Patent application number | Description | Published |
20080286562 | THERMOSETTING ENCAPSULATION ADHESIVE SHEET - A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device ( | 11-20-2008 |
20120055015 | METHOD FOR MANUFACTURING ELECTRONIC PARTS DEVICE AND RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION - The present invention relates to a method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein. | 03-08-2012 |
20120295997 | RESIN KNEADED MATERIAL AND SHEET - A resin kneaded material has not more than 30 pores having a pore diameter of not less than 20 μm in a surface area of 4.00 mm | 11-22-2012 |
20120296010 | ENCAPSULATING SHEET AND ELECTRONIC DEVICE - An encapsulating sheet is obtained by subjecting a kneaded material to plastic working, the kneaded material including an epoxy resin represented by General Formula (1) below, a curing agent, and an inorganic filler, | 11-22-2012 |
20130139874 | CONDUCTIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME, COLLECTOR ELECTRODE, AND SOLAR CELL MODULE - A conductive adhesive sheet includes a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction; a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; and an adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer. | 06-06-2013 |
20140106133 | LAMINATE - An object of the invention is to prevent staining of processing equipment by a resin originated from a resin sheet during pressing. The present invention achieves the object by a laminate having a support, a resin sheet that is laminated on a part of the support, and a release sheet that is laminated on the resin sheet, in which a peel force F | 04-17-2014 |
20140311525 | LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION - A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer. | 10-23-2014 |
20140311666 | LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION - A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer. | 10-23-2014 |