Patent application number | Description | Published |
20140071595 | LASER ABLATION ADHESION PROMOTION - A method for bonding two substrates can use a laser to ablate a bonding surface of at least one of the two substrates. In one embodiment, the laser can be used to produce a predetermined average surface roughness in a bonding surface region of one of the substrates. In another embodiment, the substrate can comprise a resin filled polymer. Ablating the surface of the bonding surface can increase the bond strength in the ablation region. | 03-13-2014 |
20140071597 | AFFINITY BOND LAYER - A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used. | 03-13-2014 |
20140145150 | Electronic Devices With Display-Integrated Light Sensors - An electronic device is provided with a display and a display-integrated light sensor. The display includes a transparent cover layer, light-generating layers, and a touch-sensitive layer. The display-integrated light sensor is interposed between the transparent cover layer and a display layer such as the touch-sensitive layer or a thin-film transistor layer of the light-generating layers. The light-generating layers include a layer of organic light-emitting material. The display-integrated light sensor can be implemented as an ambient light sensor or a proximity sensor. The display-integrated light sensor may be a packaged light sensor that is integrated into the display layers of the display or may be formed from light-sensor components formed directly on a display circuitry layer such as the touch-sensitive layer or the thin-film transistor layer. | 05-29-2014 |
20140152632 | Solar Cell Ambient Light Sensors For Electronic Devices - An electronic device is provided with a display and a solar cell ambient light sensor that receives light through a portion of the display. The solar cell ambient light sensor may include one or more thin-film photovoltaic cells. A voltage that accumulates within the thin-film photovoltaic cell in response to ambient light is sampled and converted into ambient light data. The device includes control circuitry that modifies the intensity of display light generated by the display based on the ambient light data from the photovoltaic cell. The solar cell ambient light sensor is attached to a transparent cover layer, a color filter layer, or any other layer of the display. When the accumulated voltage is not being sampled for ambient light measurements, the voltage may be used to provide charge to a battery in the device. | 06-05-2014 |
20140295808 | Method And Apparatus For Automatically Prioritizing Contact List Information Using Data Correlation - A processor-based personal electronic device (such as a smartphone) is programmed to automatically prioritize a contact list (“address book” or “phone book”) based on one or more factors. The factors may include the frequency and/or recency of calls to or from a particular contact, the location of the user, the location of a particular contact, the time of day, the day of the week, and historical data (such as a user's daily pattern of calls, the recency of selection of the contact, the recency of an in-coming call from the contact, the frequency of in-coming calls from the contact, and the recency of non-telephonic communication via the device with the contact.). | 10-02-2014 |
20140300832 | Electronic Device Signal Routing Structures With Conductive Adhesive - An electronic device may have structures that are coupled together using conductive adhesive such as anisotropic conductive film and other adhesives. The structures that are coupled together may include a touch sensor structure formed from electrodes on the inner surface of a display cover layer, a display module having display layers such as a thin-film transistor layer, and circuitry mounted on substrates such as printed circuits. Conductive signal path structures may be used in routing signals within the electronic device. The conductive signal path structures may be formed from pins that are embedded within injection molded plastic, from metal traces such as laser-deposited metal traces that are formed on the surface of a plastic member or other dielectric, from metal structures that run within channels in a plastic, printed circuit traces, and other signal path structures. | 10-09-2014 |
20150085429 | ELECTRONIC COMPONENT EMBEDDED IN CERAMIC MATERIAL - A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device. | 03-26-2015 |
20150263450 | ELASTOMERIC CONNECTORS - In a first embodiment, an elastomeric connector may include conductive and nonconductive portions and a guide that at least partially surrounds the connector and transfers compression in at least two directions. In a second embodiment, an elastomeric connector includes conductive portions at least partially surrounded by a nonconductive portion that is at least partially surrounded by conductive material connectible to ground to shield. In a third embodiment, an elastomeric connector may include multiple conductive portions and a nonconductive portion. One of the conductive portions may be separated from a first other in a cross section of a first connection surface and a second one of the others outside the cross section. At least one of the conductive portions may be connected to at least one of the others within the connector. In a fourth embodiment, a sealing component may include conductive and nonconductive elastomeric material. | 09-17-2015 |