| Patent application number | Description | Published |
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| 20080217050 | MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC - A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures. | 09-11-2008 |
| 20080244902 | Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same - A circuitized substrate assembly comprised of at least two circuitized substrates each including a thin dielectric layer and a conductive layer with a plurality of conductive members as part thereof, the conductive members of each substrate being electrically coupled to the conductive sites of a semiconductor chip. A dielectric layer is positioned between both substrates and the substrates are bonded together, such that the chips are internally located within the assembly and oriented in a stacked orientation. A method of making such an assembly is also provided, as is an electrical assembly utilizing same and an information handling system adapted for having such an electrical assembly as part thereof. | 10-09-2008 |
| 20080248596 | Method of making a circuitized substrate having at least one capacitor therein - A method of making a circuitized substrate which includes at least one and possibly several capacitors as part thereof. In one embodiment, the substrate is produced by forming a layer of capacitive dielectric material on a dielectric layer and thereafter forming channels with the capacitive material, e.g., using a laser. The channels are then filled with conductive material, e.g., copper, using selected deposition techniques, e.g., sputtering, electro-less plating and electroplating. A second dielectric layer is then formed atop the capacitor and a capacitor “core” results. This “core” may then be combined with other dielectric and conductive layers to form a larger, multilayered PCB or chip carrier. In an alternative approach, the capacitive dielectric material may be photo-imageable, with the channels being formed using conventional exposure and development processing known in the art. In still another embodiment, at least two spaced-apart conductors may be formed within a metal layer deposited on a dielectric layer, these conductors defining a channel there-between. The capacitive dielectric material may then be deposited (e.g., using lamination) within the channels. | 10-09-2008 |
| 20090109624 | Circuitized substrate with internal cooling structure and electrical assembly utilizing same - An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided. | 04-30-2009 |
| 20090206051 | Capacitive substrate and method of making same - A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation. | 08-20-2009 |
| 20100218891 | MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC - A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures. | 09-02-2010 |
| 20110126408 | Method of making high density interposer and electronic package utilizing same - A method of making an electronic package designed for interconnecting high density patterns of conductors of an electronic device (e.g., semiconductor chip) and less dense patterns of conductors of hosting circuitized substrates (e.g., chip carriers, PCBs). In one embodiment, the method includes bonding a chip to a single dielectric layer, forming a high density pattern of conductors on one surface of the layer, forming openings in the layer and then depositing metallurgy to form a desired circuit pattern which is then adapted for engaging and being electrically coupled to a corresponding pattern on yet another hosting substrate. According to another embodiment of the invention, an electronic package using a dual layered interposer is provided. Also provided are methods of making circuitized substrate assemblies using the electronic packages made using the invention's teachings. | 06-02-2011 |
| 20110127664 | Electronic package including high density interposer and circuitized substrate assembly utilizing same - An electronic package for interconnecting a high density pattern of conductors of an electronic device (e.g., semiconductor chip) of the package and a less dense pattern of conductors on a circuitized substrate (e.g., PCB), the package including in one embodiment but a single thin dielectric layer (e.g., Kapton) with a high density pattern of openings therein and a circuit pattern on an opposing surface which includes both a high density pattern of conductors and a less dense pattern of conductors. Conductive members are positioned in the openings to electrically interconnect conductors of the electronic device to conductors of the circuitized substrate when the package is positioned thereon. In another embodiment, the interposer includes a second dielectric layer bonded to the first, with conductive members extending through the second layer to connect to the less dense pattern of circuitized substrate conductors. Circuitized substrate assemblies using the electronic packages of the invention are also provided. | 06-02-2011 |
