Patent application number | Description | Published |
20080200008 | BONDING INTERFACE QUALITY BY COLD CLEANING AND HOT BONDING - The invention relates to improvements in a method for molecularly bonding first and second substrates together by placing them in surface to surface contact. The improvement includes, prior to placing the substrates in contact, cleaning the surface of one or both of the substrates in a manner to provide a cleaned surface that is slightly roughened compared to a conventionally polished surface, and heating at least one or both of the substrates prior to placing the substrates in contact while retaining the heating at least until the substrates are in surface to surface contact. | 08-21-2008 |
20100093152 | METHOD OF BONDING TWO SUBSTRATES - The invention relates to a method of forming a structure comprising a thin layer of semiconductor material transferred from a donor substrate onto a second substrate, wherein two different atomic species are co-implanted under certain conditions into the donor substrate so as to create a weakened zone delimiting the thin layer to be transferred. The two different atomic species are implanted so that their peaks have an offset of less than 200 Å in the donor substrate, and the substrates are bonded together after roughening at least one of the bonding surfaces. | 04-15-2010 |
20120001293 | SEMICONDUCTOR ON GLASS SUBSTRATE WITH STIFFENING LAYER AND PROCESS OF MAKING THE SAME - A semiconductor-on-glass substrate having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer or layers placed between the silicon film and the glass in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the ion implantation thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film. | 01-05-2012 |
20120088350 | METHOD FOR MOLECULAR BONDING OF SILICON AND GLASS SUBSTRATES - The present invention concerns a method for bonding a first substrate having a first surface to a second substrate having a second surface. This method includes the steps of holding the first substrate by at least two support points, positioning the first substrate and the second substrate so that the first surface and the second surface face each other, deforming the first substrate by applying between at least one pressure point and the two support points a strain toward the second substrate, bringing the deformed first surface and the second surface into contact, and progressively releasing the strain to facilitate bonding of the substrates while minimizing or avoiding the trapping of air bubbles between the substrates. | 04-12-2012 |
20120319121 | METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR STRUCTURE HAVING LOW ELECTRICAL LOSSES, AND CORRESPONDING STRUCTURE - A manufacturing process for a semiconductor-on-insulator structure having reduced electrical losses and which includes a support substrate made of silicon, an oxide layer and a thin layer of semiconductor material, and a polycrystalline silicon layer interleaved between the support substrate and the oxide layer. The process includes a treatment capable of conferring high resistivity to the support substrate prior to formation of the polycrystalline silicon layer, and then conducting at least one long thermal stabilization on the structure at a temperature not exceeding 950° C. for at least 10 minutes. | 12-20-2012 |
20130071997 | METHOD FOR REDUCING IRREGULARITIES AT THE SURFACE OF A LAYER TRANSFERRED FROM A SOURCE SUBSTRATE TO A GLASS-BASED SUPPORT SUBSTRATE - A method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate, by generating a weakening zone in the source substrate; contacting the source substrate and the glass-based support substrate; and splitting the source substrate at the weakening zone; wherein the glass-based substrate has a thickness of between 300 μm and 600 μm. | 03-21-2013 |
20130130473 | SEMICONDUCTOR ON GLASS SUBSTRATE WITH STIFFENING LAYER AND PROCESS OF MAKING THE SAME - A semiconductor-on-glass substrate having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer or layers placed between the silicon film and the glass in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the ion implantation thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film. | 05-23-2013 |
20130309841 | METHOD FOR MOLECULAR BONDING OF SILICON AND GLASS SUBSTRATES - The present invention concerns a method for bonding a first substrate having a first surface to a second substrate having a second surface. This method includes the steps of holding the first substrate by at least two support points, positioning the first substrate and the second substrate so that the first surface and the second surface face each other, deforming the first substrate by applying between at least one pressure point and the two support points a strain toward the second substrate, bringing the deformed first surface and the second surface into contact, and progressively releasing the strain to facilitate bonding of the substrates while minimizing or avoiding the trapping of air bubbles between the substrates. | 11-21-2013 |
