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| 20140082182 | SPAM FLOOD DETECTION METHODOLOGIES - A computer-implemented method analyzes a website to determine whether the website represents a potential source of spam, and, in response to the analyzing, flags content of the website as spam content. The determination can be made by computing a total number of content items associated with the website, calculating a publication frequency of the content items, and determining whether the website in its entirety represents spam content based on the total number and the publication frequency. The determination could also be made by generating a signature of a webpage containing a content item, obtaining an occurrence count for the generated characterizing signature, and, when the obtained occurrence count is greater than a threshold count, identifying the content item as spam. | 03-20-2014 |
| 20140082183 | DETECTION AND HANDLING OF AGGREGATED ONLINE CONTENT USING CHARACTERIZING SIGNATURES OF CONTENT ITEMS - A computer-implemented method is disclosed herein. The method obtains a first content item from an online source, and selects only a portion of the words in the first content item, in accordance with a defined selection algorithm. The method continues by generating a characterizing signature of the first content item, wherein the characterizing signature is derived from the selected words. The method continues by finding a previously-saved instance of the characterizing signature, retrieving data associated with a second content item (which is linked to the saved characterizing signature), and comparing the data associated with the second content item against corresponding data associated with the first content item. The first content item or the second content item is identified as an original content item, based on the comparing. The other content item is flagged as an aggregated content item. | 03-20-2014 |
| 20140082755 | DETECTION AND HANDLING OF AGGREGATED ONLINE CONTENT USING DECISION CRITERIA TO COMPARE SIMILAR OR IDENTICAL CONTENT ITEMS - A computer-implemented method is presented herein. The method obtains a first content item from an online source, and then generates a characterizing signature of the first content item. The method continues by finding a previously-saved instance of the characterizing signature and retrieving data associated with a second content item (the second content item is characterized by the characterizing signature). The method continues by analyzing the data associated with the second content item, corresponding data associated with the first content item, and decision criteria. Thereafter, either the first content item or the second content item is identified as an original content item, based on the analyzing. The other content item can be flagged as an aggregated content item. | 03-20-2014 |
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| 20100297941 | REMOTE CONTROL SYSTEM AND METHOD EMPLOYING CELLULAR TELEPHONES WHICH INCLUDE SHORT RANGE RADIO TRANSCEIVERS - A novel remote control system and method is disclosed which includes a user control and a control module. The system employs one or more cellular telephones as the user control which reduces the cost of the system. Further, by employing the inherent functionality of the cellular telephone, novel modes of interacting with the control module and the target devices it is connected to can be achieved. In the case of the cellular telephone being a smartphone, more advanced modes of interacting with the control module and the target devices can be achieved. Examples of target devices controlled by the system and method include, without limitation, electric garage door openers, lighting systems, thermostats, alarm systems, etc. | 11-25-2010 |
| 20110081947 | INTERACTIVE EVENT GUIDE WITH ENHANCED FEATURES - A novel interactive event guide system and method which allows users to select events from a set of event listings and to obtain additional information and/or services relevant to the selected events. The additional information and/or services can include access to E-commerce sites offering products related to an event selected from the event listings, access to sites offering additional information relating to products advertised during a selected event and/or products advertised by product placements within a selected event and/or access to social networking services. Demographic information about the user can be provided to an advertiser of a selected event to allow the advertiser to provide appropriate additional information to the user and/or to allow the advertiser to better analyze the success of their advertisement. | 04-07-2011 |
| 20110287757 | REMOTE CONTROL SYSTEM AND METHOD - A remote control system and method for controlling and interacting with a variety of devices and systems is disclosed. The system comprises at least one command server which is operable to receive control commands from a handheld communications device and to generate and transmit command signals in response to the received control commands, the transmitted command signals interacting with one or more devices controlled by the system. In one embodiment, the handheld communications device is operable to exchange data with an account server that maintains data and configuration information for the system and the devices to be controlled by it over a first communications modality. The handheld communications device transfers control commands and other data with the command server via a second communications modality and the handheld communications device can transfer data between the account server and the command server as needed. The system can support multiple devices to be controlled, multiple command servers, which can each be associated with one or more devices to be controlled, and multiple handheld communications devices. | 11-24-2011 |
