| Patent application number | Description | Published |
|---|
| 20130153277 | ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS - An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed. | 06-20-2013 |
| 20130215929 | INDIRECT TEMPERATURE MEASUREMENTS OF DIRECT BANDGAP (MULTIJUNCTION) SOLAR CELLS USING WAVELENGTH SHIFTS OF SUB-JUNCTION LUMINESCENCE EMISSION PEAKS - Methods and structures may be used to measure operating temperatures of isolated cells and/or fully interconnected cells inside a Concentrator Photovoltaic (CPV) module. The method may use spectrometers to measure wavelength shifts of a sub-cell electro-luminescence and/or photo-luminescence emission spectrum. A sub-cells' intrinsic bandgap temperature-dependence relations may be used to indirectly compute the operating temperature of each subcell. A sub-cells' intrinsic bandgap temperature-dependence coefficients can be measured by performing quantum efficiency measurements and/or by recording the electro-luminescence and/or photo-luminescence emission profile of a solar cell at multiple temperatures. | 08-22-2013 |
| 20130273695 | SELECTIVE TRANSFER OF ACTIVE COMPONENTS - A method for selectively transferring active components ( | 10-17-2013 |
| 20140261628 | HIGH EFFICIENCY SOLAR RECEIVERS INCLUDING STACKED SOLAR CELLS FOR CONCENTRATOR PHOTOVOLTAICS - A solar receiver includes at least two electrically independent photovoltaic cells which are stacked. An inter-cell interface between the photovoltaic cells includes a multi-layer dielectric stack. The multi-layer dielectric stack includes at least two dielectric layers having different refractive indices. Related devices and fabrication methods are also discussed. | 09-18-2014 |
| 20150079783 | Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby - Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer. | 03-19-2015 |
| 20150327388 | Electrically Bonded Arrays of Transfer Printed Active Components - An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed. | 11-12-2015 |
| 20150380619 | STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS - A substrate includes an anchor area physically secured to a surface of the substrate and at least one printable electronic component. The at least one printable electronic component includes an active layer having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers. The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed. | 12-31-2015 |
| 20160056223 | High-Yield Fabrication of Large-Format Substrates with Distributed, Independent Control Elements - A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s). | 02-25-2016 |
