Patent application number | Description | Published |
20090065436 | SUPER ABSORBENT CONTAINING WEB THAT CAN ACT AS A FILTER, ABSORBENT, REACTIVE LAYER OR FUEL FUSE - The web of the invention can comprise a super absorbent layer that can act as an moisture sensitive fuel shut-off valve, absorbent, adsorbant or reactant. The web of the invention can comprise a super absorbent fabric or layer made of a superabsorbent particle or fiber. The web can comprise a nanofiber layer having dispersed within the nanofiber layer a super absorbent particulate and optionally a second particulate material that can act as an absorbent, adsorbant or reactant. Fluid, gas or liquid, that flows through or by the assemblies of the invention can have any gas, liquid or solid material dispersed or dissolved in the fluid interact with the super absorbent particulate. If needed these materials can also react with, be absorbed by, or adsorbed onto, the active particulate within the nanofiber layer. The structures of the invention can act simply as flow-by reactive, absorptive, or adsorptive layers with no filtration properties, or the structures of the invention can be assembled into filters that can filter particulate from a mobile fluid in a flow-through mode while simultaneously reacting, absorbing, or adsorbing materials from the mobile fluid. | 03-12-2009 |
20110049015 | WATER REMOVAL AND MANAGEMENT SYSTEM - A system and method for removing and managing water in liquid hydrocarbons is disclosed. The system and method utilize a water absorbent filter, such as one that utilizes super absorbent polymers, cellulose, cotton or other suitable material to remove water from the system that is either present as free water or as dissolved moisture within the liquid hydrocarbon. The super absorbent polymer filter can be regenerated through the introduction of a dried liquid hydrocarbon, through the use of an air drying system, or a combination of both. | 03-03-2011 |
20110138685 | SUPER ABSORBENT CONTAINING WEB THAT CAN ACT AS A FILTER, ABSORBENT, REACTIVE LAYER OR FUEL FUSE - The web of the invention can comprise a super absorbent layer that can act as an moisture sensitive fuel shut-off valve, absorbent, adsorbant or reactant. The web of the invention can comprise a super absorbent fabric or layer made of a superabsorbent particle or fiber. The web can comprise a nanofiber layer having dispersed within the nanofiber layer a super absorbent particulate and optionally a second particulate material that can act as an absorbent, adsorbant or reactant. Fluid, gas or liquid, that flows through or by the assemblies of the invention can have any gas, liquid or solid material dispersed or dissolved in the fluid interact with the super absorbent particulate. If needed these materials can also react with, be absorbed by, or adsorbed onto, the active particulate within the nanofiber layer. The structures of the invention can act simply as flow-by reactive, absorptive, or adsorptive layers with no filtration properties, or the structures of the invention can be assembled into filters that can filter particulate from a mobile fluid in a flow-through mode while simultaneously reacting, absorbing, or adsorbing materials from the mobile fluid. | 06-16-2011 |
20120312734 | SUPER ABSORBENT CONTAINING WEB THAT CAN ACT AS A FILTER, ABSORBENT, REACTIVE LAYER OR FUEL FUSE - The web of the invention can comprise a super absorbent layer that can act as an moisture sensitive fuel shut-off valve, absorbent, adsorbant or reactant. The web of the invention can comprise a super absorbent fabric or layer made of a superabsorbent particle or fiber. Fluid, gas or liquid, that flows through or by the assemblies of the invention can have any gas, liquid or solid material dispersed or dissolved in the fluid interact with the super absorbent particulate. The structures of the invention can act simply as flow-by reactive, absorptive, or adsorptive layers with no filtration properties, or the structures of the invention can be assembled into filters. | 12-13-2012 |
20130134110 | LIQUEFIED PETROLEUM GAS FILTRATION SYSTEM - Described herein are filter assemblies for removing high molecular weight organic components from liquefied petroleum gas, as well as methods for removing high molecular weight components from liquefied petroleum gases. The filter assemblies include an upstream carbon-containing filter media pack and a downstream filter media pack. | 05-30-2013 |
Patent application number | Description | Published |
20080267556 | Flexible Printed Circuits Capable of Transmitting Electrical and Optical Signals - A flexible printed circuit capable of transmitting electrical and optical signals is disclosed. The flexible printed circuit includes a set of optical waveguides for transmitting optical signals and a set of conductors for transmitting electrical signals. Each of a subset of the optical waveguides is enclosed by a respectively one of the conductors. The optical waveguide is made of glass or plastic. The conductors are formed within a first building block constructed by a first dielectric layer and a first substrate layer, and a second building block constructed by a second dielectric layer and a second substrate layer. | 10-30-2008 |