| 20140376919 | Remote Control System and Method - A remote control system and method for controlling and interacting with a variety of devices and systems is disclosed. The system comprises at least one command server which is operable to receive control commands from a handheld communications device and to generate and transmit command signals in response to the received control commands, the transmitted command signals interacting with one or more devices controlled by the system. In one embodiment, the handheld communications device is operable to exchange data with an account server that maintains data and configuration information for the system and the devices to be controlled by it over a first communications modality. The handheld communications device transfers control commands and other data with the command server via a second communications modality and the handheld communications device can transfer data between the account server and the command server as needed. The system can support multiple devices to be controlled, multiple command servers, which can each be associated with one or more devices to be controlled, and multiple handheld communications devices. | 12-25-2014 |
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| 20130026448 | LIGHT EMITTING DIODE (LED) DIE HAVING PERIPHERAL ELECTRODE FRAME AND METHOD OF FABRICATION - A light emitting diode (LED) die includes a first-type semiconductor layer, a multiple quantum well (MQW) layer and a second-type semiconductor layer. The light emitting diode (LED) die also includes a peripheral electrode on the first-type semiconductor layer located proximate to an outer periphery of the first-type semiconductor layer configured to spread current across the first-type semiconductor layer. A method for fabricating the light emitting diode (LED) die includes the step of forming an electrode on the outer periphery of the first-type semiconductor layer at least partially enclosing and spaced from the multiple quantum well (MQW) layer configured to spread current across the first-type semiconductor layer. | 01-31-2013 |
| 20130057156 | LIGHT EMITTING DIODE (LED) SYSTEM HAVING LIGHTING DEVICE AND WIRELESS CONTROL SYSTEM - A light emitting diode (LED) system includes one or more light emitting diodes (LED), or other lighting devices, configured to provide lighting in an area, and a wireless control system configured to control the light emitting diodes (LED). The wireless control system includes at least one transmitter/receiver device in signal communication with the light emitting diode (LED), and a wireless control device operable by a user, configured to send input signals to the transmitter/receiver device for controlling the light emitting diode (LED), and to receive output signals from the transmitter/receiver device for indicating a status of the light emitting diodes (LED). | 03-07-2013 |
| 20130057178 | LIGHT EMITTING DIODE (LED) SYSTEM HAVING APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) AND WIRELESS SYSTEM - A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC) die on the substrate having a pair of power contacts, at least one light emitting diode (LED) on the substrate controlled by the application specific integrated circuit (ASIC) die, a wireless receiver on the substrate configured to receive signals for controlling the application specific integrated circuit (ASIC) die, and a wireless transmitter in signal communication with the wireless receiver configured to send the signals. | 03-07-2013 |
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| 20120092852 | LLB BULB HAVING LIGHT EXTRACTING ROUGH SURFACE PATTERN (LERSP) AND METHOD OF FABRICATION - A LLB bulb includes a base, a LED light source configured to emit electromagnetic radiation, and a lens/cover having a light extracting rough surface pattern (LERSP) configured to reduce glare and reflection in the LLB bulb without light loss. A method for fabricating the LLB bulb includes the steps of providing the lens/cover, and forming the light extracting rough surface pattern (LERSP) on the lens/cover. The lens/cover can be fabricated with the light extracting rough surface pattern (LERSP) using a process such as bead blasting, sand blasting, etching (chemical or plasma), or molding. | 04-19-2012 |
| 20130062639 | METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DEVICES HAVING OUTPUT WITH SELECTED CHARACTERISTICS - A method for fabricating a light emitting diode (LED) device includes the steps of forming (or providing) a plurality of LED dice, forming a plurality of wavelength conversions layers, and then evaluating at least one electromagnetic radiation emission characteristic of each LED die and at least one color characteristic of each wavelength conversion layer. The method also includes the steps of comparing the evaluated characteristic of each LED die and the evaluated characteristic of each wavelength conversion layer to a database, selecting a selected LED die and a selected wavelength conversion layer based on the evaluating and comparing steps, and then attaching the selected wavelength conversion layer to the selected LED die. | 03-14-2013 |
| 20130062640 | LIGHT EMITTING DIODE (LED) PACKAGE HAVING WAVELENGTH CONVERSION MEMBER AND WAFER LEVEL FABRICATION METHOD - A light emitting diode (LED) package includes a substrate and a light emitting diode (LED) die on the substrate configured to emit electromagnetic radiation in a first spectral region. The (LED) package also includes a dielectric layer on the (LED) die and a wavelength conversion member on the dielectric layer configured to convert the electromagnetic radiation in the first spectral region to electromagnetic radiation in a second spectral region. The (LED) package also includes an interconnect comprising a conductive trace on the wavelength conversion member and on the dielectric layer in electrical contact with a die contact on the (LED) die and with a conductor on the substrate, and a transparent dome configured as a lens encapsulating the (LED) die. | 03-14-2013 |
