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Doany

Fuad Doany, Katonah, NY US

Patent application number	Description	Published
20120163811	ULTRA-HIGH BANDWIDTH, MULTIPLE-CHANNEL FULL-DUPLEX, SINGLE-CHIP CMOS OPTICAL TRANSCEIVER - A novel parallel optical module having combined optical signal transmit and receive function for high-speed performance. The optical module includes a plurality, e.g., sixteen 10-Gb/s transmitter and receiver channels for a 160-Gb/s bidirectional aggregate data rate. The module utilizes a single-chip CMOS optical transceiver containing both transmitter and receiver circuits. 16-channel high-speed photodiode (PD) and VCSEL arrays are flip-chip attached to the low-power CMOS IC. The substrate emitting/illuminated VCSEL and PD arrays operate at 985 nm and include collimating lenses integrated into the backside of the substrate. The IC-OE assembly is then flip-chip attached to a high density organic package forming the transceiver optical module. The exclusive use of flip-chip packaging for both the IC-to-optoelectronic (OE) devices and for the IC-to-organic package minimizes the module footprint and associated packaging parasitics.	06-28-2012
20130209026	THROUGH-SUBSTRATE OPTICAL COUPLING TO PHOTONICS CHIPS - An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.	08-15-2013
20150063755	MULTICORE FIBER WAVEGUIDE COUPLER - An optical connector includes a fiber element incorporating one or more optical fibers, the optical fiber including a plurality of cores, and an optical element including an array of optical waveguides arranged in one or more layers so as to match the geometry of the plurality of cores of the optical fiber.	03-05-2015

