Patent application number | Description | Published |
20090250162 | High Resolution Inkjet Printer - A high-resolution printer includes a printhead having optimized features including 3 to 20 micron diameter orifices spaced apart from adjacent orifices by a distance of between about 15 and 75 microns. The orifice plate is electroformed and plated to a thickness ranging from about 6 to 19 microns. A barrier layer secures the orifice plate to a printhead substrate. | 10-08-2009 |
20130033548 | Print Head - Thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel for receiving fluid from the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to a fluid feed channel wall, and a cantilever extending over the fluid feed channel wall, having a staggered edge that follows the staggered pattern of the resistors. | 02-07-2013 |
20130162724 | PROTECTING A FLUID EJECTION DEVICE RESISTOR - In an embodiment, a method of fabricating a fluid ejection device includes forming a resistor on the front side of a substrate, depositing a dielectric film on the resistor to protect the resistor from chemical exposure during a slot formation process, and forming a slot in the substrate that extends from the back side to the front side of the substrate. | 06-27-2013 |
20140327720 | FLUID DISPENSER - A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers. | 11-06-2014 |
20150034734 | FLUID EJECTION DEVICE - A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening. | 02-05-2015 |
20150124024 | FLUID EJECTION DEVICE WITH PARTICLE TOLERANT THIN-FILM EXTENSION - In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate, a chamber layer formed over the thin-film layer, the chamber layer defining a fluidic channel that leads to a firing chamber, a slot extending through the substrate and into the chamber layer through an ink feed hole in the thin-film layer, and a particle tolerant thin-film extension of the thin-film layer that protrudes into the slot from between the substrate and the chamber layer. | 05-07-2015 |
20150145908 | CONTROLLING ADHESIVES BETWEEN SUBSTRATES AND CARRIERS - Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression. | 05-28-2015 |
20150210076 | FLUID EJECTION ASSEMBLY WITH CONTROLLED ADHESIVE BOND - In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot. | 07-30-2015 |