| 20130248816 | Light Emitting Diode (LED) Die Having Recessed Electrode And Light Extraction Structures And Method Of Fabrication - A light emitting diode (LED) die includes a semiconductor substrate having an n-type confinement layer, a multiple quantum well (MQW) layer in electrical contact with the n-type confinement layer configured to emit electromagnetic radiation, a p-type confinement layer in electrical contact with the multiple quantum well (MQW) layer; multiple light extraction structures on the n-type confinement layer configured to scatter the electromagnetic radiation; and an electrode in a recess embedded in the n-type confinement layer proximate to the light extraction structures. A method of fabrication includes: forming the semiconductor substrate; forming a recess in the n-type confinement layer having sidewalls and a planar bottom surface; forming an electrode in the recess comprising a conductive material conforming to the sidewalls and to the bottom surface of the recess; planarizing the electrode; and forming a plurality of light extraction structures in the n-type confinement layer proximate to the electrode. | 09-26-2013 |
| 20130250139 | Method And System For Tagging And Organizing Images Generated By Mobile Communications Devices - A method for tagging and organizing images includes the steps of providing a mobile communication device having an input device configured to receive voice input, an image capture device configured to capture the images of events, a storage medium configured to store the images, and a processor. The method also includes the steps of capturing the images using the image capture device; providing the voice input from the user containing the information; recording the voice input; and forming tagged images in the storage medium using the voice input and the information. A system includes a mobile communications device having a processor in signal communication with an image capture device, with a storage medium and with an input device configured to tag the images with information responsive to voice input and to form tagged images in the storage medium. | 09-26-2013 |
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| 20100264432 | LIGHT EMITTING DEVICE WITH HIGH COLOR RENDERING INDEX AND HIGH LUMINESCENCE EFFICIENCY - A light emitting device comprises two light-emitting diode (LED) groups, a group of luminophor layers, and an input terminal. The first LED group includes at least one blue LED emitting light having a dominant wavelength in a range between 400 nm and 480 nm, and the second LED group includes at least one red-orange LED emitting light having a dominant wavelength in a range between 610 nm and 630 nm. The group of luminophor layers, which are selected from one of silicates, nitrides, and nitrogen oxides, are positioned above the first LED group and partially converts the light emitted by the first LED group into light having a dominant wavelength in a range between 500 nm and 555 nm. The input terminal is connected to the two LED groups for providing desired electric energy thereto. | 10-21-2010 |
| 20110037082 | Smart Integrated Semiconductor Light Emitting System Including Light Emitting Diodes And Application Specific Integrated Circuits (ASIC) - A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC) on the substrate, and at least one light emitting diode (LED) on the substrate in electrical communication with the application specific integrated circuit (ASIC). The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated system having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions. | 02-17-2011 |
| 20110309390 | Lighting Device Comprising Leds With Phosphor Layers - A lighting device comprising LEDs with phosphor layers includes a plurality of LED sets which can emit light with a peak emission wavelength between 360 nm and 490 nm; and a plurality of sets of phosphor layers covering the corresponding LED sets among the plurality of LED sets. At least two of the plurality of LED sets respectively have peak emission wavelength different from each other. The dominant fluorescence wavelength of at least one of the plurality of sets of phosphor layers ranges from 500 nm to 580 nm, and the dominant fluorescence wavelength of at least one of the other sets of phosphor layers ranges from 590 nm to 650 nm. | 12-22-2011 |
| 20120091466 | Smart Integrated Semiconductor Light Emitting System Including Nitride Based Light Emitting Diodes (LED) And Application Specific Integrated Circuits (ASIC) - A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC), and at least one light emitting diode (LED) that includes a Group-III nitride based material such as GaN, InGaN, AlGaN, AlInGaN or other (Ga, In or Al) N-based materials. The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated LED circuit having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions. | 04-19-2012 |
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| 20090093075 | METHOD OF SEPARATING SEMICONDUCTOR DIES - A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies. | 04-09-2009 |
| 20110217799 | METHOD OF SEPARATING SEMICONDUCTOR DIES - A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies. | 09-08-2011 |
