Patent application number | Description | Published |
20080311751 | Method for Etching a Layer on a Substrate - A method for etching a layer that is to be removed on a substrate, in which a Si | 12-18-2008 |
20090026561 | Micromechanical component and corresponding method for its manufacture - A micromechanical component having a conductive substrate, an elastically deflectable diaphragm including at least one conductive layer, which is provided over a front side of the substrate, the conductive layer being electrically insulated from the substrate, a hollow space, which is provided between the substrate and the diaphragm and is filled with a medium, and a plurality of perforation openings, which run under the diaphragm through the substrate, the perforation openings providing access to the hollow space from a back surface of the substrate, so that a volume of the medium located in the hollow space may change when the diaphragm is deflected. Also described is a corresponding manufacturing method. | 01-29-2009 |
20090171524 | Method and Device for Controlling a Drive Unit of a Vehicle - A method and a device for controlling a drive unit of a vehicle are provided in which, starting from the comparison of a first acceleration variable, which is calculated at least from the operating state of the drive unit, and a second acceleration variable, an error is detected. The second acceleration variable includes a first component, in the direction of the vehicle longitudinal axis, and a second component, perpendicular to the vehicle longitudinal axis. | 07-02-2009 |
20090200262 | Method for Producing Porous Microneedles and their Use - A method for producing porous microneedles ( | 08-13-2009 |
20090210111 | Method for Detecting the State of a Tire - A method for detecting the state of a vehicle tire and/or a roadway, in which at least one sensor, in particular an acceleration sensor, disposed in the tire interior generates a signal that is assigned to physical variables of the vehicle tire and/or the roadway. A tire state and/or characteristics of the roadway are/is determined on the basis of the signal. | 08-20-2009 |
20090236610 | Method for Manufacturing a Semiconductor Structure, and a Corresponding Semiconductor Structure - A method for manufacturing a semiconductor structure is provided which includes the following operations: supplying a crystalline semiconductor substrate, providing a porous region adjacent to a surface of the semiconductor substrate, introducing a dopant into the porous region from the surface, and thermally recrystallizing the porous region into a crystalline doping region of the semiconductor substrate whose doping type and/or doping concentration and/or doping distribution are/is different from those or that of the semiconductor substrate. A corresponding semiconductor structure is likewise provided. | 09-24-2009 |
20100007246 | Bending transducer device for generating electrical energy from deformations and circuit module - A bending transducer device for generating electrical energy includes at least one elastically deformable support structure, one piezoelectric element, and a bearing device. The piezoelectric element is configured and situated on the support structure in such a way that the piezoelectric element is deformable due to a deformation of the support structure caused by vibration, and the support structure is supported vibration-capably in at least one bearing of the bearing device, the bearing being configured as an articulated receptacle, e.g., a hinge. | 01-14-2010 |
20100009077 | Method for Treating a Material Having Nanoscale Pores - A method and a device for treating a material having nanoscale pores), especially implant material for the treatment of living cells, as provided. The method distinguished in that the surface tension of a substance ( | 01-14-2010 |
20100033060 | BENDING TRANSDUCER FOR GENERATING ELECTRICAL ENERGY FROM MECHANICAL DEFORMATIONS - A bending transducer device for generating electrical energy from deformations, and a circuit module which has such a bending transducer. The bending transducer includes at least one electrically deformable, vibration-capable, electrically conductive support structure, one piezoelectric element and a first contacting element, the conductive support structure having a first restraining area and a second restraining area for restraining the support structure, the piezoelectric element being designed and situated on the support structure in such a way that the piezoelectric element is deformable due to the deformation of the support structure caused by vibrations, and a first electrode for picking up the voltage generated by the deformation of the piezoelectric element is formed and contacted by the support structure, the first contacting element being connected electrically conductively to the support structure outside the first restraining area and the second restraining area. | 02-11-2010 |
20100035068 | Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type - A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material. | 02-11-2010 |
