Patent application number | Description | Published |
20130082754 | PHASE LOCKED LOOP CALIBRATION - An inductor-capacitor phase locked loop (LCPLL) includes an inductor-capacitor voltage controlled oscillator (LCVCO) that provides an output frequency. A calibration circuit includes two comparators and provides a coarse tune signal to the LCVCO. The two comparators respectively compare the loop filter signal with a first reference voltage and a second reference voltage that is higher than the first reference voltage to supply a first and second comparator output, respectively. The calibration circuit is capable of adjusting the coarse tune signal continuously in voltage values and adjusts the coarse tune signal based on the two comparator outputs. A loop filter provides a loop filter signal to the calibration circuit and a fine tune signal to the LCVCO. A coarse tune frequency range is greater than a fine tune frequency range. | 04-04-2013 |
20130126979 | INTEGRATED CIRCUITS WITH ELECTRICAL FUSES AND METHODS OF FORMING THE SAME - A method of forming an integrated circuit includes forming at least one transistor over a substrate. Forming the at least one transistor includes forming a gate dielectric structure over a substrate. A work-function metallic layer is formed over the gate dielectric structure. A conductive layer is formed over the work-function metallic layer. A source/drain (S/D) region is formed adjacent to each sidewall of the gate dielectric structure. At least one electrical fuse is formed over the substrate. Forming the at least one electrical fuse includes forming a first semiconductor layer over the substrate. A first silicide layer is formed on the first semiconductor layer. | 05-23-2013 |
20130241634 | RF CALIBRATION THROUGH-CHIP INDUCTIVE COUPLING - An integrated circuit includes a first chip and a second chip coupled to the first chip in a vertical stack. The first chip includes a radio frequency circuit and a first coil electrically coupled to the radio frequency circuit. The second chip includes a calibration circuit and a second coil electrically coupled to the calibration circuit. The calibration circuit is configured to calibrate the radio frequency circuit disposed on the first chip through inductive coupling between the first and second coils. | 09-19-2013 |
20130311957 | SEMICONDUCTOR DEVICE DESIGN SYSTEM AND METHOD OF USING THE SAME - A circuit design system includes a schematic design tool configured to generate schematic information and pre-coloring information for a circuit. The circuit design system also includes a netlist file configured to store the schematic information and the pre-coloring information on a non-transitory computer readable medium and an extraction tool configured to extract the pre-coloring information from the netlist file. A layout design tool, included in the circuit design system, is configured to design at least one mask based on the schematic information and the pre-coloring information. The circuit design system further includes a layout versus schematic comparison tool configured to compare the at least one mask to the schematic information and the pre-coloring information. | 11-21-2013 |
20130342247 | CAPACTIVE LOAD PLL WITH CALIBRATION LOOP - A circuit includes a capacitive-load voltage controlled oscillator having an input configured to receive a first input signal and an output configured to output an oscillating output signal. A calibration circuit is coupled to the voltage controlled oscillator and is configured to output one or more control signals to the capacitive-load voltage controlled oscillator for adjusting a frequency of the oscillating output signal. The calibration circuit is configured to output the one or more control signals in response to a comparison of an input voltage to at least one reference voltage. | 12-26-2013 |
20140009175 | MOTION DETECTION USING CAPACITOR HAVING DIFFERENT WORK FUNCTION MATERIALS - An apparatus for detecting mechanical displacement in a micro-electromechanical system includes a capacitor having first and second plates spaced from one another, the first and second plates having different work functions and being electrically connected with each other. The capacitor plates are movable with respect to one another such that a spacing between the plates changes in response to a force. A current through the capacitor represents a rate of change in the spacing between the plates at a given time. | 01-09-2014 |
20140028407 | Reconfigurable and Auto-Reconfigurable Resonant Clock - The present disclosure relates to a resonant clock system having a driver component, a clock load capacitor, and a reconfigurable inductor array. The driver component generates a driven input signal. The clock load capacitor is configured to receive the driven input signal. The inductor array is configured to have an effective inductance according to a selected frequency. The inductor array also generates a resonant signal at the selected frequency using the effective inductance. | 01-30-2014 |
