Patent application number | Description | Published |
20090186584 | TECHNIQUE FOR LOW-POWER OPERATION OF A WIRELESS DEVICE - Embodiments of a circuit are described. In this circuit, a receiver includes at least one input node that receives one or more signals from one or more antenna elements. Note that a given signal from a given antenna element may have an associated fixed bandwidth and/or may include directional information corresponding to a region in a space. Moreover, the receiver includes a measurement circuit, coupled to at least the one input node, that determines whether a metric of the given signal exceeds a corresponding threshold. Additionally, control logic in the circuit, which is coupled to the measurement circuit, instructs a communication circuit in the circuit to exit a first power-consumption mode if the metric of at least one of the signals exceeds the corresponding threshold. | 07-23-2009 |
20100058100 | DRIFT TRACKING FEEDBACK FOR COMMUNICATION CHANNELS - A communication channel includes a first component having a transmitter coupled to a normal signal source, and a second component having a receiver coupled to a normal signal destination. A communication link couples the first and second components. Calibration logic provides for setting an operation value for a parameter of the communication channel, such as by executing an exhaustive calibration sequence at initialization of the link. A tracking circuit, including a monitoring function, tracks drift in the parameter by monitoring a feedback signal that has a characteristic that correlates with drift in the communication channel, and updates, or indicates the need for updating of, the operation value of the parameter in response to the monitoring function. | 03-04-2010 |
20100073047 | Apparatus for Data Recovery in a Synchronous Chip-to-Chip System - An apparatus that reduces sampling errors for data communicated between devices uses phase information acquired from a timing reference signal such as a strobe signal to align a data-sampling signal for sampling a data signal that was sent along with the timing reference signal. The data-sampling signal may be provided by adjustably delaying a clock signal according to the phase information acquired from the strobe signal. The data-sampling signal may also have an improved waveform compared to the timing reference signal, including a fifty percent duty cycle and sharp transitions. The phase information acquired from the timing reference signal may also be used for other purposes, such as aligning received data with a local clock domain, or transmitting data so that it arrives at a remote device in synchronism with a reference clock signal at the remote device. | 03-25-2010 |
20100078809 | Semiconductor Module with Micro-Buffers - The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die. | 04-01-2010 |
20100240327 | ANTENNA ARRAY WITH FLEXIBLE INTERCONNECT FOR A MOBILE WIRELESS DEVICE - An antenna array can be mounted on a flexible substrate and connected by a flexible interconnect to an integrated circuit such as a radio frequency front end. The antenna array can be mounted in a device housing that includes radio frequency interference (RFI) shielding. The antenna array is aligned with and next to an area of the housing that is not shielded against RFI. | 09-23-2010 |
20110005090 | DISPLACEMENT SENSING USING A FLEXIBLE SUBSTRATE - Angular displacement of a flexible substrate is determined based on an electrical change of a mm-wave circuit associated with the flexible substrate. This electrical change may relate to, for example, one or more of a phase shift, an amplitude shift, a frequency shift, or a pulse shift. In some implementations the flexible substrate may include conductors on multiple layers whereby an angular displacement of the flexible substrate causes a relative displacement between conductors of different layers, thereby inducing the electrical change of the mm-wave circuit. | 01-13-2011 |
20110119425 | DETACHABLE INTERCONNECT FOR CONFIGURABLE WIDTH MEMORY SYSTEM - The disclosure relates to a detachable signalling interconnect apparatus that provides connectivity between two or more components of a memory system in conjunction with different modes of operation of the components. The memory system comprises: a first socket to receive a first memory module; a second socket to receive a second memory module; a detachable signal-interconnect; and a memory controller coupled to the detachable signal-interconnect and configured to define a first mode of operation and a second mode of operation, wherein in the first mode of operation the detachable signal-interconnect is to couple the memory-controller to the first memory module and in the second mode of operation the detachable signal-interconnect is to couple the memory controller to the first memory module and the second memory module. | 05-19-2011 |
20110255615 | Apparatus for Data Recovery in a Synchronous Chip-to-Chip System - An apparatus that reduces sampling errors for data communicated between devices uses phase information acquired from a timing reference signal such as a strobe signal to align a data-sampling signal for sampling a data signal that was sent along with the timing reference signal. The data-sampling signal may be provided by adjustably delaying a clock signal according to the phase information acquired from the strobe signal. The data-sampling signal may also have an improved waveform compared to the timing reference signal, including a fifty percent duty cycle and sharp transitions. The phase information acquired from the timing reference signal may also be used for other purposes, such as aligning received data with a local clock domain, or transmitting data so that it arrives at a remote device in synchronism with a reference clock signal at the remote device. | 10-20-2011 |
20120181704 | SEMICONDUCTOR MODULE WITH MICRO-BUFFERS - The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die. | 07-19-2012 |
20130082374 | STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE - A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each having terminals mounted to the respective panel contacts. Each package can include a microelectronic element having a face and contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The terminals can include first terminals at positions within first and second parallel grids. The first terminals can be configured to carry address information usable by circuitry within the package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic element. Signal assignments of the first terminals in the first grid can be a mirror image of signal assignments of the first terminals in the second grid. | 04-04-2013 |
20130082375 | STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE - A system or microelectronic assembly can include one or more microelectronic packages each having a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region. | 04-04-2013 |
20130082381 | STUB MINIMIZATION USING DUPLICATE SETS OF TERMINALS FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and second parallel grids of the package. The first terminals of each grid are configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid. | 04-04-2013 |
20130082389 | STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE - A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region. | 04-04-2013 |