20100127339 | MICROMECHANICAL COMPONENT HAVING AN ANTI-ADHESIVE LAYER - A micromechanical component, having a substrate and a functional element, the functional element having a functional surface which has an anti-adhesion layer, that has been applied at least in regions, for reducing the surface adhesion forces, and in which the anti-adhesion layer is stable to a temperature of more than 800° C. | 05-27-2010 |
20100203739 | METHOD FOR ETCHING A LAYER ON A SILICON SEMICONDUCTOR SUBSTRATE - A method for selective etching of an SiGe mixed semiconductor layer on a silicon semiconductor substrate by dry chemical etching of the SiGe mixed semiconductor layer with the aid of an etching gas selected from the group including ClF | 08-12-2010 |
20110012248 | Method for producing a capping wafer for a sensor - A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material. | 01-20-2011 |
20110034873 | METHOD FOR MANUFACTURING A MICROPUMP AND MICROPUMP - A method for manufacturing a micropump, which may be for the metered delivery of insulin, multiple layers being situated on the front side of a first carrier layer, which has a front side and a rear side, and microfluidic functional elements being formed by structuring at least one of the layers. It is provided that the structuring of the at least one layer for manufacturing all microfluidic functional elements is exclusively performed by front side structuring. Furthermore, a micropump is disclosed. | 02-10-2011 |
20110137254 | Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite - A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips. | 06-09-2011 |
20110163398 | METHOD FOR MANUFACTURING SEPARATED MICROMECHANICAL COMPONENTS SITUATED ON A SILICON SUBSTRATE AND COMPONENTS MANUFACTURED THEREFROM - A method for manufacturing separated micromechanical components situated on a silicon substrate includes the following steps of a) providing separation trenches on the substrate via an anisotropic plasma deep etching method, b) irradiating the area of the silicon substrate which forms the base of the separation trenches using laser light, the silicon substrate being converted from a crystalline state into an at least partially amorphous state by the irradiation in this area, and c) inducing mechanical stresses in the substrate. In one specific embodiment, cavities are etched simultaneously with the etching of the separation trenches. The etching depths can be controlled via the RIE lag effect. | 07-07-2011 |
20110248604 | METHOD FOR MANUFACTURING AT LEAST ONE MECHANICAL-ELECTRICAL ENERGY CONVERSION SYSTEM, AND MECHANICAL-ELECTRICAL ENERGY CONVERSION SYSTEM - In a method for manufacturing at least one mechanical-electrical energy conversion system including multiple individual parts, and a mechanical-electrical energy conversion, multiple different individual parts are positioned in an assembly device and joined in joining areas assigned to the individual parts in the assembly device, the individual parts including at least one piezoelectric element, one support structure and one seismic mass. | 10-13-2011 |
20110281102 | METHOD FOR MANUFACTURING POROUS MICROSTRUCTURES, POROUS MICROSTRUCTURES MANUFACTURED ACCORDING TO THIS METHOD, AND THE USE THEREOF - A method for manufacturing porous microstructures in a silicon semiconductor substrate, porous microstructures manufactured according to this method, and the use thereof. | 11-17-2011 |
20110296906 | Piezoelectric Generator - A piezoelectric generator includes a piezoelectric element, a spring element, a mass element, and at least one stop. The piezoelectric element, the spring element, and the mass element form a system which can oscillate. The stop limits the oscillation of the system which can oscillate, at least on one side. The stop is formed from a ductile material or has a coating of a ductile material. | 12-08-2011 |
20110306930 | Hypodermic Needle - A hypodermic needle, particularly for injecting a pharmaceutical substance into a human or animal body is disclosed. The needle provides a simple way of improving long-term use in a human or animal body. The hypodermic needle includes a tubular hollow body having a needle tip for introducing the hypodermic needle into the human or animal body, wherein the hollow body has a rigidity which is reducible by the influence of heat and/or moisture. | 12-15-2011 |
20120018779 | METHOD FOR PRODUCING MICROMECHANICAL PATTERNS HAVING A RELIEF-LIKE SIDEWALL OUTLINE SHAPE OR AN ADJUSTABLE ANGLE OF INCLINATION - A method for producing micromechanical patterns having a relief-like sidewall outline shape or an angle of inclination that is able to be set, the micromechanical patterns being etched out of a SiGe mixed semiconductor layer that is present on or deposited on a silicon semiconductor substrate, by dry chemical etching of the SiGe mixed semiconductor layer; the sidewall outline shape of the micromechanical pattern being developed by varying the germanium proportion in the SiGe mixed semiconductor layer that is to be etched; a greater germanium proportion being present in regions that are to be etched more strongly; the variation in the germanium proportion in the SiGe mixed semiconductor layer being set by a method selected from the group including depositing a SiGe mixed semiconductor layer having varying germanium content, introducing germanium into a silicon semiconductor layer or a SiGe mixed semiconductor layer, introducing silicon into a germanium layer or an SiGe mixed semiconductor layer and/or by thermal oxidation of a SiGe mixed semiconductor layer. | 01-26-2012 |
