Patent application number | Description | Published |
20110009255 | BORON-SILICON-CARBON CERAMIC MATERIALS AND METHOD OF MAKING - A reaction bonded ceramic body that has 50% to 60%, by weight, boron carbide, and 20% to 30%, by weight, silicon carbide. The reaction bonded ceramic body has least a portion of the boron carbide reacted with silicon to become siliconized boron carbide. Also, a method of making a reaction bonded ceramic material. The method may include the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder, and contacting the green body with a liquid infiltrant comprising silicon. The infiltrant has a temperature of about 1625° C. to about 1700° C. Furthermore, a method of making a reaction bonded boron carbide ceramic body. The method includes the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder. The weight ratio of boron carbide to carbon in the green body may be about 5:5 to 1 or more. The method also includes siliconizing a first portion of the boron carbide to siliconized boron carbide by contacting the green body with a molten silicon infiltrant, where the infiltrant has a temperature of about 1625° C. to about 1700° C. The method may further include dissolving a second portion of the boron carbide in the silicon infiltrant, where at least some of the dissolved boron carbide is reprecipated as smooth particulates. | 01-13-2011 |
20130115418 | MULTILAYER RARE-EARTH OXIDE COATINGS AND METHODS OF MAKING - Embodiments relate to a coated substrate and a method of making and using the same. A plasma-spray coated layer may be formed on a substrate, wherein the plasma-sprayed coated layer comprises a rare-earth oxide (e.g., yttrium oxide), a rare-earth fluoride (e.g. yttrium fluoride), or a rare-earth silicate (e.g. yttrium silicate). An exposed surface of the plasma-spray coated layer may be irradiated to form a treated portion of the layer, wherein the treated portion of the layer has a mean spacing of local peaks (S value) between about 100 and 200 microns. A second layer may be formed on the treated portion of the plasma-spray coated layer, wherein the second layer comprises a dielectric material. | 05-09-2013 |
20130168905 | BORON-SILICON-CARBON CERAMIC MATERIALS AND METHOD OF MAKING - A reaction bonded ceramic body that has 50% to 60%, by weight, boron carbide, and 20% to 30%, by weight, silicon carbide. The reaction bonded ceramic body has least a portion of the boron carbide reacted with silicon to become siliconized boron carbide. Also, a method of making a reaction bonded ceramic material. The method may include the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder, and contacting the green body with a liquid infiltrant comprising silicon. The infiltrant has a temperature of about 1625° C. to about 1700° C. Furthermore, a method of making a reaction bonded boron carbide ceramic body. The method includes the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder. The weight ratio of boron carbide to carbon in the green body may be about 5:5 to 1 or more. The method also includes siliconizing a first portion of the boron carbide to siliconized boron carbide by contacting the green body with a molten silicon infiltrant, where the infiltrant has a temperature of about 1625° C. to about 1700° C. The method may further include dissolving a second portion of the boron carbide in the silicon infiltrant, where at least some of the dissolved boron carbide is reprecipated as smooth particulates. | 07-04-2013 |
Patent application number | Description | Published |
20080268584 | ELECTRONIC DEVICES AND METHODS FOR FORMING THE SAME - Methods for forming electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the method may include applying materials to a flexible substrate to form the electronic device. At least some of the materials applied to the flexible substrate may be applied using a printing apparatus. The substrate may be annealed when at least some of the materials are present on the flexible substrate. The resulting electronic device may have a high charge carrier mobility in the range from about 10 cm | 10-30-2008 |
20090153616 | Low Profile Printhead - An inkjet printhead having a housing having a top face and a bottom face, an ink ejection device and a contact circuit. The contact circuit is affixed to the housing in a substantially horizontal orientation and is in communication with the ink ejection device. The contact circuit is configured to connect the ink ejection device to an external device. | 06-18-2009 |
20100213165 | LOW EJECTION ENERGY MICRO-FLUID EJECTION HEADS - A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors. | 08-26-2010 |
20100285411 | MICRO-FLUID EJECTION DEVICES WITH A POLYMERIC LAYER HAVING AN EMBEDDED CONDUCTIVE MATERIAL - Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material. | 11-11-2010 |
20120236076 | PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS - Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead. | 09-20-2012 |
20120320130 | FLUID EJECTION DEVICE AND METHOD FOR FABRICATING FLUID EJECTION DEVICE - Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles. Further, the fluid ejection device includes a flow feature layer. The flow feature layer includes a plurality of flow features. The fluid ejection device further includes an ejection unit. The ejection unit includes a first layer. The first layer includes a plurality of fluid vias. Further, the ejection unit includes a second layer. The second layer includes a plurality of fluid channels. Further, the second layer is attached to the first layer through a first intermediate silicon oxide layer. The ejection unit also includes a third layer. The third layer includes a plurality of ports. The third layer is also attached to the second layer through a second intermediate silicon oxide layer. Further disclosed are an ejection unit for a fluid ejection device and a method for fabricating the fluid ejection device. | 12-20-2012 |
Patent application number | Description | Published |
20080267708 | APPARATUS AND METHOD FOR IMPROVING CONTROL OF A CONCRETE SCREED HEAD ASSEMBLY - A soft landing control system for a screeding device is operable to automatically lower a vibrating member relative to a grade setting device after the grade setting device is lowered to the desired grade. The control may be operable to delay lowering the vibrating member relative to the grade setting device at least until the control receives an input indicative of at least a portion of the screed head assembly being moved to a position generally over a newly placed concrete area. Optionally, the control may delay lowering of the vibrating member relative to the grade setting device until a period of time has elapsed after an activating event. Optionally, the control may automatically stop vibration of the vibrating member when the screed head assembly is not moving in the screeding direction and may automatically vibrate the vibrating member when the screed head assembly moves in the screeding direction. | 10-30-2008 |
20100172695 | APPARATUS AND METHOD FOR IMPROVING THE CONROL OF A CONCRETE SCREED HEAD ASSEMBLY - A soft landing control system for a screeding device is operable to automatically lower a vibrating member relative to a grade setting device after the grade setting device is lowered to the desired grade. The control may be operable to delay lowering the vibrating member relative to the grade setting device at least until the control receives an input indicative of at least a portion of the screed head assembly being moved to a position generally over a newly placed concrete area. | 07-08-2010 |
20100196096 | APPARATUS AND METHOD FOR IMPROVING THE CONTROL OF A CONCRETE SCREEDING MACHINE - A screeding machine including at least one of (a) a boom speed cruise control for automatically controlling the travel speed of the screed head assembly, (b) an auto-stabilizer control that automatically adjusts the stabilizer actuators of the screeding machine to a preselected degree of extension, (c) a control for automatically controlling the lowering of the screed head assembly toward and to the concrete surface and automatically activating the auger and vibrator at a beginning of each screeding pass and automatically deactivating the auger and vibrator in response to the screed head assembly being raised away from the concrete surface at the end of a screed pass, and (d) an auto-screed mode that allows the operator to select maximum values for at least one of a boom extension speed, a boom retraction speed, a boom rotation speed and a screed head rotation speed. | 08-05-2010 |