Patent application number | Description | Published |
20090140216 | Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods - An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles. | 06-04-2009 |
20090146105 | Liquid Crystal Photo-Alignment Agent and Liquid Crystal Photo-Alignment Film and Liquid Crystal Display Including the Same - One embodiment of the present invention provides a liquid crystal photo-alignment agent that includes a polyamic acid copolymer including a repeating unit having the following Formula 1 and a repeating unit having the following Formula 2; a polyimide copolymer including a repeating unit having the following Formula 3 and a repeating unit having the following Formula 4; or a combination thereof: | 06-11-2009 |
20100136264 | Liquid Crystal Alignment Agent, and Liquid Crystal Alignment Film and Liquid Crystal Display Including Same - Disclosed are a liquid crystal alignment agent, and a liquid crystal alignment film and a liquid crystal display (LCD) including the same. The liquid crystal alignment agent includes a polymer of polyamic acid, a polyimide, or a combination thereof, and an epoxy compound represented by the following Chemical Formula 1. | 06-03-2010 |
20100155661 | Epoxy Compound for Liquid Crystal Photo-Alignment Agent, Liquid Crystal Photo-Alignment Agent, and Liquid Crystal Photo-Alignment Film - Disclosed is an epoxy compound for a liquid crystal photo-alignment agent, a liquid crystal photo-alignment agent, and a liquid crystal photo-alignment film. The epoxy compound is represented by the following Chemical Formula 1. | 06-24-2010 |
20100163811 | Organic Layer Photosensitive Resin Composition and Organic Layer Fabricated Using Same - Disclosed is an organic layer photosensitive resin composition and an organic layer fabricated using the same. The organic layer photosensitive resin composition includes (A) an organic binder resin, (B) a reactive unsaturated compound, (C) a polymerization initiator, (D) a black pigment including a lactam-based black pigment, and (E) a solvent. | 07-01-2010 |
20110155430 | ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITE AND FILM, AND CIRCUIT CONNECTING STRUCTURE INCLUDING THE SAME - An anisotropic conductive adhesive composite and film includes a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle. | 06-30-2011 |
20110230606 | Liquid Crystal Photo-Alignment Agent and Liquid Crystal Photo-Alignment Film Manufactured Using the Same - Disclosed is a liquid crystal photo-alignment agent and a liquid crystal photo-alignment film manufactured using the same. The liquid crystal photo-alignment agent includes an epoxy compound represented by Chemical Formula 1, and a polymer including a polyamic acid, a polyimide, or a mixture thereof. | 09-22-2011 |
20120141786 | ADHESIVE FILM FOR SEMICONDUCTOR DEVICE - An adhesive film for semiconductor devices, the adhesive film including a base film having a coefficient of linear expansion of about 50 to about 150 μm/m·° C. at 0 to 5° C. | 06-07-2012 |
20120141802 | OPTICAL MEMBER COMPRISING ANISOTROPIC CONDUCTIVE FILM - An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part. | 06-07-2012 |
20120168213 | ANISOTROPIC CONDUCTIVE FILM AND APPARATUS INCLUDING THE SAME - An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa·s to about 10,000 Pa·s at about 30° C. to about 200° C. | 07-05-2012 |
20120168683 | ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the binder part having an ion content of more than 0 ppm to about 100 ppm. | 07-05-2012 |
20130113119 | SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM - A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less. | 05-09-2013 |
20130126788 | Electronic device using anisotropic conductive composition and film - An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, | 05-23-2013 |
20130127038 | SEMICONDUCTOR DEVICE BONDED BY AN ANISOTROPIC CONDUCTIVE FILM - A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer. | 05-23-2013 |
20130154093 | ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE BONDED BY THE SAME - An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: | 06-20-2013 |
20130154095 | SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMPRISING CONDUCTIVE MICROSPHERES - A semiconductor device includes an anisotropic conductive film for connecting the semiconductor device. The anisotropic conductive film includes a first conductive layer that has first conductive particles. The first conductive particles include cores containing silica or a silica composite, and have a 20% K-value ranging from about 7,000 N/mm | 06-20-2013 |
20130154129 | ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE BONDED BY THE SAME - A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst. | 06-20-2013 |
20130161566 | SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM - An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: | 06-27-2013 |
20130161838 | ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE - A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate. | 06-27-2013 |
20130168847 | ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME - An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles. | 07-04-2013 |
20130196129 | ANISOTROPIC CONDUCTIVE FILM AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a first insulating adhesive layer, a conductive adhesive layer, and a second insulating adhesive layer which are sequentially stacked on a base film, wherein an adhesive strength ratio of the second insulating adhesive layer to the first insulating adhesive layer is about 1.1 to about 20. | 08-01-2013 |
20130213691 | ELECTRONIC DEVICE - An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1. | 08-22-2013 |
20130273355 | DICING DIE BONDING FILM - A pressure sensitive dicing die bonding film includes a base film, a pressure sensitive adhesive layer formed on the base film, and a bonding layer formed on the pressure sensitive adhesive layer. An adhesive strength between the pressure sensitive adhesive layer and the bonding layer and an adhesive strength between the pressure sensitive adhesive layer and a ring frame may satisfy the following relation: | 10-17-2013 |
20130281559 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME - An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C. | 10-24-2013 |
20140034882 | ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, wherein the anisotropic conductive film has an electrical conductivity of more than 0 μS/cm to about 100 μS/cm. | 02-06-2014 |
20140042374 | ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the anisotropic conductive film has a halogen ion content of more than 0 ppm to about 100 ppm. | 02-13-2014 |