20120057721 | COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE, AND METHOD FOR OPERATING SUCH A MICROPHONE COMPONENT - A concept is proposed for a MEMS microphone which may be operated at a relatively low voltage level and still have comparatively high sensitivity. The component according to the present invention includes a micromechanical microphone structure having an acoustically active diaphragm which functions as a deflectable electrode of a microphone capacitor ( | 03-08-2012 |
20120076339 | MICROPHONE COMPONENT AND METHOD FOR OPERATING SAME - A system and method are described for reducing the current consumption of a microphone component without adversely affecting performance. The system includes a micromechanical microphone capacitor, an acoustically inactive compensation capacitor, an arrangement for applying a high-frequency sampling signal to the microphone capacitor and for applying the inverted sampling signal to the compensation capacitor, an integrating operational amplifier which integrates the sum of the current flow through the microphone capacitor and the current flow through the compensation capacitor as a charge amplifier, a demodulator, which is synchronized with the sampling signal, for the output signal of the integrating operational amplifier, and a low-pass filter which uses the output signal of the demodulator to obtain a microphone signal that corresponds to the changes in capacitance of the microphone capacitor. The sampling signal is composed of a periodic sequence of sampling pulses and pause times. In addition, at least one first switching element is provided which reduces the current flow through the integrating operational amplifier during the pause times. The low-pass filter has a “sample-and-hold” characteristic so that during the pause times the low-pass filter in each case stores the output signal of the integrating operational amplifier averaged over the preceding sampling operation. | 03-29-2012 |
20120091544 | COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE, AND METHOD FOR ITS PRODUCTION - A component having a robust, but acoustically sensitive microphone structure is provided and a simple and cost-effective method for its production. This microphone structure includes an acoustically active diaphragm, which functions as deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counter element, which functions as counter electrode of the microphone capacitor, and an arrangement for detecting and analyzing the capacitance changes of the microphone capacitor. The diaphragm is realized in a diaphragm layer above the semiconductor substrate of the component and covers a sound opening in the substrate rear. The counter element is developed in a further layer above the diaphragm. This further layer generally extends across the entire component surface and compensates level differences, so that the entire component surface is largely planar according to this additional layer. This allows a foil to be applied on the layer configuration of the microphone structures exposed in the wafer composite, which makes it possible to dice up the components in a standard sawing process. | 04-19-2012 |
20120132925 | METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE, AND A CORRESPONDING SEMICONDUCTOR STRUCTURE - A method for manufacturing a semiconductor structure is provided which includes the following steps: a crystalline semiconductor substrate ( | 05-31-2012 |
20120319219 | EPITAXIAL SILICON CMOS-MEMS MICROPHONES AND METHOD FOR MANUFACTURING - A method of manufacturing a microphone using epitaxially grown silicon. A monolithic wafer structure is provided. A wafer surface of the structure includes poly-crystalline silicon in a first horizontal region and mono-crystalline silicon in a second horizontal region surrounding a perimeter of the first horizontal region. A hybrid silicon layer is epitaxially deposited on the wafer surface. Portions of the hybrid silicon layer that contact the poly-crystalline silicon use the poly-crystalline silicon as a seed material and portions that contact the mono-crystalline silicon use the mono-crystalline silicon as a seed material. As such, the hybrid silicon layer includes both mono-crystalline silicon and poly-crystalline silicon in the same layer of the same wafer structure. A CMOS/membrane layer is then deposited on top of the hybrid silicon layer. | 12-20-2012 |
20130061674 | METHOD FOR PRODUCING A CAPPING WAFER FOR A SENSOR - A method for producing a capping wafer for a sensor having at least one cap includes: production of a contacting via extending through the wafer, and, temporally subsequent thereto, filling of the contacting via with an electrically conductive material. | 03-14-2013 |