| 20110260299 | METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLYMER DIELECTRIC LAYERS - A semiconductor printed circuit board assembly (PCBA) and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of dielectric substrate placed on the core layer. A second layer of dielectric substrate is placed on the lower surface of the core layer of CIC. The layers are laminated together. Blind vias are laser drilled into the layers of dielectric substrate. The partially completed PCBA is subjected to a reactive ion etch (RIE) plasma as a first step to clean blind vias in the PCBA. After the plasma etch, an acidic etchant liquid solution is used on the blind vias. Pre-plating cleaning of blind vias removes a majority of oxides from the blind vias. Seed copper layers are then applied to the PCBA, followed by a layer of copper plating that can be etched to meet the requirements of the PCBA. | 10-27-2011 |
| 20120015532 | HIGH DENSITY DECAL AND METHOD FOR ATTACHING SAME - A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal. | 01-19-2012 |
| 20120031649 | CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging. | 02-09-2012 |
| 20120112345 | HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE - A high bandwidth semiconductor printed circuit board assembly (PCBA) providing a layer of dielectric substrate containing plated vias with an upper and lower surface plated with etched copper, mated with a second layer of etched copper plated dielectric containing plated vias that is placed on the top surface of the first layer. A third layer of etched copper plated dielectric containing plated vias may be placed on the bottom layer of etched copper foil. A base layer of etched copper plated thick dielectric containing plated vias is laminated simultaneously with the preceding layers to provide the high bandwidth digital and RF section of the assembly. | 05-10-2012 |
| 20120160544 | CORELESS LAYER BUILDUP STRUCTURE WITH LGA - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging. | 06-28-2012 |
| 20120160547 | CORELESS LAYER BUILDUP STRUCTURE - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. | 06-28-2012 |
| 20120162928 | ELECTRONIC PACKAGE AND METHOD OF MAKING SAME - An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates and also including an opening therein in which is positioned at least one electrical component, such as a semiconductor chip, coupled to the lower or base substrate. A second component may also be mounted on and electrically coupled to the upper surface of the top or cover circuitized substrate. A method of making such a package is also provided. | 06-28-2012 |
| 20120201006 | ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME - An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package. | 08-09-2012 |
| 20120223047 | METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE - Methods of forming embedded, multilayer capacitors in printed circuit boards wherein copper or other electrically conductive channels are formed on a dielectric substrate. The channels may be preformed using etching or deposition techniques. A photoimageable dielectric is an upper surface of the laminate. Exposing and etching the photoimageable dielectric exposes the space between the copper traces. These spaces are then filled with a capacitor material. Finally, copper is either laminated or deposited atop the structure. This upper copper layer is then etched to provide electrical interconnections to the capacitor elements. Traces may be formed to a height to meet a plane defining the upper surface of the dielectric substrate or thin traces may be formed on the remaining dielectric surface and a secondary copper plating process is utilized to raise the height of the traces. | 09-06-2012 |
| 20120243155 | CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND INFORMATION HANDLING SYSTEM UTILIZING SAME - A method of forming a circuitized substrate utilizing a conductive nub structure for enhanced interconnection integrity by using a joining core layer with copper outer layer on it, and forming thru-holes in the joining layer. Placing conductive adhesive in the thru-hole prior to removing the copper outer layers from the joining core layer creates an adhesive bump on joining core layer that engages a conductive secondary metal nub placed on the circuitized substrate-to-joining layer contact points, thus creating an enhanced connection between the layers. | 09-27-2012 |
| 20120260063 | MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM - A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time. | 10-11-2012 |