Patent applications by Fuad Doany, Katonah, NY US

Fuad E. Doany, Katonah, NY US

Patent application number	Description	Published
20080230875	DUV LASER ANNEALING AND STABILIZATION OF SiCOH FILMS - A method of fabricating a dielectric film comprising atoms of Si, C, O and H (hereinafter SiCOH) that has improved insulating properties as compared with prior art dielectric films, including prior art SiCOH dielectric films that are not subjected to the inventive deep ultra-violet (DUV) is disclosed. The improved properties include reduced current leakage which is achieved without adversely affecting (increasing) the dielectric constant of the SiCOH dielectric film. In accordance with the present invention, a SiCOH dielectric film exhibiting reduced current leakage and improved reliability is obtained by subjecting an as deposited SiCOH dielectric film to a DUV laser anneal. The DUV laser anneal step of the present invention likely removes the weakly bonded C from the film, thus improving leakage current.	09-25-2008
20120001166	PARELLEL OPTICAL TRANSCEIVER MODULE - A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer.	01-05-2012
20120001697	DIFFERENTIAL AMPLIFIER STAGE WITH INTEGRATED OFFSET CANCELLATION CIRCUIT - A differential amplifier stage and method for offset cancellation include an amplifier having an input and an output. An internal offset cancellation circuit has an input for receiving a control signal to control offset cancellation in the amplifier. The offset cancellation circuit is integrated with the amplifier but isolated from the input and the output of the amplifier, and, in accordance with its isolation, an impedance of the stage is unaffected by the offset cancellation circuit.	01-05-2012
20120159782	OPTICAL ALIGNMENT MODULE UTILIZING TRANSPARENT RETICLE TO FACILITATE TOOL CALIBRATION DURING HIGH TEMPERATURE PROCESS - An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate.	06-28-2012
20120207426	FLIP-CHIP PACKAGING FOR DENSE HYBRID INTEGRATION OF ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS - A chip system and method includes a photonics chip and an electrical integrated circuit (IC) flip-chip coupled to the photonics chip to form an optochip. The IC or the photonics chip includes an array of bond pads for attachment to the other. The optochip has an array of bond pads for subsequent attachment to a carrier where the photonics chip includes an exposed edge to connect with at least one waveguide.	08-16-2012
20120313704	DIFFERENTIAL AMPLIFIER STAGE WITH INTEGRATED OFFSET CANCELLATION CIRCUIT - A differential amplifier stage and method for offset cancellation include an amplifier having an input and an output. An internal offset cancellation circuit has an input for receiving a control signal to control offset cancellation in the amplifier. The offset cancellation circuit is integrated with the amplifier but isolated from the input and the output of the amplifier, and, in accordance with its isolation, an impedance of the stage is unaffected by the offset cancellation circuit.	12-13-2012
20130084039	LENS ARRAY OPTICAL COUPLING TO PHOTONIC CHIP - A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip and a lens array coupling element. The photonic chip includes a waveguide at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.	04-04-2013
20130142211	PARALLEL OPTICAL TRANSCEIVER MODULE - A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer.	06-06-2013
20130181233	SILICON PHOTONICS WAFER USING STANDARD SILICON-ON-INSULATOR PROCESSES THROUGH SUBSTRATE REMOVAL OR TRANSFER - Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer.	07-18-2013
20130271217	DIFFERENTIAL AMPLIFIER STAGE WITH INTEGRATED OFFSET CANCELLATION CIRCUIT - A differential amplifier stage and method for offset cancellation include an amplifier having an input and an output. An internal offset cancellation circuit has an input for receiving a control signal to control offset cancellation in the amplifier. The offset cancellation circuit is integrated with the amplifier but isolated from the input and the output of the amplifier, and, in accordance with its isolation, an impedance of the stage is unaffected by the offset cancellation circuit.	10-17-2013
20130308900	PARALLEL OPTICAL TRANSCEIVER MODULE - A silicon-on-insulator wafer is provided. The silicon-on-insulator wafer includes a silicon substrate having optical vias formed therein. In addition, an optically transparent oxide layer is disposed on the silicon substrate and the optically transparent oxide layer is in contact with the optical vias. Then, a complementary metal-oxide-semiconductor layer is formed over the optically transparent oxide layer.	11-21-2013
20140304971	GRATING EDGE COUPLER AND METHOD OF FORMING SAME - An apparatus for optical coupling comprises a substrate, a first waveguide formed on the substrate and includes a grating structure directing light in a first direction, and a second waveguide formed on the first waveguide and including an angled portion directing the light in a second direction different from the first direction.	10-16-2014
20140308004	GRATING EDGE COUPLER AND METHOD OF FORMING SAME - An apparatus for optical coupling comprises a substrate, a first waveguide formed on the substrate and includes a grating structure directing light in a first direction, and a second waveguide formed on the first waveguide and including an angled portion directing the light in a second direction different from the first direction.	10-16-2014
20150063768	OPTICAL WAVEGUIDE STRUCTURE WITH WAVEGUIDE COUPLER TO FACILITATE OFF-CHIP COUPLING - Aspects of the invention are directed to a method for forming an optical waveguide structure. Initially, a base film stack is received with an optical waveguide feature covered by a lower dielectric layer. An etch stop feature is then formed on the lower dielectric layer, and an upper dielectric layer is formed over the etch stop feature. Subsequently, a trench is patterned in the upper dielectric layer and the etch stop feature at least in part by utilizing the etch stop feature as an etch stop. Lastly, a waveguide coupler feature is formed in the trench, at least a portion of the waveguide coupler feature having a refractive index higher than the lower dielectric layer and the upper dielectric layer. The waveguide coupler feature is positioned over at least a portion of the optical waveguide feature but is separated from the optical waveguide feature by a portion of the lower dielectric layer.	03-05-2015
20150289406	HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS - A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.	10-08-2015
20150346431	OPTICAL WAVEGUIDE STRUCTURE WITH WAVEGUIDE COUPLER TO FACILITATE OFF-CHIP COUPLING - Aspects of the invention are directed to a method for forming an optical waveguide structure. Initially, a base film stack is received with an optical waveguide feature covered by a lower dielectric layer. An etch stop feature is then formed on the lower dielectric layer, and an upper dielectric layer is formed over the etch stop feature. Subsequently, a trench is patterned in the upper dielectric layer and the etch stop feature at least in part by utilizing the etch stop feature as an etch stop. Lastly, a waveguide coupler feature is formed in the trench, at least a portion of the waveguide coupler feature having a refractive index higher than the lower dielectric layer and the upper dielectric layer. The waveguide coupler feature is positioned over at least a portion of the optical waveguide feature but is separated from the optical waveguide feature by a portion of the lower dielectric layer.	12-03-2015
20160091664	POLARIZATION-INDEPENDENT GRATING COUPLER FOR SILICON ON INSULATOR - A grating structure has a plurality of gratings. In one example, one or more of the gratings are configured: to be non-uniformly spaced with respect to one or more other ones of the gratings; and to optically couple a first light conduit and a second light conduit enabling light having a first polarization and light having a second polarization to pass through the grating structure and propagate in the same direction in the first light conduit or the second light conduit. The non-uniform spacing of the gratings may represent an intersection or a union of a period associated with the light having the first polarization and a period associated with the light having the second polarization.	03-31-2016