20090056998 | METHODS FOR MANUFACTURING A SEMI-BURIED VIA AND ARTICLES COMPRISING THE SAME - Disclosed herein is a method comprising drilling a first hole in a multilayered device; the multilayered device comprising a fill layer disposed between and in intimate contact with two layers of a first electrically conducting material; the fill layer being electrically insulating; plating the first hole with a slurry; the slurry comprising a magnetic material, an electrically conducting material, or a combination comprising at least one of the foregoing materials; filling the first hole with a fill material; the fill material being electrically insulating; laminating a first layer and a second layer on opposing faces of the multilayered device to form a laminate; the opposing faces being the faces through which the first hole is drilled; the first layer and the second layer each comprising a second electrically conducting material; drilling a second hole through the laminate; the second hole having a circumference that is encompassed by a circumference of the first hole; and plating the surface of the second hole with a third electrically conducting material. | 03-05-2009 |
20090188712 | Flexible Multilayer Printed Circuit Assembly with Reduced EMI Emissions - A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends. | 07-30-2009 |
20090213565 | EMC SHIELDING FOR PRINTED CIRCUITS USING FLEXIBLE PRINTED CIRCUIT MATERIALS - Exemplary embodiments of the present invention relate to a method for making multilayer flexible printed circuit carrier. The method comprises producing a first flexible conductor layer having a first width, producing a second flexible conductor layer having a second width larger than the first width, and separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator. The method also comprises placing a second insulator over at least a portion of a second surface of the first flexible conductor, and wrapping a portion of the second flexible conductor over the at least a portion of the second surface of the first flexible conductor. | 08-27-2009 |
20090277670 | High Density Printed Circuit Board Interconnect and Method of Assembly - A printed circuit board assembly having an edge joined first and second sub-circuit board is provided. The first sub-circuit board includes an edge with a stair-step profile interconnection wherein each of the stairs on the profile exposes an area of a signal layer. Each exposed portion of the signal layer has a plurality of signal pads thereon. The second sub-circuit board includes an edge with an inverse stair-step profile interconnection. A pad-on-pad connector is positioned in-between and electrically interconnects the respective signal layers on each sub-circuit board. | 11-12-2009 |
20100084160 | SPLIT FLEX CABLE - A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias. | 04-08-2010 |
20120088376 | SPLIT FLEX CABLE - A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias. | 04-12-2012 |
20120275798 | PROGRAMMABLE OPTICAL INTERCONNECT FOR MULTI-NODE COMPUTER SYSTEMS - A device for connecting a plurality of assemblage-mounted optical transmitters to a plurality of assemblage-mounted optical receivers mounted on a selected side of an assemblage includes a planar frame configured to be coupled to the selected side of the assemblage. A plurality of first redirecting structures is affixed to the planar frame and each is configured to receive a first optical signal from a different assemblage-mounted optical transmitter. Each first redirecting structure transmits a second optical signal, corresponding to the first optical signal, along a preselected path. A plurality of second redirecting structures is affixed to the planar frame and each is configured to receive the second optical signal from a different one of the first redirecting structures. Each of the second redirecting structures transmits a third optical signal, corresponding to the second optical signal, to a different one of the assemblage-mounted optical receivers. | 11-01-2012 |
20130177697 | IMPLEMENTING ENHANCED OPTICAL MIRROR COUPLING AND ALIGNMENT UTILIZING TWO-PHOTON RESIST - A method, system and computer program product for implementing an enhanced optical mirror coupling and alignment mechanism utilizing two-photon resist. An initial placement is provided for one or more vias on a printed circuit board. A via is filled with a resist. A series of tightly focused light beams suitably exposes the resist at varying depths in the via, the varying depths defining a sloped polymer in the via after removing resist that had not been at the focus of the light beam. The sloped polymer is coated with reflective material to reflect light into or out of the via. | 07-11-2013 |