| 20130033671 | LIQUID CRYSTAL POLYMER (LCP) SURFACE LAYER ADHESION ENHANCEMENT - A method of conditioning a liquid crystal polymer (LCP) substrate for enhanced surface adhesion accomplished by exposing an LCP substrate to oxygen plasma. The plasma will chemically alter and modify the LCP substrate surface to promote increased adhesion of metal and subsequent LCP layers during lamination. Lamination is accomplished while dwelling under the melt temperature of the LCP substrate itself. A further method is disclosed of detecting impurities modified or deposited onto the LCP surface during plasma treatment. | 02-07-2013 |
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| 20110274490 | METHOD AND COMPOSITION FOR ROAD CONSTRUCTION AND SURFACING - Methods and compositions for improving the strength and longevity of secondary roadways through environmentally sound practices are disclosed herein. A composition for road sealing includes an aqueous emulsion of acrylic and vinyl acetate polymer, water, and a resin-modified emulsion, wherein the resin-modified emulsion includes a mixture of pitch and rosin, an emulsifying agent, and water. | 11-10-2011 |
| 20120129983 | METHOD AND COMPOSITION FOR ROAD CONSTRUCTION AND SURFACING - Methods and compositions for improving the strength and longevity of secondary roadways through environmentally sound practices are disclosed herein. A composition for road sealing includes an aqueous emulsion of acrylic and vinyl acetate polymer, water, and a resin-modified emulsion, wherein the resin-modified emulsion includes a mixture of pitch and rosin, an emulsifying agent, and water. | 05-24-2012 |
| 20120129984 | METHOD AND COMPOSITION FOR ROAD CONSTRUCTION AND SURFACING - Methods and compositions for improving the strength and longevity of secondary roadways through environmentally sound practices are disclosed herein. A composition for road sealing includes an aqueous emulsion of acrylic and vinyl acetate polymer, water, and a resin-modified emulsion, wherein the resin-modified emulsion includes a mixture of pitch and rosin, an emulsifying agent, and water. | 05-24-2012 |
| 20130197128 | METHOD AND COMPOSITION FOR ROAD CONSTRUCTION AND SURFACING - Methods and compositions for improving the strength and longevity of secondary roadways through environmentally sound practices are disclosed herein. A composition for road sealing includes an aqueous emulsion of acrylic and vinyl acetate polymer, water, and a resin-modified emulsion, wherein the resin-modified emulsion includes a mixture of pitch and rosin, an emulsifying agent, and water. | 08-01-2013 |
| 20140186117 | METHOD AND COMPOSITION FOR ROAD CONSTRUCTION AND SURFACING - Methods and compositions for improving the strength and longevity of secondary roadways through environmentally sound practices are disclosed herein. A composition for road sealing includes acrylic and vinyl acetate powdered polymer mixed with native soil. | 07-03-2014 |
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| 20120134527 | HAZARD DETECTION FOR ASSET MANAGEMENT - An approach that detects locations of hazardous conditions within an infrastructure is provided. This approach uses satellite imagery, GIS data, automatic image processing, and predictive modeling to determine the location of the hazards automatically, thus optimizing infrastructure management. Specifically, a hazard detection tool provides this capability. The hazard detection tool comprises a detection component configured to: receive visual media containing asset location data about a set of physical assets, and hazard location data about potential hazards within a vicinity of each of the set of physical assets. The detection component further receives graphical information system (GIS) data containing asset location data about each of the set of physical assets. The hazard detection tool further comprises an analysis component configured to: analyze the visual media to determine if a hazardous condition exists for each of the set of physical assets; and apply the GIS data to the visual media to determine a location of hazardous conditions within the infrastructure. | 05-31-2012 |
| 20120173300 | INFRASTRUCTURE ASSET MANAGEMENT - An approach for infrastructure asset management is provided. This approach comprises an end-to-end analytics driven maintenance approach that can take data about physical assets and additional external data, and apply advanced analytics to the data to generate business insight, foresight and planning information. Specifically, this approach uses a maintenance analysis tool, which is configured to: receive data about a set of physical assets of an infrastructure, and analyze the data about the set of physical assets to predict maintenance requirements for each of the set of physical assets. The maintenance analysis tool further comprises an output component configured to generate a maintenance plan based on the predicted maintenance requirements for each of the set of physical assets. | 07-05-2012 |
