Deorio
Andrew Deorio, Ann Arbor, MI US
Patent application number | Description | Published |
---|---|---|
20110257955 | Gate-Level Logic Simulator Using Multiple Processor Architectures - Techniques for simulating operation of a connectivity level description of an integrated circuit design are provided, for example, to simulate logic elements expressed through a netlist description. The techniques utilize a host processor selectively partitioning and optimizing the descriptions of the integrated circuit design for efficient simulation on a parallel processor, more particularly a SIMD processor. The description may be segmented into cluster groups, for example macro-gates, formed of logic elements, where the cluster groups are sized for parallel simulation on the parallel processor. Simulation may occur in an oblivious as well as event-driven manner, depending on the implementation. | 10-20-2011 |
James Deorio, Durham, NC US
Patent application number | Description | Published |
---|---|---|
20110282397 | Ankle Fusion Device, Instrumentation and Methods - An ankle fusion device has a proximal portion generally aligned with a first longitudinal axis. The proximal portion includes a proximal end and a first fastener hole. The proximal portion has an arcuate curve such that the proximal end is spaced a distance from the first longitudinal axis in a first direction. The first fastener hole is configured to receive a first fastener along a first fastener axis. A distal portion of the ankle fusion device extends to a distal end from the proximal portion along a second longitudinal axis. The second longitudinal axis is angled in second and third directions relative to the first longitudinal axis. The second direction is perpendicular to the first direction and the third direction being opposite the first direction. The distal portion includes a second fastener hole configured to receive a second fastener along a second fastener axis. | 11-17-2011 |
20140025127 | Ankle Fusion Device, Instrumentation and Methods - An ankle fusion device has a proximal portion generally aligned with a first longitudinal axis. The proximal portion includes a proximal end and a first fastener hole. The proximal portion has an arcuate curve such that the proximal end is spaced a distance from the first longitudinal axis in a first direction. The first fastener hole is configured to receive a first fastener along a first fastener axis. A distal portion of the ankle fusion device extends to a distal end from the proximal portion along a second longitudinal axis. The second longitudinal axis is angled in second and third directions relative to the first longitudinal axis. The second direction is perpendicular to the first direction and the third direction being opposite the first direction. The distal portion includes a second fastener hole configured to receive a second fastener along a second fastener axis. | 01-23-2014 |
James K. Deorio, Durham, NC US
Patent application number | Description | Published |
---|---|---|
20120130376 | SURGICAL INSTRUMENTATION AND METHODS OF USE FOR IMPLANTING A PROSTHESIS - A tissue resection guide for use with a datum includes a base releasably engagable with the datum. The tissue resection guide has a first frame fixed relative to the base and the first frame has at least one integral first guide path that is sized and configured to at least partially capture and guide a first tissue resection tool relative to the first frame. | 05-24-2012 |
Lori Ann Deorio, Irvine, CA US
Patent application number | Description | Published |
---|---|---|
20140307394 | APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES - Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection. | 10-16-2014 |