Patent application number | Description | Published |
20110266539 | High Performance Compliant Wafer Test Probe - An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi. | 11-03-2011 |
20120329295 | High Performance Compliant Wafer Test Probe - An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi. | 12-27-2012 |
20130147502 | VERTICAL PROBE ASSEMBLY WITH AIR CHANNEL - A vertical probe assembly includes an upper die; a lower die; a plurality of probes, the probes comprising an electrically conductive material, wherein the probes extend from the upper die through the lower die; and an air channel located between the upper die and the lower die, such that airflow through the air channel passes through the plurality of probes. | 06-13-2013 |
20130342234 | PROBE-ON-SUBSTRATE - Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls. | 12-26-2013 |
20130344694 | PROBE-ON-SUBSTRATE - Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls. | 12-26-2013 |
20150331014 | SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING - A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package. | 11-19-2015 |
Patent application number | Description | Published |
20140266048 | Dual Port Charger - A battery charger for charging a first battery pack and a second battery pack is disclosed. The charger includes a housing, a first and second charging circuit positioned within the housing, a first and second charging port coupled to the housing and electrically coupled the first and second charging circuits, respectively. The first charging port is configured to support the first battery pack and defines a first connection axis along which the first battery pack is movable to connect with the first charging circuit. The second charging port is configured to support the second battery pack and defines a second connection axis along which the second battery pack is movable to connect with the second charging circuit. The second charging port is configured to support the second battery pack while the first charging port supports the first battery pack. | 09-18-2014 |
20150097348 | MODULAR ACCESSORY ATTACHMENT SYSTEM FOR A UTILITY CART - Three different families of mobile utility cart accessories may be quickly and easily attached to a mobile utility cart of the present invention using the inexpensive, but flexible modular accessory attachment system of the present invention. This is accomplished by releasably slidably attaching the accessories to vertical rails mounted adjacent corner edges of the utility cart. The rails share fundamentally the same cross-section, and are continuous and uninterrupted, so that the accessories may be positioned at any vertical location on the rails, and consequently, on the utility cart. No complicated rail clamps are necessary. Instead, just two types of fastener subassemblies are needed to attach the accessories to slots in the rails. These accessories may include, for example, a tool holster of the present invention capable of snugly retaining up to three power tools on the cart. | 04-09-2015 |