| 20110316034 | Side By Side Light Emitting Diode (LED) Having Separate Electrical And Heat Transfer Paths And Method Of Fabrication - A light emitting diode includes a thermal conductive substrate having at least one electrical isolation layer configured to provide vertical electrical isolation and a heat transfer path through the substrate from a front side (first side) to a back side (second side) thereof. The light emitting diode includes an anode having a through interconnect, and a cathode having a through interconnect, which are arranged side by side on the substrate. The light emitting diode also includes a LED chip mounted to the substrate between the anode and the cathode. A method for fabricating the light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect. | 12-29-2011 |
| 20120074384 | PROTECTION FOR THE EPITAXIAL STRUCTURE OF METAL DEVICES - Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non-(or low) thermally conductive and/or non-(or low) electrically conductive carrier substrate that has been removed. | 03-29-2012 |
| 20130302926 | METHOD FOR FABRICATING SEMICONDUCTOR DICE BY SEPARATING A SUBSTRATE FROM SEMICONDUCTOR STRUCTURES USING MULTIPLE LASER PULSES - A method for fabricating semiconductor dice includes the steps of providing a wafer assembly having a substrate and semiconductor structures on the substrate; and defining the semiconductor dice on the substrate. The method also includes the step of separating the substrate from the semiconductor structures by applying a first laser pulse to each semiconductor die on the substrate having first parameters selected to break an interface between the substrate and the semiconductor structures and then applying a second laser pulse to each semiconductor die on the substrate having second parameters selected to complete separation of the substrate from the semiconductor structures. The method can also include the steps of forming one or more intermediate structures between the semiconductor dice on the substrate configured to protect the semiconductor dice during the separating step. | 11-14-2013 |
| 20130337590 | METHOD FOR FABRICATING SIDE BY SIDE LIGHT EMITTING DIODE (LED) HAVING SEPARATE ELECTRICAL AND HEAT TRANSFER PATHS - A method for fabricating a light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect. | 12-19-2013 |
| 20140051197 | METHOD FOR FABRICATING A VERTICAL LIGHT EMITTING DIODE (VLED) DIE HAVING EPITAXIAL STRUCTURE WITH PROTECTIVE LAYER - A method for fabricating a vertical light emitting diode (VLED) die includes the steps of: providing a substrate; forming an epitaxial structure on the substrate; forming an electrically insulative insulation layer covering the lateral surfaces of the epitaxial structure; forming an electrically non-conductive material on the electrically insulative insulation layer; and forming a mirror on the p-doped layer, with the electrically insulative insulation layer configured to protect the epitaxial structure during formation of the mirror. | 02-20-2014 |
| 20140087499 | METHOD FOR HANDLING A SEMICONDUCTOR WAFER ASSEMBLY - Systems and methods for fabricating a light emitting diode include forming a multilayer epitaxial structure above a carrier substrate; depositing at least one metal layer above the multilayer epitaxial structure; removing the carrier substrate. | 03-27-2014 |
| 20140151630 | PROTECTION FOR THE EPITAXIAL STRUCTURE OF METAL DEVICES - Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non-(or low) thermally conductive and/or non-(or low) electrically conductive carrier substrate that has been removed. | 06-05-2014 |
| 20140154821 | METHOD FOR FABRICATING VERTICAL LIGHT EMITTING DIODE (VLED) STRUCTURE USING A LASER PULSE TO REMOVE A CARRIER SUBSTRATE - A method for fabricating a vertical light-emitting diode (VLED) structure includes the steps of providing a carrier substrate, and forming a semiconductor structure on the carrier substrate having a p-type confinement layer, a multiple quantum well (MQW) layer in electrical contact with the p-type confinement layer configured to emit electromagnetic radiation, and an n-type confinement layer in electrical contact with the multiple quantum well (MQW) layer. The method also includes the steps of removing the carrier substrate using a laser pulse to expose an inverted surface of the n-type confinement layer, and forming a metal contact on the surface of the n-type confinement layer. | 06-05-2014 |
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| 20140061585 | LIGHT EMITTING DIODE - The present invention provides a light emitting diode, which comprises a first LED die and a second LED die, each die comprising a first semi-conductive layer, a second semi-conductive layer, and a multiple quantum well layer disposed between the first and the second semi-conductive layers, wherein the first semi-conductive layer of the first LED die is coupled to the second semi-conductive layer of the second LED die so as to form a serially connected structure whereby the consuming current and heat generation of the light emitting diode are lowered so that the size of heat dissipating device for the light emitting diode can be reduced and illumination of the light emitting diode can be enhanced. | 03-06-2014 |
| 20140070164 | LIGHT EMITTING DIODE - The present invention provides a light emitting diode, which comprises a first LED die, a second LED die, and a dummy LED die, wherein the second LED die is disposed between the first LED die and the dummy LED die, and each die comprises a first semi-conductive layer, a second semi-conductive layer, and a multiple quantum well layer disposed between the first and the second semi-conductive layers. The first semi-conductive layer of the first LED die is coupled to the second semi-conductive layer of the second LED die, and the first semi-conductive layer of the second LED die is coupled to the first and second semi-conductive layers of the dummy LED die. | 03-13-2014 |