20130240250 | CIRCUIT APPARATUS HAVING A ROUNDED DIFFERENTIAL PAIR TRACE - A first artwork layer having a first adaptable-mask section allows a graded amount of light to pass into an underlying first photoresist layer. Subsequent to developing the first photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least a lower portion of a rounded trace. A dielectric layer is laminated upon the lower portion and a second artwork layer having an second adaptable-mask section allows a graded amount of light to pass into a second photoresist layer. Subsequent to developing the second photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least an upper portion of a rounded trace. The photoresist and dielectric layers are removed resulting in a circuit apparatus having a rounded differential pair trace. | 09-19-2013 |
20140005818 | IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CIRCUITS | 01-02-2014 |
20140142883 | IMPLEMENTING FREQUENCY SPECTRUM ANALYSIS USING CAUSALITY HILBERT TRANSFORM RESULTS OF VNA-GENERATED S-PARAMETER MODEL INFORMATION - A method, system and computer program product are provided for implementing frequency spectrum analysis of noise in a device under test using causality (Hilbert Transform) results of Vector Network Analyzer (VNA) VNA-generated S-parameter model Information. A plurality of S-parameter samples are collected from the VNA generated S-parameter model Information. A Hilbert Transform of the collected plurality of S-parameter samples is used for error magnitude per frequency point analysis. An average error magnitude of predefined collected error magnitude samples is calculated to identify environmental noise in the device under test and used to identify acceptable environmental effects on the device under test. | 05-22-2014 |
20140192483 | THERMAL DISSIPATIVE RETRACTABLE FLEX ASSEMBLY - Embodiments of the present invention provide an apparatus comprising a flexible circuit having a proximal end, a distal end, and a plurality of longitudinal conductors. Further, the apparatus includes a substantially cylindrical retractor capable of retracting the flexible circuit around an exterior surface. Further still, the apparatus includes a plurality of thermal energy transfer turrets attached to the flexible circuit near the plurality of longitudinal conductors. | 07-10-2014 |
20140205232 | IMPLEMENTING EMBEDDED HYBRID ELECTRICAL-OPTICAL PCB CONSTRUCT - Methods and structures are provided for implementing embedded hybrid electrical-optical printed circuit board (PCB) constructs. The embedded hybrid electrical-optical PCB construct includes electrical channels and optical channels within a single physical PCB layer. The embedded hybrid electrical-optical PCB construct includes an electrically conductive sheet or a copper sheet, and a reflective mesh adhesive layer provided with the electrical channels and optical channels within the single physical PCB layer. | 07-24-2014 |
20140259653 | FLEXIBLE REWORK DEVICE - A rework device in form of a flexible circuit is provided in order to repair a printed circuit assembly. The printed circuit assembly includes one or more through vias and interconnections. The flexible circuit includes a lead in portion and a tail portion. The flexible circuit also includes a first distended head portion proximal to the lead in portion and a second distended head portion proximal to the tail portion. Further, the second distended head portion is connected to the first distended head portion through a coverlay portion. The flexible circuit provided is adapted to be threaded through a through via to repair the printed circuit assembly. | 09-18-2014 |
20150200500 | RETRACTABLE INTERCONNECT DEVICE CONFIGURED TO SWITCH BETWEEN ELECTRICAL PATHS - A retractable interconnect device is configurable to operate in an extended mode or a retracted mode. The retractable interconnect device includes a first (e.g., short) electrical path and a second (e.g., long) electrical path. The retractable interconnect device also includes a connector that is electrically coupled to the first electrical path in the retracted mode and that is electrically coupled to the second electrical path in the extended mode. | 07-16-2015 |
20150200528 | RETRACTABLE INTERCONNECT DEVICE INCLUDING MULTIPLE ELECTRICAL PATHS - A retractable interconnect device is configurable to operate in an extended mode or a retracted mode. The retractable interconnect device includes a first (e.g., short) electrical path and a second (e.g., long) electrical path. The retractable interconnect device also includes a connector that is electrically coupled to the second electrical path and that is selectively electrically couplable to the first electrical path. | 07-16-2015 |
20150222068 | SPLIT FLEX CABLE - A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias. | 08-06-2015 |
20150338457 | RESIDUAL MATERIAL DETECTION IN BACKDRILLED STUBS - A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded. | 11-26-2015 |
