Dukkipati
Nandita Dukkipati, Menlo Park, CA US
Patent application number | Description | Published |
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20100220592 | LAYERED INTERNET VIDEO ENGINEERING - Embodiments are described herein such as a method for providing media-aware congestion control for the transmission of video streams, the method comprising: estimating congestion price information for one or more network nodes; responding to the congestion price information by calculating optimal rates for one or more end hosts; adapting the sending rates of the one or more end hosts according to the calculated optimal rates; and determining an amount of FEC to be inserted into the video streams based on the congestion price information. | 09-02-2010 |
20110158253 | Increasing Transmission Rate to a Remote Device In Response to Attributing Information Loss as Not Being a Result of Network Congestion - In response to a detected loss of previously transmitted information by an apparatus communicating with a remote device (e.g., using TCP), the rate of transmission of information is increased by the apparatus in response to attributing the detected loss of previously transmitted information as not being caused by congestion. This attribution of the packet loss is typically determined based on roundtrip delays between sent information and received corresponding acknowledgments, which may be used directly or indirectly, such as by estimating network queuing delays based on the measured roundtrip delays. | 06-30-2011 |
20140112134 | Increasing Transmission Rate to a Remote Device In Response to Attributing Information Loss as Not Being a Result of Network Congestion - In response to a detected loss of previously transmitted information by an apparatus communicating with a remote device (e.g., using TCP), the rate of transmission of information is increased by the apparatus in response to attributing the detected loss of previously transmitted information as not being caused by congestion. This attribution of the packet loss is typically determined based on roundtrip delays between sent information and received corresponding acknowledgments, which may be used directly or indirectly, such as by estimating network queuing delays based on the measured roundtrip delays. | 04-24-2014 |
Venkat Dukkipati, Westlake, OH US
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20140102631 | POLYMER COMPOSITIONS FOR TEMPORARY BONDING - Embodiments in accordance with the present invention are directed to poly(lactide) compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such poly(lactide) compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter. | 04-17-2014 |
Venkat Dukkipati, Copley, OH US
Patent application number | Description | Published |
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20130192754 | Room Temperature Debonding Composition, Method and Stack - Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching. | 08-01-2013 |
20140178701 | ROOM TEMPERATURE DEBONDING COMPOSITION, METHOD AND STACK - Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching. | 06-26-2014 |
Venkat R. Dukkipati, Newport Beach, CA US
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20160118288 | ROOM TEMPERATURE DEBONDABLE AND THERMALLY CURABLE COMPOSITIONS - Embodiments in accordance with the present invention are directed to a method of fabricating a semiconductor device wherein a device wafer substrate is coated with a composition encompassing a surface energy modifier and a thermally stable polymer which is then bonded to a carrier wafer substrate coated with a composition encompassing a crosslinkable polymer composition. The polymer composition allows thinning of a device wafer before separating from the carrier wafer at room temperature. | 04-28-2016 |
Venkat Ram Dukkipati, Westlake, OH US
Patent application number | Description | Published |
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20120172479 | POLYMER COMPOSITIONS FOR TEMPORARY BONDING - Embodiments in accordance with the present invention are directed to polymer compositions that are useful for forming temporary bonding layers that serve to releasably join a first substrate to a second substrate as well as methods of both forming such a temporary bond and methods of debonding such substrates. Some such polymer compositions encompass a casting solvent, a photoacid generator and optionally a sensitizer and/or an adhesion promoter. | 07-05-2012 |