| 20140236650 | INFRASTRUCTURE ASSET MANAGEMENT - An approach for infrastructure asset management is provided. This approach comprises an end-to-end analytics driven maintenance approach that can take data about physical assets and additional external data, and apply advanced analytics to the data to generate business insight, foresight and planning information. Specifically, this approach uses a maintenance analysis tool, which is configured to: receive data about a set of physical assets of an infrastructure, and analyze the data about the set of physical assets to predict maintenance requirements for each of the set of physical assets. The maintenance analysis tool further comprises an output component configured to generate a maintenance plan based on the predicted maintenance requirements for each of the set of physical assets. | 08-21-2014 |
| 20150015606 | HAZARD DETECTION FOR ASSET MANAGEMENT - An approach that detects locations of hazardous conditions within an infrastructure is provided. This approach uses satellite imagery, GIS data, automatic image processing, and predictive modeling to determine the location of the hazards automatically, thus optimizing infrastructure management. Specifically, a hazard detection tool provides this capability. The hazard detection tool comprises a detection component configured to: receive visual media containing asset location data about a set of physical assets, and hazard location data about potential hazards within a vicinity of each of the set of physical assets. The detection component further receives graphical information system (GIS) data containing asset location data about each of the set of physical assets. The hazard detection tool further comprises an analysis component configured to: analyze the visual media to determine if a hazardous condition exists for each of the set of physical assets; and apply the GIS data to the visual media to determine a location of hazardous conditions within the infrastructure. | 01-15-2015 |
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| 20110011808 | SOLAR WATER PASTEURIZER - In accordance with the present invention, there are provided solar water pasteurizers that are portable, efficient, inexpensive and easy to use. In its simplest form, the solar pasteurizer includes a transparent container such as a bag or envelope that contains at least one energy converting structure and has sufficient insulation to enable heating water to a temperature of at least 60° C. for a time sufficient to achieve pasteurization (typically a period of about one hour at this temperature), and preferably to a temperature of at least 70° C. (at which temperature, a period of only about 6 minutes is required for pasteurization). Invention solar pasteurizers are particularly useful for pasteurizing water. In additional embodiments, invention solar pasteurizers include additional features, such as, for example, a water pasteurization indicator. In accordance with another embodiment of the invention, there are provided methods for pasteurizing water employing solar pasteurizers described herein, as well as kits suitable to convert any transparent water tight container into a solar water pasteurizer. | 01-20-2011 |
| 20120279927 | SOLAR WATER PASTEURIZER - In accordance with the present invention, there are provided solar water pasteurizers that are portable, efficient, inexpensive and easy to use. In its simplest form, the solar pasteurizer includes a transparent container such as a bag or envelope that contains at least one energy converting structure and has sufficient insulation to enable heating water to a temperature of at least 65° C. (and preferably to a temperature of at least 70° C.) for a time sufficient to achieve pasteurization (at 65-70° C., a period of only about 6 minutes is required for pasteurization). Invention solar pasteurizers are particularly useful for pasteurizing water. In additional embodiments, invention solar pasteurizers include additional features, such as, for example, a water pasteurization indicator, and a receptacle for retaining same within the invention container. In accordance with another embodiment of the invention, there are provided methods for pasteurizing water employing solar pasteurizers described herein, as well as kits suitable to convert any transparent water tight container into a solar water pasteurizer. | 11-08-2012 |
