Patent application number | Description | Published |
20100041845 | HETERO-FUNCTIONAL COMPOUNDS AND METHODS FOR USE THEREOF - The invention provides hetero-functional compound compounds useful in a variety of adhesive applications. More particularly, the invention provides compounds bearing at least one electron rich olefinic bond and at least one electron poor olefinic bond, wherein the two olefinic bonds are separated by a C | 02-18-2010 |
20110049731 | MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS - The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. | 03-03-2011 |
20110130485 | IMIDE-LINKED MALEIMIDE AND POLYMALEIMIDE COMPOUNDS - The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds. | 06-02-2011 |
20120065336 | CURABLE COMPOSITION WITH RUBBER-LIKE PROPERTIES - Low viscosity, radiation curable compositions have been developed that produce plastics with silicone rubber-like properties. These compositions have also been shown to give great adhesion to plastics. The combination of an ethylenically unsaturated oligomer with di- or polythiol compound, reactive diluents and a radical initiator will produce these properties. These materials can find use in many areas such as: Electronics packaging, displays, conformal coatings, seals, gaskets, fiber optics coatings, and golf ball coatings. | 03-15-2012 |
20130228901 | MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS - The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers. | 09-05-2013 |
20130338313 | AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF - The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved by incorporating amide-extended maleimides into an adhesive formulation. Amide-extended maleimides described herein can be used to toughen bismaleimide thermosetting materials without sacrificing any thermal stability. Amide-extended maleimides are readily prepared by reacting a bismaleimide with an appropriate amine via the well-known Michael addition reaction. Acylation of the resulting secondary amines provides the amide-extended maleimide. The acylating agent can also be used to introduce polymerizable functional groups into the backbones of these thermoset monomers. Amide-extended acrylate and methacrylate monomers can also be prepared. | 12-19-2013 |
20140275413 | HEAT AND MOISTURE RESISTANT ANAEROBIC ADHESIVES AND SEALANTS - Anaerobic adhesive compositions have been developed that are very thermally stable, and are also extremely hydrophobic to allow for formulations that can withstand extreme harsh temperature, pressure and moisture environments. | 09-18-2014 |
20150344627 | LOW MODULUS NEGATIVE TONE, AQUEOUS DEVELOPABLE PHOTORESIST - Hydrophobic, low modulus, photoimagable, functionalized polyimides have been discovered that can be developed using aqueous solutions. In particular, compositions containing the functionalized polyimides of the current invention can be used in the photolithography step for the passivation layer on a silicon wafer to reduce stress in thin wafers, or as a low modulus hydrophobic solder mask. These materials can serve as protective layers in other applications in which a thin, flexible, and hydrophobic polymer is required. | 12-03-2015 |