Dongkyun
Dongkyun Im, Seoul KR
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20150013945 | CENTRIFUGAL BLOWER AND AIR CONDITIONER USING THE SAME - A centrifugal blower for an air conditioner may include a centrifugal fan rotatably coupled to a motor, and a bell mouth guiding air into the centrifugal fan. The centrifugal fan may include a hub fixed to a rotary shaft of the motor, a main plate provided at an outer circumferential surface of the hub, a shroud having a suction opening surrounding the rotary shaft, the shroud positioned opposite the main plate to define a main gas flow path, and a plurality of wings arranged along the circumferential direction of the suction opening between the main plate and the shroud. A rear axial end portion of the bell mouth may be inserted into the shroud through the suction opening so as to form a predetermined radial gap with the suction opening. The rear portion of the bell mouth may include a plurality of alternately formed protruding portions and recessed portions, with the protruding portions and the recessed portions inserted into the shroud. | 01-15-2015 |
Dongkyun Kim, Suwon-Si KR
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20120211072 | Solar Cell And Method Of Manufacturing Same - Example embodiments of a solar cell including a semiconductor substrate, an N emitter layer formed on a light-absorbing surface of the semiconductor substrate, a p+ region formed on the light-absorbing surface of the semiconductor substrate, a first electrode electrically connected to the p+ region, a second electrode separately formed from the first electrode on the light-absorbing surface of the semiconductor substrate and electrically connected to the N emitter layer, and an auxiliary layer inducing an N+ back surface field (BSF) on the opposite surface to the light-absorbing surface of the semiconductor substrate, and a method of manufacturing the solar cell are provided. | 08-23-2012 |
Dongkyun Kim, Daegu KR
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20090296704 | METHOD FOR MULTI-PATH SOURCE ROUTING IN SENSOR NETWORK - A method for a multi-path source routing in a sensor network. In the sensor network including a sink node and a plurality of sensor nodes, the sensor network transmits data packets through a downlink route set based on a routing table generated by collecting uplink neighbor information of each sensor node from a control message for initializing a network and an uplink route formed by using uplink neighbors of each sensor node. Uplink neighbors for transmitting data from each sensor node to the sink node by performing a network initialization process and acquires the information in the sink node to generate the multi-path is maintained. As a result, it has advantages of reducing a control message overhead while using the multi-path and increasing scalability and energy efficiency by keeping a routing table small in the sensor node regardless of the size of the network. | 12-03-2009 |
Dongkyun Kim, Seoul KR
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20110176608 | METHOD AND APPARATUS FOR DETERMINING INTRA PREDICTION MODE, AND METHOD AND APPARATUS FOR ENCODING/DECODING VIDEO USING SAME - Disclosed are a method and apparatus for determining an intra prediction mode, and for encoding/decoding video using the same. An apparatus for determining an intra prediction mode is provided, the apparatus comprising a calculator to calculate a variation of adjacent pixels to a current block; a threshold setter to set a threshold to evaluate the pixel variation; a comparator to compare between the variation and the threshold; a first prediction mode determination unit to determine a single predetermined prediction mode to be an optimal prediction mode if the variation is below the threshold; and a second prediction mode determination unit to determine a particular prediction mode from a plurality of prediction modes to be the optimal prediction mode through a rate-distortion optimization by performing intra predictions in the plurality of prediction modes if the variation is greater than or equal to the threshold. | 07-21-2011 |
Dongkyun Ko, Kyunggi-Do KR
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20100109132 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure. | 05-06-2010 |
20100110656 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate. | 05-06-2010 |
20120098109 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure. | 04-26-2012 |
Dongkyun Lim, Gyeonggi-Do KR
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20150109227 | TOUCH SENSING SYSTEM AND DRIVING METHOD THEREOF - A touch sensing system and a driving method thereof are provided. The touch sensing system includes: a touch screen drive circuit which senses a change in the amount of electric charge in touch sensors during a sensing period, generates raw data and temporarily stores it in a buffer memory, transmits the raw data read out from the buffer memory to an algorithm execution unit during a raw data transmission period, and calculates the coordinates of touch input by the algorithm execution unit during an algorithm execution period. The touch screen drive circuit controls the amount of data stored in the buffer memory and the start timing of a read operation to make the sensing period and the raw data transmission period overlap each other. | 04-23-2015 |
Dongkyun Nam, Seoul KR
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20130192185 | LAWN MOWER ROBOT AND METHOD OF CONTROLLING THE SAME - The present embodiment relates to a lawn mower robot. The lawn mower robot includes a body including a mowing device; a sensor disposed in the body and sensing light signal produced from a signal producing unit in the outside; a moving device disposed in the body; and a controller controlling the moving device based on information sensed from the sensor, wherein the controller controls the moving device so that the lawn mower robot is moved along the light signal. | 08-01-2013 |