Patent applications by Fuad E. Doany, Katonah, NY US

Fuad E. Doany, Yorktown Heights, NY US

Patent application number	Description	Published
20110119909	ALIGNMENT MODULE UTILIZING TRANSPARENT RETICLE TO FACILITATE TOOL CALIBRATION DURING THE HIGH TEMPERATURE PROCESS - An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate.	05-26-2011

Fuad E. Doany, New York, NY US

Patent application number	Description	Published
20160094295	NEAR-THRESHOLD OPTICAL TRANSMITTER PRE-DISTORTION - Methods an systems for low-power transmission include biasing an emitter in a non-linear operating range of the emitter near a threshold current of the emitter. A data signal is distorted to add a precursor pulse to a rising edge of a data waveform to quickly bring the emitter into a linear operating range. The distorted data signal is transmitted at the emitter.	03-31-2016

Fuad Elias Doany, Katonah, NY US

Patent application number	Description	Published
20080282742	DEVICES AND METHODS FOR SIDE-COUPLING OPTICAL FIBERS TO OPTOELECTRONIC COMPONENTS - Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.	11-20-2008
20120014639	PACKAGED MULTICORE FIBER OPTICAL TRANSCEIVER MODULE - A method and structure for coupling to a plurality of multicore optical fiber strands. A first plurality of optoelectronic devices is provided on a surface of a substrate, the first optoelectronic devices being arranged in a 2D array pattern that corresponds to a 2D array pattern corresponding to different light cores of a first multicore optical fiber. A second plurality of optoelectronic devices is provided on the surface of the substrate, the second optoelectronic devices being arranged in a 2D array pattern that corresponds to a 2D array pattern corresponding to different light cores of a second multicore optical fiber. Each optoelectronic device on the substrate surface provides one of a receive function and a transmit function for interacting with a corresponding core of a multicore optical fiber strand.	01-19-2012

Patent applications by Fuad Elias Doany, Katonah, NY US

Ziyad H. Doany, Austin, TX US

Patent application number	Description	Published
20120068823	MAGNETOMECHANICAL MARKERS FOR MARKING STATIONARY ASSETS - An article, system and method related to a magnetomechanical marker used to mark stationary assets. Magnetomechanical markers can be arranged in clusters and associated with stationary assets, including assets buried underground. Markers can be associated with an asset by being attached to the asset, arranged in a particular spatial relationship with the asset, or in any other appropriate way. A portable locating device can be used to generate an alternating magnetic field to activate the magnetomechanical marker and thus locate the asset.	03-22-2012
20120325359	FLEXIBLE MAGNETIC CORE ELECTRONIC MARKER - An electronic marker and method of making an electronic marker for marking obscured articles. The marker includes a core made of flexible, and sometimes high permeability magnetic material and a solenoid disposed around the core. A capacitor is electrically coupled with the solenoid, and the marker is tuned to respond to a signal at a characteristic resonant frequency. The marker can attached to a conduit to be buried underground. The marker can further include a radio frequency identification chip.	12-27-2012
20130099790	MULTI-AXIS MARKER LOCATOR - A portable locator for locating an obscured marker. The locator includes a portable locator housing, a first antenna disposed within the housing, a second antenna disposed orthogonally to the antenna within the housing; and a processor. The processor is configured to interact with each of the first and second antennas, such that each of the first and second antennas is configured to transmit and receive signals. The locator may include more than two antennas, and may include multiple sets of antennas.	04-25-2013
20150226872	MAGNETOMECHANICAL MARKERS FOR MARKING STATIONARY ASSETS - An article, system and method related to a magnetomechanical marker used to mark stationary assets. Magnetomechanical markers can be arranged in clusters and associated with stationary assets, including assets buried underground. Markers can be associated with an asset by being attached to the asset, arranged in a particular spatial relationship with the asset, or in any other appropriate way. A portable locating device can be used to generate an alternating magnetic field to activate the magnetomechanical marker and thus locate the asset.	08-13-2015

Patent applications by Ziyad H. Doany, Austin, TX US