20130082390 | STUB MINIMIZATION USING DUPLICATE SETS OF TERMINALS FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid. | 04-04-2013 |
20130082391 | STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to the panel contacts at the first and second surfaces, respectively. The circuit panel can electrically interconnect terminals of the first package with corresponding terminals of the second package. Each package can include a substrate having first and second surfaces, a microelectronic element, conductive structure extending above a front face of the microelectronic element, and parallel columns of terminals at the second surface. The terminals of each package can include first terminals in a central region of the respective second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location within the respective microelectronic element. Each central region can have a width within three and one-half times a minimum pitch between adjacent terminals. | 04-04-2013 |
20130082396 | STUB MINIMIZATION USING DUPLICATE SETS OF TERMINALS FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and second parallel grids of the package. The first terminals of each grid are configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid. | 04-04-2013 |
20130082397 | STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. The microelectronic element can include stacked electrically interconnected semiconductor chips. Edges of the microelectronic element can define an axial plane extending in the first direction and a third direction normal to the rear face. The package can include columns of terminals extending in the first direction at a second surface of the substrate. The terminals can include first terminals exposed in a central region of the second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location. The central region may have a width not more than 3.5 times a minimum pitch between adjacent terminal columns. The axial plane can intersect the central region. | 04-04-2013 |
20130082398 | STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. Edges of the microelectronic element can define an axial plane extending in the first direction and a third direction normal to the rear face. The package can include columns of terminals extending in the first direction at a second surface of the substrate. The terminals can include first terminals exposed in a central region of the second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between any two adjacent columns of the terminals. The axial plane can intersect the central region. | 04-04-2013 |
20130083582 | STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE - A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region. | 04-04-2013 |
20130083583 | STUB MINIMIZATION FOR MULTI-DIE WIREBOND ASSEMBLIES WITH PARALLEL WINDOWS - A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The central region of the second surface can be disposed between the first and second axes. The terminals can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements. | 04-04-2013 |
20130127062 | MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE - A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region. | 05-23-2013 |
20130286707 | STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS - A microelectronic structure has active elements defining a storage array, and address inputs for receipt of address information specifying locations within the storage array. The structure has a first surface and can have terminals exposed at the first surface. The terminals may include first terminals and the structure may be configured to transfer address information received at the first terminals to the address inputs. Each first terminal can have a signal assignment which includes one or more of the address inputs. The first terminals are disposed on first and second opposite sides of a theoretical plane normal to the first surface, wherein the signal assignments of the first terminals disposed on the first side are a mirror image of the signal assignments of the first terminals disposed on the second side of the theoretical plane. | 10-31-2013 |
20130313721 | Semiconductor Module with Micro-Buffers - The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die. | 11-28-2013 |
20140103535 | STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE - A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region. | 04-17-2014 |
20140167278 | STUB MINIMIZATION USING DUPLICATE SETS OF TERMINALS FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid. | 06-19-2014 |
20140167279 | STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE - A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each having terminals mounted to the respective panel contacts. Each package can include a microelectronic element having a face and contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The terminals can include first terminals at positions within first and second parallel grids. The first terminals can be configured to carry address information usable by circuitry within the package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic element. Signal assignments of the first terminals in the first grid can be a mirror image of signal assignments of the first terminals in the second grid. | 06-19-2014 |
20140185354 | STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS - A microelectronic structure has active elements defining a storage array, and address inputs for receipt of address information specifying locations within the storage array. The structure has a first surface and can have terminals exposed at the first surface. The terminals may include first terminals and the structure may be configured to transfer address information received at the first terminals to the address inputs. Each first terminal can have a signal assignment which includes one or more of the address inputs. The first terminals are disposed on first and second opposite sides of a theoretical plane normal to the first surface, wherein the signal assignments of the first terminals disposed on the first side are a mirror image of the signal assignments of the first terminals disposed on the second side of the theoretical plane. | 07-03-2014 |
20140185725 | DRIFT TRACKING FEEDBACK FOR COMMUNICATION CHANNELS - A communication channel includes a first component having a transmitter coupled to a normal signal source, and a second component having a receiver coupled to a normal signal destination. A communication link couples the first and second components. Calibration logic provides for setting an operation value for a parameter of the communication channel, such as by executing an exhaustive calibration sequence at initialization of the link. A tracking circuit, including a monitoring function, tracks drift in the parameter by monitoring a feedback signal that has a characteristic that correlates with drift in the communication channel, and updates, or indicates the need for updating of, the operation value of the parameter in response to the monitoring function. | 07-03-2014 |
20140328015 | STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic assembly ( | 11-06-2014 |
20140328016 | STUB MINIMIZATION FOR MULTI-DIE WIREBOND ASSEMBLIES WITH PARALLEL WINDOWS - A microelectronic assembly | 11-06-2014 |