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| 20120002503 | Seismic Acquisition in Marine Environments Using Survey Paths Following a Series of Linked Deviated Paths and Methods of Use - Methods and systems are provided for acquiring seismic data in a marine environment using survey paths following a series of linked curved paths so as to obtain multi-azimuthal data over a sub-surface target. Marine vessels towing multiple seismic streamers may be configured to travel substantially along a series of linked deviated paths or a series of linked curved paths. Sources may be excited to introduce acoustic wave energy in the marine environment and into the subsea region. The acoustic wave energy then reflects and refracts from the subsea region to form reflected and refracted wave energy, which is detected by seismic receivers spaced along the streamers. The detected seismic data is then interpreted to reveal seismic information representative of the surveyed subsea region. Other enhancements include configuring the streamers in a flared configuration, where the lateral spacing increases rearwardly over the length of the seismic streamers. | 01-05-2012 |
| 20120014212 | CONTINUOUS COMPOSITE RELATIVELY ADJUSTED PULSE - The invention relates to continuously or near continuously acquiring seismic data where at least one pulse-type source is fired in a distinctive sequence to create a series of pulses and to create a continuous or near continuous rumble. In a preferred embodiment, a number of pulse-type seismic sources are arranged in an array and are fired in a distinctive loop of composite pulses where the returning wavefield is source separable based on the distinctive composite pulses. Firing the pulse-type sources creates an identifiable loop of identifiable composite pulses so that two or more marine seismic acquisition systems with pulse-type seismic sources can acquire seismic data concurrently, continuously or near continuously and the peak energy delivered into the water will be less, which will reduce the irritation of seismic data acquisition to marine life. | 01-19-2012 |
| 20120014213 | HIGH DENSITY SOURCE SPACING USING CONTINUOUS COMPOSITE RELATIVELY ADJUSTED PULSE - The invention relates to continuously or near continuously acquiring seismic data where at least one pulse-type source is fired in a distinctive sequence to create a series of pulses and to create a continuous or near continuous rumble. In a preferred embodiment, a number of pulse-type seismic sources are arranged in an array and are fired in a distinctive loop of composite pulses where the returning wavefield is source separable based on the distinctive composite pulses. Firing the pulse-type sources creates an identifiable loop of identifiable composite pulses so that two or more marine seismic acquisition systems with pulse-type seismic sources can acquire seismic data concurrently, continuously or near continuously and the peak energy delivered into the water will be less, which will reduce the irritation of seismic data acquisition to marine life. | 01-19-2012 |
| 20120035853 | UNIQUE COMPOSITE RELATIVELY ADJUSTED PULSE - The invention relates to acquiring seismic data in either land or marine environments, but typically marine environments where a pulse-type source is fired in a distinctive composite pulse like a distinctive rumble. In a preferred embodiment, a number of pulse-type seismic sources, sometimes called an array, are fired in a distinctive composite pulse to be able to identify within the returning wavefield the energy resulting from the composite pulse. Firing the pulse-type sources creates an identifiable signature so that two or more marine seismic acquisition systems with source arrays can be acquiring seismic data concurrently and the peak energy delivered into the water will be less, which will reduce the irritation of seismic data acquisition to marine life. | 02-09-2012 |
| 20120037444 | CONSTANT HOLDDOWN WEIGHT FOR VIBRATORY SEISMIC SOURCES - The invention relates to maintaining constant holddown force on the vibrator baseplate during actuation. The invention described measures the weight on the point of locomotion verses the baseplate and dynamically adjusts the forces required to keep the holddown force on the baseplate constant. | 02-16-2012 |
| 20120037445 | METHOD FOR CREATING AN IMPROVED SWEEP FOR A SEISMIC SOURCE - An adapted seismic vibrator for obtaining a true ground force comprising: a baseplate pad; a baseplate drive system, wherein the drive system is connected to the baseplate pad and moves the baseplate pad up and down; a vibrator controller electronics, wherein the electronics are connected to the drive system and causes the drive system to move the baseplate pad up and down; and a plurality of load cell sensors disposed between the baseplate pad and ground, wherein the sensors measure the vibrator output force during a sweep. A method of obtaining a true ground force sweep comprising the steps of: using the load cell sensors to measure an actual output force of a seismic vibrator and electronics to obtain an actual ground force data; using inversion to invert the actual ground force data and desired original pilot sweep to obtain a revised pilot sweep that produces a true ground force sweep; and entering the true ground force sweep into the electronics. | 02-16-2012 |
