Erina
Erina Kawabata, Kyoto-Shi JP
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20150262030 | IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD, AND IMAGE PROCESSING PROGRAM - Disclosed is an image processing device that includes: a matching processing unit that performs matching processing on an input image based on one or a plurality of preregistered templates; an interaction unit that outputs a result indicating a range of each region extracted from the input image assuming that the region matches one of the templates, and that receives from a user an input regarding whether an extraction result of each region is proper; and a control unit that executes optimization processing of a parameter to be used for the matching processing when there has been an input that the extraction result is not proper, and that executes update processing of the template according to success or failure of the matching result of each extracted region when there has been an input that the extraction result is proper. | 09-17-2015 |
Erina Kimura, Yamaguchi JP
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20140378622 | PHOSPHORUS-CONTAINING PHENOLIC RESIN, METHOD FOR MANUFACTURING THE SAME, AND USE OF THE SAME - The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin. | 12-25-2014 |
Erina Minami, Himeji-Shi JP
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20150367018 | ABSORBING ARTICLES COMPRISING WATER ABSORBING RESIN AND METHOD FOR PRODUCING THE SAME - Absorbing articles comprises water absorbing resin including a water-soluble unsaturated monomer, having a dissociable group, as a main component in a repeating unit of a main chain and an internal cross-linked structure, in which a cross-linked structure index represented by the formula [Cross-linked structure index=(Equilibrium swelling capacity with respect to 0.9% by weight of brine) | 12-24-2015 |
Erina Ohno, Joetsu-Shi JP
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20160044918 | METHOD OF CONTROLLING FILBERTWORM - There is provided a method of controlling filbertworm capable of reducing the number of release positions without changing a dosage amount per unit area. More specifically, there is provided a method of controlling filbertworm comprising the step of: providing E,E-8,10-dodecadienyl acetate or a composition comprising 80% by weight or more of E,E-8,10-dodecadienyl acetate at 1 to 100 release positions/ha to release the E,E-8,10-dodecadienyl acetate at a release rate of from 0.01 to 5 g/day/ha for mating disruption. | 02-18-2016 |
Erina Okamoto, Shiga JP
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20150148925 | CONTROL METHOD, COMMUNICATIONS TERMINAL, AND CONTROL SYSTEM - A control method includes receiving setting information containing a first property representing a property of an operation performed by one or more target appliances and a setting of the first property, obtaining correspondence information between device information identifying each of the appliances and a second property representing a property of an operation performed by the appliance, extracting the device information items of the target appliances from among the device information items in the correspondence information, the device information items each having a second property that is the same as the first property, generating a plurality of control information items each associated with each of the extracted device information items of one or more target appliances, containing the setting information and a predetermined information corresponding to the first property and each of the device information items, transmitting the control information to the target appliance through wireless communication. | 05-28-2015 |
Erina Saito, Kanagawa JP
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20160070186 | ELECTROSTATIC CHARGE IMAGE DEVELOPING TONER, ELECTROSTATIC CHARGE IMAGE DEVELOPER, AND TONER CARTRIDGE - An electrostatic charge image developing toner includes toner particles containing a binder resin having a polyester resin and a styrene-(meth)acrylic acid alkyl copolymer resin, a release agent having a hydrocarbon release agent, and an oligomer which includes a styrene structure and whose content is in a range of 1% by weight to 6% by weight with respect to toner particles. | 03-10-2016 |
20160085167 | ELECTROSTATIC CHARGE IMAGE DEVELOPING TONER, ELECTROSTATIC CHARGE IMAGE DEVELOPER, AND TONER CARTRIDGE - An electrostatic charge image developing toner includes toner particles containing a binder resin including a polyester resin, a release agent including a hydrocarbon wax, and a styrene (meth)acrylic resin, wherein 70% or more of the release agent with respect to the entire release agent is present within 800 nm from the surface of the toner particles, wherein the styrene (meth)acrylic resin forms domains having an average diameter of 0.3 μm to 0.8 μm in the toner particles, and wherein a number ratio of the domains included in a range of the average diameter ±0.1 μm is less than 65%. | 03-24-2016 |
Erina Sato, Kanagawa JP
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20150029122 | ELECTRONIC DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM - This electronic device includes: a manipulation unit ( | 01-29-2015 |
Erina Yamada, Komaki-Shi JP
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20120110839 | METHOD OF MANUFACTURING WIRING BOARD - Disclosed is a manufacturing method of a wiring board with at least one conduction layer and at least one resin insulation layer. The manufacturing method includes an opening forming step of forming openings in the resin insulation layer and a paste filling step of filling a copper paste into the openings to form the conduction layer from the copper paste. | 05-10-2012 |
20120152596 | WIRING BOARD - A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may include a conductor layer, a solder resist layer laminated thereon, and a conductor post provided at least within the through-hole and that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder and includes a lower conductor post located within the through-hole and an upper conductor post located above the lower conductor post and projected outside the layer; the lower conductor post includes an external alloy layer disposed on an external side surface thereof; and the conductor post is brought into intimate contact with an internal side surface of the through-hole via the external alloy layer. | 06-21-2012 |
20120152597 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may comprise a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the solder resist layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder; the conductor post includes a lower conductor post, which is located within the through-hole and includes an external side surface and a lower end surface, and an upper conductor post, which is located above the lower conductor post and is projected outside the solder resist layer; and at least a part of a lower end surface of the upper conductor post is brought into intimate contact with an outer surface of the solder resist layer. | 06-21-2012 |
20120152598 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a method for manufacturing a wiring board including a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post to be electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the solder resist layer, the method including a through-hole boring process of boring the through-hole in the solder resist layer containing a thermosetting resin to expose the conductor layer within the through-hole; a first conductor part forming process of forming a first conductor part composed mainly of copper within the through-hole; and a second conductor part forming process of forming a second conductor part composed mainly of tin, copper, or a solder on the first conductor part, in this order. | 06-21-2012 |
20120205039 | METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE - A method for manufacturing a reliable multilayer wiring substrate at a relatively low cost having little or no warpage or distortion is provided. In certain embodiments an insulation core made of an insulation material that is more rigid than that of resin insulation layers is prepared. A through hole is formed through core upper and lower surfaces of the insulation core, and a through hole conductor is formed therein. A plate-like substrate is prepared, and resin insulation layers and at least one conductor layer are laminated on the substrate to form a first buildup layer. The insulation core is laminated on the first buildup layer so as to electrically connect the conductor layer and the through hole conductor. Resin insulation layers and at least one conductor layer are then laminated on the insulation core. Lastly, the substrate is separated from the first buildup layer to yield a multilayer wiring substrate. | 08-16-2012 |
20120205142 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate is configured such that each of laminate portions provided above and below a substrate core includes insulating layers and conductor layers stacked alternately. Of the conductor layers of the laminate portions, signal line layers are treated with a silane coupling treatment, which is a surface modification treatment, so that each signal line comprises a flat surface. A roughening treatment is performed on the remaining conductor layers of the laminate portions such that the surfaces of these layers are roughened. This structure provides an advantage when high-frequency signals are transmitted through the signal line layers. That is, when each signal line comprises a flat surface, an increase in conductor loss due to the skin effect can be prevented. In addition, by means of chemical bonding attained through the silane coupling treatment, the reliability of adhesion between the signal line layers and the insulating layer is sufficiently attained. | 08-16-2012 |