Patent application number | Description | Published |
20080220202 | LAMINATED SUBSTRATES FOR MOUNTING ELECTRONIC PARTS AND METHODS FOR MAKING SAME - A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps:
| 09-11-2008 |
20120139003 | OPTOELECTRONIC COMPONENT - An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body. | 06-07-2012 |
20130215584 | LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT - The invention relates to methods for producing a laminate for contacting an electronic component, in which an insulating layer is arranged between first and second metal layers. The method includes contacting the metal layers to each other in a contact region, generating a recess in the insulating layer, laminating the metal layers to the insulating layer, generating a notch for accommodating the electronic component in the contact region in the first metal layer, inserting the electronic component in a depression in the laminate formed through a notch and recess. The electronic component is connected in a conductive manner to the second metal layer, such that an entire circumference of the electronic component is accommodated in the recess and/or notch, and at least part of the height of the electronic component is accommodated in the notch and/or recess. The invention also relates to such a laminate for contacting an electronic component. | 08-22-2013 |
20130223032 | CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES - A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator. | 08-29-2013 |
Patent application number | Description | Published |
20110218356 | Carbonylation process catalysed by mordenite supported on inorganic oxides - A process for the preparation of methyl acetate and/or acetic acid by carbonylating dimethyl ether and/or methanol with carbon monoxide in the presence of a catalyst, which catalyst is a H-mordenite bound with a mesoporous binder selected from silicas, aluminas, silica-aluminas, magnesium silicates and magnesium aluminum silicates. | 09-08-2011 |
20110224462 | HYDROGENATION OF ETHANOIC ACID TO PRODUCE ETHANOL - The present invention relates to a process for producing methanol and ethanol, wherein the methanol is produced from synthesis gas and the ethanol is produced via the hydrogenation of an ethanoic acid feed; characterised in that the hydrogenation of the ethanoic acid feed is carried out within the same alcohol synthesis unit and in the presence of the same catalyst(s) that is used to produce the methanol from the synthesis gas and wherein the feed introduced to the alcohol synthesis unit comprises synthesis gas and ethanoic acid. | 09-15-2011 |
20110237825 | CARBONYLATION PROCESS USING BOUND SILVER AND/OR COPPER MORDENITE CATALYSTS - A process for the carbonylation of dimethyl ether and/or methanol with carbon monoxide to produce methyl acetate and/or acetic acid in the presence of a catalyst formed by compositing a mordenite loaded with silver and/or copper, with an inorganic oxide binder. | 09-29-2011 |
20120101298 | CARBONYLATION PROCESS - A process for the production of acetic acid and/or methyl acetate by carbonylating methanol and/or reactive derivatives thereof with carbon monoxide in the presence of a catalyst which is a mordenite which has been treated with an aqueous basic solution containing at least one of aluminate ions and gallate ions and has a silica:X | 04-26-2012 |
20150375217 | DEHYDRATION-HYDROLYSIS PROCESSES AND CATALYSTS THEREFOR - Crystalline zeolites having a FER framework type wherein the crystallites have a dimension in the c-axis of about 500 nanometres (nm) or less, a method for their preparation and a process for the co-production of acetic acid and dimethyl ether comprising the step of contacting methyl acetate and methanol in the presence of catalysts comprising the crystalline zeolites. | 12-31-2015 |
Patent application number | Description | Published |
20100063315 | PROCESS FOR THE CARBONYLATION OF DIMETHYL ETHER - Production of methyl acetate by carbonylating a dimethyl ether feed with carbon monoxide in the presence of hydrogen under substantially anhydrous conditions, in the presence of a zeolite catalyst at a temperature in the range of greater than 250° C. to 350° C. and a dimethyl ether concentration of at least 1 mol %. | 03-11-2010 |
20100121099 | PROCESS FOR THE CARBONYLATION OF DIMETHYL ETHER - Production of methyl acetate by carbonylating a dimethyl ether feed with carbon monoxide under substantially anhydrous conditions, in the presence of a zeolite catalyst at a temperature in the range 240° C. to 350° C. and in the presence of hydrogen. | 05-13-2010 |
20100274045 | CARBONYLATION PROCESS FOR THE PRODUCTION OF METHYL ACETATE - A process for the manufacture of methyl acetate by the carbonylation of dimethyl ether or dimethyl carbonate with carbon monoxide under substantially anhydrous conditions in the presence of a Group TB metal loaded mordenite catalyst prepared by ion-exchanging mordenite with at least one Group IB metal, the ion-exchanged mordenite having a molar ratio of the Group IB metal to total aluminium present in the mordenite in the range 5 to 50 mol %. | 10-28-2010 |
20100311567 | REGENERATION OF ZEOLITE CARBONYLATION CATALYSTS - A process for the in-situ regeneration of a zeolite catalyst in a carbonylation process for the production of at least one of methyl acetate and acetic acid by contacting methanol, dimethyl ethyl or dimethyl carbonate with carbon monoxide in the presence of a zeolite catalyst, ceasing contact of the catalyst with the reactant, regenerating the catalyst with a regenerating gas selected from hydrogen or a mixture of hydrogen and carbon monoxide at a temperature in the range 250 to 600° C., terminating the hydrogen regenerating step and resuming contact of the catalyst with the reactant and carbon monoxide. | 12-09-2010 |
Patent application number | Description | Published |
20100198457 | SYSTEM AND METHOD FOR ADAPTIVE MOUNTING AN ASSEMBLY - A system for mounting an assembly, such as a motor vehicle engine, on a supporting structure such as a vehicle body. Disposed between the assembly and the supporting structure is a soft mount and/or a soft rubber spring featuring a damping and/or spring excursion along which the soft mount damps and/or adapts the load acting on the assembly. Also, disposed between the supporting structure and the assembly is an actuator which communicates an adaptive reaction force. A displacement of the assembly caused by the load along the damping or spring excursion of the soft mount or of the rubber spring can be cancelled out by a counter motion of the assembly prompted by the actuator. | 08-05-2010 |
20120067681 | COUPLING MEMBER AND MULTIPLE POINT CONNECTION - For an elastic coupling member for a three (or more) point connection of a vibration absorber mass, like a gas generator for an airbag, to a motor vehicle part exposed to vibrations or oscillations, like a steering wheel structure, comprising a sleeve-shaped spring body firmly connectable to the vibration absorber mass and the motor vehicle part and having an axial direction, it is provided that the spring body has a different shape in its first radial sectional plane, in particular a vertical radial sectional plane, compared to a second, in particular horizontal radial section plane circumferentially offset from the first one. | 03-22-2012 |
20120306119 | ELASTIC COUPLING DEVICE, DAMPING ARRANGEMENT AND METHOD FOR MANUFACTURING THE ELASTIC COUPLING PIECE - An elastic coupling device for elastically connecting a damping mass like a gas generator to a motor vehicle part exposed to oscillations and/or vibrations, in particular an airbag module, in one embodiment comprising a rigid support ring facing the vehicle, at least one fixation piece like a rivet head, the fixation piece facing the damping mass and being made of a rigid material, and a spring body coupling the support ring and the fixation piece. The support ring and/or the fixation piece, respectively made of a plastic material, as well as the spring body, which may be made of an elastomer material, may be produced in a single manufacturing step by means of a two-component process, in particular by two-component injection moulding. | 12-06-2012 |