| 20120037446 | UNIFORM DISPLACEMENT SWEEP - This invention relates to operating a seismic vibrator to produce a uniform displacement sweep wherein the baseplate drive is connected to the baseplate and the baseplate is moved in an up and down or reciprocating pattern creating displacement of the earth. The reciprocating pattern and physical displacement of the baseplate and the ground in contact with the baseplate is maintained at a relatively constant distance over at least most of the frequencies that are delivered into the earth although a constant displacement of the baseplate at higher frequencies will require greater power. The high frequency energy is more significantly present in the data traces of the recorded return wavefield and shows that Q attenuation is not fully to blame for the relative absence of high frequency data but rather in failing to effectively deliver high frequency energy into the earth in the first place. | 02-16-2012 |
| 20120057429 | TUNING UNIQUE COMPOSITE RELATIVELY ADJUSTED PULSE - The invention relates to acquiring seismic data in either land or marine environments, but typically marine environments where a pulse-type source is fired in a distinctive composite pulse like a distinctive rumble. In a preferred embodiment, a number of pulse-type seismic sources, sometimes called an array, are fired in a distinctive composite pulse to be able to identify within the returning wavefield the energy resulting from the composite pulse. Firing the pulse-type sources creates an identifiable signature so that two or more marine seismic acquisition systems with source arrays can be acquiring seismic data concurrently and the peak energy delivered into the water will be less, which will reduce the irritation of seismic data acquisition to marine life. In addition, the composite pulse may be formulated by timing the firing of several of the sources with respect to energy emitted by “ringing” bubbles that attenuate within 100 to 300 ms to provide either or both of low frequency pulses and high frequency pulses to provide data for various processing and analysis of the data returned from the subsurface. On land, the complicating factor to be addressed is reverberation rather than bubbles. | 03-08-2012 |
| 20120130644 | ELECTRICAL METHODS SEISMIC INTERFACE BOX - The present invention relates to a method and apparatus for evaluating the geometry of a fracture. | 05-24-2012 |
| 20120146648 | AUTONOMOUS ELECTRICAL METHODS NODE - The present invention relates to a method and apparatus for evaluating and measuring the geometry of a fracture. | 06-14-2012 |
| 20120152529 | ELECTRICAL METHODS FRACTURE DETECTION VIA 4D TECHNIQUES - This invention relates to a method for acquiring and evaluating the geometry of a fracture. | 06-21-2012 |
| 20120169343 | FRACTURE DETECTION VIA SELF-POTENTIAL METHODS WITH AN ELECTRICALLY REACTIVE PROPPANT - This invention relates to a method for evaluating and measuring the geometry of a fracture. | 07-05-2012 |
| 20130114372 | OSCILLATING FLARED STREAMERS - The invention relates to a seismic acquisition process where the streamers are intentionally directed to follow an oscillating sweep pattern behind a tow vessel to counteract the effect of the large gaps between the streamers while acquire a wide sweep of data through each pass over the survey area. | 05-09-2013 |
| 20140104984 | FLARED PSEUDO-RANDOM SPIRAL MARINE ACQUISITION - A method for acquisition of seismic data in a marine environment. | 04-17-2014 |
| 20140269175 | Seismic Acquisition in Marine Environments Using Survey Paths Following a Series of Linked Deviated Paths and Methods of Use - Methods and systems are provided for acquiring seismic data in a marine environment using survey paths following a series of linked curved paths so as to obtain multi-azimuthal data over a sub-surface target. Marine vessels towing multiple seismic streamers may be configured to travel substantially along a series of linked deviated paths or a series of linked curved paths. Sources may be excited to introduce acoustic wave energy in the marine environment and into the subsea region. The acoustic wave energy then reflects and refracts from the subsea region to form reflected and refracted wave energy, which is detected by seismic receivers spaced along the streamers. The detected seismic data is then interpreted to reveal seismic information representative of the surveyed subsea region. Other enhancements include configuring the streamers in a flared configuration, where the lateral spacing increases rearwardly over the length of the seismic streamers. | 09-18-2014 |
