. | 10-15-2009 |
20100027988 | FRAME PROCESSING APPARATUS, OPTICAL RECEIVING APPARATUS, OPTICAL TRANSCEIVING APPARATUS, OPTICAL TRANSMISSION SYSTEM, AND FRAME PROCESSING CONTROLLING METHOD - The technique for improving the efficiency in use of power resources while maintaining the received signal quality that satisfies the requirement during a system operation is disclosed. The frame processing apparatus disclosed in the present case includes: a frame processing unit which performs frame processing on an input signal in the designated error processing mode; and a controlling unit which receives the monitoring result relating to the signal quality of the input signal and performs switching control of the designation of the above error processing mode in the frame processing unit based on the received monitoring result. | 02-04-2010 |
20110200339 | OPTICAL RECEIVER - An optical receiver includes: a waveform distortion compensator to perform an operation on digital signal representing an optical signal generated by an A/D converter to compensate for waveform distortion of the optical signal; a phase detector to generate phase information representing sampling phase of the A/D converter; a phase adjuster to generate digital signal representing an optical signal in which the sampling phase of the A/D converter is adjusted from an output signal of the waveform distortion compensator using the phase information; a demodulator to generate a demodulated signal from the output signal of the phase adjuster; a phase controller to control the sampling phase of the A/D converter; a peak detector to detect a peak value of the phase information while the sampling phase of the A/D converter is controlled by the phase controller; and a compensation controller to control the waveform distortion compensator using the peak value. | 08-18-2011 |
20110229128 | OPTICAL NODE, OPTICAL NETWORK SYSTEM, AND METHOD FOR MEASURING POLARIZATION MODE DISPERSION - An optical node disposed along a transmission line that uses optical fiber. The optical node includes a first signal generator and a monitor. The first signal generator generates a first measurement signal for measuring polarization mode dispersion values and transmits the first measurement signal along the transmission line. The monitor detects a second measurement signal from the transmission line and measures polarization mode dispersion values by performing signal processing with respect to the second measurement signal. | 09-22-2011 |
20140328602 | DIGITAL COHERENT RECEIVER, OPTICAL RECEPTION SYSTEM, AND OPTICAL RECEPTION METHOD - A digital coherent receiver, includes: an acquisition circuit configured to acquire a plurality of digital electrical signals obtained by sampling a plurality of analog electrical signals by using a sampling signal and digitally converting the plurality of analog electrical signals, the plurality of analog electrical signals being obtained by subjecting a plurality of optical signals to photoelectric conversion; a phase deviation detector configured to output a detection value corresponding to a phase deviation between the sampling signal and the optical signals by using the digital electrical signals; a determination circuit configured to determine whether or not a variation amount of the detection value is equal to or less than a first variation amount; and a compensation circuit configured to compensate wavelength dispersion of the digital electrical signals based on the detection value when the variation amount is equal to or less than the first variation amount. | 11-06-2014 |
20140363154 | OPTICAL SIGNAL PROCESSING DEVICE, OPTICAL SIGNAL PROCESSING METHOD AND RECORDING MEDIUM - An optimization unit in an optical receiver divides a symbol region out of a plurality of symbol regions into which signal points that specifies symbol information included in an optical signal are classified, into a plurality of division regions from the symbol center coordinate of the symbol region. Moreover, the optimization unit accumulates the signal points of the symbol information for every division region in the symbol region. Furthermore, based on the accumulated number of signal points for every division region, the optimization unit controls the average length of a phase estimation unit when the phase noise of the optical signal is calculated. | 12-11-2014 |
Patent application number | Description | Published |
20100052142 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a first electrode and a second electrode of a semiconductor element, the first electrode and the second electrode being configured on a first surface and a second surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, the surface portion being other than regions, each of the regions connecting with the first second electrodes, each of inner electrodes being connected with the first or the second electrodes, a thickness of the inner electrode from the first surface or the second surface being the same thickness as the encapsulating material from the first surface or the second surface, respectively, outer electrodes, each of the outer electrodes being formed on the encapsulating material and connected with the inner electrode, a width of the outer electrode being at least wider than a width of the semiconductor chip, and outer plating materials, each of the outer plating materials covering five surfaces of the outer electrode other than one surface of the outer electrode being connected with the inner electrode. | 03-04-2010 |
20100052185 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a semiconductor element, a first electrode of the semiconductor chip being configured on a first surface of the semiconductor element, a second electrode of the semiconductor element being configured on a second surface opposed to the first surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, a first hole and a second hole being configured in the encapsulating material, a portion of the first electrode and a portion of the second electrode being exposed, a first conductive material being connected to the first surface of the semiconductor chip via the first hole, a second conductive material being connected to the second surface of the semiconductor chip via the second hole, and a plating film covering five surfaces of the first conductive material other than one surface contacting with the encapsulating material and five surfaces of the second conductive material other than one surface contacting with the encapsulating material. | 03-04-2010 |
20110186982 | SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME - According to one embodiment, a surface mount diode including a diode chip including a first main surface and a second main surface, a cathode electrode including a first internal electrode portion on the first main surface and a first external electrode portion on the first internal electrode portion, an anode electrode including a second internal electrode portion on the second main surface and a second external electrode portion on the second internal electrode portion, a thickness of the second external electrode portion being the same as a thickness of the first external electrode portion, a first covering member covering a periphery surface of one of the internal electrode portions and a periphery surface of the diode chip, and a second covering member covering a periphery surface of the other of the internal electrode portions, the second covering member being different in color from the first covering member. | 08-04-2011 |
20110272817 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a first electrode and a second electrode of a semiconductor element, the first electrode and the second electrode being configured on a first surface and a second surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, the surface portion being other than regions, each of the regions connecting with the first second electrodes, each of inner electrodes being connected with the first or the second electrodes, a thickness of the inner electrode from the first surface or the second surface being the same thickness as the encapsulating material from the first surface or the second surface, respectively, outer electrodes, each of the outer electrodes being formed on the encapsulating material and connected with the inner electrode, a width of the outer electrode being at least wider than a width of the semiconductor chip, and outer plating materials, each of the outer plating materials covering five surfaces of the outer electrode other than one surface of the outer electrode being connected with the inner electrode. | 11-10-2011 |
20140264435 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor module includes: a first circuit component: a second circuit component; and a third circuit component. The first circuit component includes: an insulating first substrate; a first conductive layer; a first switching element; and a first diode. The second circuit component includes: an insulating second substrate; a second conductive layer; a second switching element; and a second diode. The second circuit component is disposed between the first circuit component and the third circuit component. The third circuit component includes: an insulating third substrate; a third conductive layer provided on the third substrate and including a third element mounting unit; a third switching element provided on the third element mounting unit; and a third diode provided on the third element mounting unit. A direction from the third switching element toward the third diode is an opposite direction to the first direction. | 09-18-2014 |