20140038085 | Automatic Misalignment Balancing Scheme for Multi-Patterning Technology - Some aspects of the present disclosure provide for a method of automatically balancing mask misalignment for multiple patterning layers to minimize the consequences of mask misalignment. In some embodiments, the method defines a routing grid for one or more double patterning layers within an IC layout. The routing grid has a plurality of vertical grid lines extending along a first direction and a plurality of horizontal grid lines extending along a second, orthogonal direction. Alternating lines of the routing grid in a given direction (e.g., the horizontal and vertical direction) are assigned different colors. Shapes on the double patterning layers are then routed along the routing grid in a manner that alternates between different colored grid lines. By routing in such a manner, variations in capacitive coupling caused by mask misalignment are reduced. | 02-06-2014 |
20140049329 | DIVIDER-LESS PHASE LOCKED LOOP (PLL) - One or more techniques and systems for a divider-less phase locked loop (PLL) and associated phase detector (PD) are provided herein. In some embodiments, a pulse phase detector (pulse | 02-20-2014 |
20140055155 | Method and Apparatus for RFID Tag Testing - A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner. | 02-27-2014 |
20140077057 | 3D-STACKED BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MAKING THE SAME - A stacked image sensor and method for making the same are provided. The stacked image sensor includes an upper chip with a pixel array thereon. The second chip includes a plurality of column circuits and row circuits associated with the columns and rows of the pixel array and disposed in respective column circuit and row circuit regions that are arranged in multiple groups. Inter-chip bonding pads are formed on each of the chips. The inter-chip bonding pads on the second chip are arranged linearly and are contained within the column circuit regions and row circuit regions in one embodiment. In other embodiments, the inter-chip bonding pads are staggered with respect to each other. In some embodiments, the rows and columns of the pixel array include multiple signal lines and the corresponding column circuit regions and row circuit regions also include multiple inter-chip bonding pads. | 03-20-2014 |
20140111273 | INDUCTOR WITH CONDUCTIVE TRACE - Among other things, an inductor comprising a conductive trace and a method for forming the inductor are provided. The inductor comprises a magnetic structure, such as a ferrite core. A molding material, such as a dielectric, is formed around the magnetic structure. A conductive trace, comprising one or more conductive pillars interconnected by one or more upper interconnects and one or more lower interconnects, is formed around the magnetic structure to form the inductor. The conductive trace allows physical limitations associated with winding a wire to be avoided, and thus allows the inductor to be smaller than wire wound inductors. In one example, the inductor is formed within an integrated circuit package comprising an active device, such as an integrated circuit. In this way, the inductor can be connected to the integrated circuit within the integrated circuit package. | 04-24-2014 |
20140138520 | Dual-Side Illumination Image Sensor Chips and Methods for Forming the Same - A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction. | 05-22-2014 |
20140138521 | Dual-Side Illumination Image Sensor Chips and Methods for Forming the Same - A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction. | 05-22-2014 |
20140145749 | METHOD AND APPARATUS OF RFID TAG CONTACTLESS TESTING - A semiconductor wafer includes a plurality of dies. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit and a coil. The RFID tag circuit includes a tag core, an RF front-end circuit, an ID decoder, a comparator and conductive line for a unique ID. The RF front-end circuit is configured to receive electromagnetic signals through the coil in each of the plurality of dies and to convert the received electromagnetic signals into commands. The ID decoder is configured to receive the commands and to generate an expect ID. The comparator is configured to compare the unique ID with the expect ID to generate a comparison result. The comparison result is arranged to decide if the tag core is configured to receive commands. | 05-29-2014 |
20140184296 | MCML RETENTION FLIP-FLOP/LATCH FOR LOW POWER APPLICATIONS - The present disclosure relates to a device and method to reduce the dynamic/static power consumption of an MCML logic device. In order to retain register contents during power off mode, an MCML retention latch and flip-flop are disclosed. Retention Latch circuits in MCML architecture are used to retain critical register contents during power off mode, wherein combination logic including clock buffers on the clock tree paths are powered off to reduce dynamic/static power consumption. The MCML retention flip-flop comprises a master latch and a slave latch, wherein a power switch is added to the master latch to power the master latch off during power off mode. The slave latch includes pull-down circuits that remain active to enable the slave latch to retain data at a proper voltage level during power off mode. Other devices and methods are also disclosed. | 07-03-2014 |