20150342057 | RESIDUAL MATERIAL DETECTION IN BACKDRILLED STUBS - A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded. | 11-26-2015 |
Patent application number | Description | Published |
20080230259 | Method and Structure for Implementing Control of Mechanical Flexibility With Variable Pitch Meshed Reference Planes Yielding Nearly Constant Signal Impedance - A method and structure are provided for implementing flexible circuits of various electronic packages and circuit applications. A meshed reference plane includes a variable mesh pitch arranged for control of mechanical flexibility. A dielectric core separates a signal layer from the variable pitch meshed reference plane. An electrically conductive coating covers the surface of the variable pitch meshed reference plane yielding substantially constant signal impedance for the signal layer. | 09-25-2008 |
20080236883 | STRUCTURES FOR IMPLEMENTING EMI SHIELDING FOR RIGID CARDS AND FLEXIBLE CIRCUITS - A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition (PVD) process. A solder mask is applied. Mechanically cleaning removes the sputtered copper coating in areas of the outer layer that are not protected by the solder mask. | 10-02-2008 |
20090189635 | METHOD AND APPARATUS FOR IMPLEMENTING REDUCED COUPLING EFFECTS ON SINGLE ENDED CLOCKS - A method and apparatus implement reduced noise coupling effects on single ended clocks, and a design structure on which the subject circuit resides is provided. A clock receiver includes a clock voltage reference that is generated from received clock peaks and valleys of a received input clock signal. The received clock peaks (VT) and the received clock valleys (VB) are continuously sampled. The clock voltage reference is set, for example, equal to an average of VT and VB; or ((VT+VB)/2). | 07-30-2009 |
20090211792 | Flexible Printed Circuit Assembly With Reduced Dielectric Loss - A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace. | 08-27-2009 |
20090255713 | Controlling Impedance and Thickness Variations for Multilayer Electronic Structures - Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a process of generating equalization data and a design structure for multilayer electronic structures is presented. | 10-15-2009 |
20090255715 | Controlling Impedance and Thickness Variations for Multilayer Electronic Structures - Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into multilayer cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer structure and a method of manufacture are presented. | 10-15-2009 |
20090258194 | Controlling Impedance and Thickness Variations for Multilayer Electronic Structures - Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer electronic structure and a method of manufacture is presented. | 10-15-2009 |
20120122342 | IMPLEMENTING IMPEDANCE GRADIENT CONNECTOR FOR BOARD-TO-BOARD APPLICATIONS - A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs. | 05-17-2012 |
Patent application number | Description | Published |
20140305870 | FILTRATION MEDIUM COMPRISING A METAL-CONTAINING PARTICULATE - Described herein is a liquid filtration device is disclosed comprising a fluid conduit fluidly connecting a fluid inlet to a fluid outlet; and a water filtration medium disposed in the fluid conduit; the water filter medium comprising a metal-containing particulate, wherein the metal-containing particulate comprises a thermolysis product of a metal salt wherein the salt is selected from nitrogen-containing oxyanions, sulfur-containing anions, chlorides, phosphates, and combinations thereof; and methods of removing chloramines from aqueous solutions. | 10-16-2014 |
20140305882 | FILTRATION MEDIUM COMPRISING A METAL-CONTAINING PARTICULATE - Described herein is a liquid filtration device is disclosed comprising a fluid conduit fluidly connecting a fluid inlet to a fluid outlet; and a water filtration medium disposed in the fluid conduit; the water filter medium comprising a metal-containing particulate, wherein the metal-containing particulate comprises a thermolysis product of a metal carboxylate; and methods of removing chloramines from aqueous solutions. | 10-16-2014 |
20140319061 | FILTRATION MEDIUM COMPRISING A THERMOLYSIS PRODUCT OF A CARBON OXYCHALCOGENIDE AND A METAL SALT, METHOD OF REMOVING CHLORAMINE WITH THIS FILTRATION MEDIUM AND METHOD OF MAKING THIS FILTRATION MEDIUM - Described herein is a filtration medium comprising a substrate, wherein the substrate comprises a thermolysis product of (i) a carbon substrate having a surface of CO | 10-30-2014 |
20140360942 | FILTRATION MEDIUM COMPRISING A METAL SULFIDE - Described herein is a liquid filtration device is disclosed a vessel for treating an aqueous liquid, wherein the vessel contains a filtration medium and wherein the filtration medium comprises a metal sulfide, wherein the sulfur in the form of a metal sulfide is at least 0.5% by weight of the filtration media. | 12-11-2014 |