20130183170 | MICRO-DOSING PUMP AND METHOD FOR PRODUCING A MICRO-DOSING PUMP - A micro-dosing pump includes a pump chamber substrate, a flexible membrane, a fluid line, a valve disk, a magnetizable actuator disk, and a drive unit. The pump chamber substrate has a pump chamber. The flexible membrane is on a first side of the pump chamber substrate and covers the pump chamber in a fluid-tight manner. The fluid line is on a second side of the pump chamber substrate such that fluid can enter and leave the pump chamber. The valve disk, arranged inside the pump chamber, has a fluid through-opening and is configured to close the fluid line by rotating and to open it via the through-opening. The actuator disk is coupled to the valve disk such that rotating the actuator disk rotates the valve disk. The drive unit has a pump plunger configured to move the membrane for suction or ejection of fluid and to rotate the actuator disk. | 07-18-2013 |
20140077315 | ELECTRONIC SENSOR APPARATUS FOR DETECTING CHEMICAL OR BIOLOGICAL SPECIES, MICROFLUIDIC APPARATUS COMPRISING SUCH A SENSOR APPARATUS, AND METHOD FOR PRODUCING THE SENSOR APPARATUS AND METHOD FOR PRODUCING THE MICROFLUIDIC APPARATUS - An electronic sensor apparatus for detecting chemical or biological species includes a semiconductor chip, a sensor device, and a substrate. The chip is produced from a semiconductor substrate and is configured for one or more functions such as: amplifying and/or evaluating an electrical voltage, amplifying and/or evaluating an electric current, amplifying and/or evaluating an electrical charge, and amplifying and/or reading out capacitance changes. The sensor device has an active surface configured to detect chemical or biological species and generate an electrical signal based on a species-characteristic interaction with the active surface. The electrical signal can be an electrical voltage, an electric current, an electrical charge and/or a capacitance change. The substrate is produced from a melt-moldable material and has a surface including first and second regions. The chip is at least partly embedded in the first region, and the sensor device is at least partly embedded in the second region. | 03-20-2014 |
20140291558 | Normally Closed Valve for Microfluidic Components of a Polymeric Layer System and Method - A normally closed valve for microfluidic components includes a polymer substrate and a polymer membrane film arranged on the polymer substrate. The polymer substrate has a first chamber, a second chamber, and a fluidic barrier element configured to separate the first chamber from the second chamber. The first chamber is fluidically coupled to the second chamber by the polymer membrane film, and, in an initial configuration, a connection of the polymer membrane film to the fluidic barrier element prevents a fluidic communication of the first chamber to the second chamber. The first chamber is at least partially filled with a substance in the initial configuration, and a transfer of the substance from the first chamber into the second chamber takes place by applying a pressure to the substance. The pressure is chosen to be great enough to disconnect the connection of the polymer membrane film to the fluidic barrier element. | 10-02-2014 |
20140291786 | component having a micromechanical microphone structure - Substrate-side overload protection for the diaphragm structure of a microphone component having a micromechanical microphone structure which impairs the damping properties of the microphone structure as little as possible, in which the microphone structure includes a diaphragm structure having at least one acoustically active diaphragm which is formed in a diaphragm layer above a semiconductor substrate. The diaphragm structure spans at least one sound opening in the rear side of the substrate. A stationary, acoustically permeable counter element is formed in the layer structure of the component above the diaphragm layer. According to the invention, at least projections are formed at the outer edge area of the diaphragm structure which protrude beyond the edge area of the sound opening, so that the edge area of the sound opening acts as a substrate-side stop for the diaphragm structure. | 10-02-2014 |
20140322100 | Method and Device for Producing a Microfluidic Analysis Cartridge - A method for producing a pneumatically actuatable microfluidic analysis cartridge includes closing a joining side of a fluidic part of the analysis cartridge with a first fluid-tight elastic membrane and/or closing a joining side of a pneumatic part of the analysis cartridge with a second membrane. The fluidic part is configured to perform fluidic basic operations of a biochemical analysis process, and the pneumatic part is configured to control the basic operations using air pressure. The joining side of the fluidic part and the joining side of the pneumatic part are aligned, and the fluidic part and the pneumatic part are connected to form the analysis cartridge. | 10-30-2014 |
20150035094 | MICROPHONE ASSEMBLY HAVING AT LEAST TWO MEMS MICROPHONE COMPONENTS - A microphone assembly includes two MEMS components each having a micromechanical microphone structure, each microphone structure having: a diaphragm configured to be deflected by sound pressure and provided with at least one diaphragm electrode of a capacitor system; and a stationary acoustically permeable counter-element that acts as bearer for at least one counter-electrode of the capacitor system. The microphone assembly is configured such that under the action of sound the spacing between the diaphragm and the counter-element of the two microphone structures changes in opposite directions. | 02-05-2015 |