20130199145 | LAWN MOWER ROBOT AND METHOD OF CONTROLLING THE SAME - The present embodiment relates to a lawn mower robot. A lawn mower robot system, comprising: a lawn mower robot disposed with a moving device; a mowing device disposed in the lawn mower robot and mowing lawns; a first communication device disposed in the lawn mower robot and transmitting an inquiry signal for state information; a plurality of boundary display apparatuses, arranged in a lawn presence region, disposed with a second communication device for receiving the inquiry signal for the state information from the first communication device and for transmitting an acknowledge signal for the state information to the first communication device; a controller for recognizing a plurality of absolute coordinates from the lawn presence region based on the acknowledge signal for the state information received from the second communication device and for controlling the mowing device within the limit of the plurality of absolute coordinates. | 08-08-2013 |
20130212994 | LAWN MOWER ROBOT AND METHOD OF CONTROLLING THE SAME - The present embodiment relates to a lawn mower robot. The lawn mower robot includes a body disposed with a moving device; a mowing device disposed in the bottom of the body and mowing lawns; a sensor disposed in the body and outputting data by sensing colors; and a controller determining a lawn presence region based on data output from the sensor. | 08-22-2013 |
Dongkyun Park, Suwon-Shi KR
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20120193761 | Highly Integrated Semiconductor Devices Including Capacitors - A capacitor of semiconductor device is provided including a lower electrode on a semiconductor substrate; a dielectric film covering a surface of the lower electrode; and an upper electrode covering the dielectric film. The lower electrode includes a first conductive pattern having a groove region defined by a bottom portion and a sidewall portion; and a first core support pattern disposed in the groove region of the first conductive pattern and exposing a portion of inner sidewall of the first conductive pattern. Related methods are also provided herein. | 08-02-2012 |
Dongkyun Park, Hwasung-City KR
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20130277802 | INTEGRATED CIRCUIT DEVICES WITH CAPACITOR AND METHODS OF MANUFACTURING THE SAME - An integrated circuit device with capacitors and methods of forming the integrated circuit device are provided. The methods may include forming a first lower capacitor electrode pattern on an inner surface of a hole in a mold layer. The first lower capacitor electrode pattern may have a hollow cylindrical shape and an opening in an upper surface. The method may further include forming a second lower capacitor electrode pattern plugging the opening and an upper surface of the second lower capacitor electrode pattern may be planar. The first and the second lower capacitor electrode patterns may comprise a lower capacitor electrode including a void. Additionally, the method may include removing the mold layer to expose the lower capacitor electrode, forming a dielectric layer on the lower capacitor electrode, and forming an upper capacitor electrode layer on the dielectric layer. | 10-24-2013 |
Dongkyun Park, Suwon-Si KR
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20120098092 | SEMICONDUCTOR DEVICE CAPACITORS INCLUDING MULTILAYERED LOWER ELECTRODES - A capacitor of a semiconductor device may include a lower electrode on a semiconductor substrate. A dielectric film can cover a surface of the lower electrode and an upper electrode can cover the dielectric film. The lower electrode can be a first conductive pattern that includes a bottom portion and a sidewall portion that defines a groove region. A core support pattern can be in the groove region of the first conductive pattern and a second conductive pattern can electrically connect to the first conductive pattern on the core support pattern. | 04-26-2012 |
20140110824 | SEMICONDUCTOR DEVICES HAVING HYBRID CAPACITORS AND METHODS FOR FABRICATING THE SAME - A semiconductor device includes a plurality of capacitors disposed on a substrate and a support pattern supporting upper portions and lower portions of the capacitors. Each of the capacitors includes a lower electrode, an upper electrode, and a dielectric layer between the lower and upper electrodes. The lower electrode includes a first electrode portion electrically connected to the substrate and having a solid shape and a second electrode portion stacked on the first electrode portion and having a shape comprising an opening therein. The support pattern includes an upper pattern contacting sidewalls of top end portions of the lower electrodes and a lower pattern vertically spaced apart from the upper pattern. The lower pattern contacts sidewalls under the top end portions of the lower electrodes. | 04-24-2014 |
20140120683 | CAPACITOR OF SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - Capacitor of a semiconductor device, and a method of fabricating the same, include sequentially forming a mold structure and a polysilicon pattern over a semiconductor substrate, patterning the mold structure using the polysilicon pattern as an etch mask to form lower electrode holes penetrating the mold structure, forming a protection layer covering a surface of the polysilicon pattern, forming lower electrodes in the lower electrode holes provided with the protection layer, removing the polysilicon pattern and the protection layer to expose upper sidewalls of the lower electrodes, removing the mold structure to expose lower sidewalls of the lower electrodes, and sequentially forming a dielectric and an upper electrode covering the lower electrodes. | 05-01-2014 |
Dongkyun Seo, Seoul KR
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20100052216 | NANO IMPRINT LITHOGRAPHY USING AN ELASTIC ROLLER - Imprint lithography devices and methods of lithography are provided. | 03-04-2010 |