20140217263 | IMAGE SENSOR CONFIGURED TO REDUCE BLOOMING DURING IDLE PERIOD - Among other things, techniques and systems are provided for identifying when a pixel of an image sensor is in an idle period. A flag is utilized to differentiate when the pixel is in an idle period and when the pixel is in an integration period. When the flag indicates that the pixel is in an idle period, a blooming operation is performed on the pixel to reduce an amount of electrical charge that has accumulated at the pixel or to mitigate electrical charge from accumulating at the pixel. In this way, the blooming operation reduces a probability that the photosensitive sensor becomes saturated during an idle period of the pixel, and thus reduces the likelihood of electrical charge from a pixel that is not intended contribute to an image from spilling over and potentially contaminating a pixel that is intended to contribute to the image. | 08-07-2014 |
20140256063 | CONTACTLESS COMMUNICATIONS USING FERROMAGNETIC MATERIAL - A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. | 09-11-2014 |
20140264628 | Multi-Gate and Complementary Varactors in FinFET Process - A varactor includes at least one semiconductor fin, a first gate, and a second gate physically disconnected from the first gate. The first gate and the second gate form a first FinFET and a second FinFET, respectively, with the at least one semiconductor fin. The source and drain regions of the first FinFET and the second FinFET are interconnected to form the varactor. | 09-18-2014 |
20140266344 | VARAINDUCTOR, VOLTAGE CONTROLLED OSCILLATOR INCLUDING THE VARAINDUCTOR, AND PHASE LOCKED LOOP INCLUDING THE VARAINDUCTOR - A varainductor including a signal line disposed over a substrate. The varainductor further includes a first ground plane over the substrate, the first ground plane disposed on a first side of the signal line, and a second ground plane over the substrate, the second ground plane disposed on a second side of the signal line opposite the first side of the signal line. The varainductor further includes a first floating plane over the substrate, the first floating plane disposed between the first ground plane and the signal line, and a second floating plane over the substrate, the second floating plane disposed between the second ground plane and the signal line. The varainductor further includes an array of switches, the array of switches is configured to selectively connect the first ground plane to the first floating plane, and to selectively connect the second ground plane to the second floating plane. | 09-18-2014 |
20140347110 | CAPACITIVE LOAD PLL WITH CALIBRATION LOOP - A circuit includes a capacitive-load voltage controlled oscillator having an input configured to receive a first input signal and an output configured to output an oscillating output signal. A calibration circuit is coupled to the voltage controlled oscillator and is configured to output one or more control signals to the capacitive-load voltage controlled oscillator for adjusting a frequency of the oscillating output signal. The calibration circuit is configured to output the one or more control signals in response to a comparison of an input voltage to at least one reference voltage. | 11-27-2014 |
20150020039 | CASCODE CMOS STRUCTURE - A MOS device includes an active area having first and second contacts. First and second gates are disposed between the first and second contacts. The first gate is disposed adjacent to the first contact and has a third contact. The second gate is disposed adjacent to the second contact and has a fourth contact coupled to the third contact. A transistor defined by the active area and the first gate has a first threshold voltage, and a transistor defined by the active area and the second gate has a second threshold voltage. | 01-15-2015 |
20150084158 | THREE DIMENSIONAL CIRCUIT INCLUDING SHIELDED INDUCTOR AND METHOD OF FORMING SAME - The three dimensional (3D) circuit includes a first tier including a semiconductor substrate, a second tier disposed adjacent to the first tier, a three dimensional inductor including an inductive element portion, the inductive element portion including a conductive via extending from the first tier to a dielectric layer of the second tier. The 3D circuit includes a ground shield surrounding at least a portion of the conductive via. In some embodiments, the ground shield includes a hollow cylindrical cage. In some embodiments, the 3D circuit is a low noise amplifier. | 03-26-2015 |