20130341756 | SEMICONDUCTOR ON GLASS SUBSTRATE WITH STIFFENING LAYER AND PROCESS OF MAKING THE SAME - A semiconductor-on-glass substrate having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer or layers placed between the silicon film and the glass in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the ion implantation thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film. | 12-26-2013 |
20140027714 | QUANTUM WELL THERMOELECTRIC COMPONENT FOR USE IN A THERMOELECTRIC DEVICE - A quantum well thermoelectric component for use in a thermoelectric device based on the thermoelectric effect,
| 01-30-2014 |
20140038388 | METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR STRUCTURE HAVING LOW ELECTRICAL LOSSES, AND CORRESPONDING STRUCTURE - A manufacturing process for a semiconductor-on-insulator structure having reduced electrical losses and which includes a support substrate made of silicon, an oxide layer and a thin layer of semiconductor material, and a polycrystalline silicon layer interleaved between the support substrate and the oxide layer. The process includes a treatment capable of conferring high resistivity to the support substrate prior to formation of the polycrystalline silicon layer, and then conducting at least one long thermal stabilization on the structure at a temperature not exceeding 950° C. for at least 10 minutes. | 02-06-2014 |
20140183601 | METHOD FOR TRANSFERRING A LAYER OF A SEMICONDUCTOR AND SUBSTRATE COMPRISING A CONFINEMENT STRUCTURE - A method for transferring a layer of semiconductor by providing a donor substrate that includes a useful layer of a semiconductor material, a confinement structure that includes a confinement layer of a semiconductor material having a chemical composition that is different than that of the useful layer, and two protective layers of semiconductor material that is distinct from the confinement layer with the protective layers being arranged on both sides of the confinement layer; introducing ions into the donor substrate, bonding the donor substrate to a receiver substrate, subjecting the donor and receiver substrates to a heat treatment that provides an increase in temperature during which the confinement layer attracts the ions in order to concentrate them in the confinement layer, and detaching the donor substrate from the receiver substrate by breaking the confinement layer. | 07-03-2014 |
20150056783 | SYSTEMS AND METHODS FOR MOLECULAR BONDING OF SUBSTRATES - A method for bonding a first substrate having a first surface to a second substrate having a second surface. This method includes the steps of holding the first substrate by at least two support points, positioning the first substrate and the second substrate so that the first surface and the second surface face each other, deforming the first substrate by applying between at least one pressure point and the two support points a strain toward the second substrate, bringing the deformed first surface and the second surface into contact, and progressively releasing the strain to facilitate bonding of the substrates while minimizing or avoiding the trapping of air bubbles between the substrates. | 02-26-2015 |
Patent application number | Description | Published |
20100040876 | MULTI-LAYER COEXTRUSION METHOD - Method for protecting a thermoplastic polymer comprising superposing, in this order, by coextrusion, by hot compression molding or by multi-injection molding:
| 02-18-2010 |
20100143629 | METHACRYLIC COMPOSITION FOR OBTAINING A COATING HAVING A ROUGH TEXTURE AND A MATT APPEARANCE - The invention relates to a methacrylic composition comprising (100-x-y) parts of at least one methacrylic polymer that is a homopolymer or copolymer of MMA, dispersed in which are:
| 06-10-2010 |
20110312084 | USE OF A TRANSPARENT COMPOSITION FOR PHOTOBIOREACTORS - The present invention relates to photobioreactors and more particularly to the use of a transparent composition based on at least one methacrylic polymer for constructing installations for the culture of photosensitive organisms. This composition can be in the form of films, plates, profiled elements or cylinders such as tubes. | 12-22-2011 |
20140018469 | COMPOSITE MATERIAL CONTAINING CARBON NANOTUBES AND PARTICLES HAVING A CORE-SHELL STRUCTURE - A composite material including, in a polymeric composition, carbon nanotubes combined with particles having an elastomeric core and at least one thermoplastic shell. The composite material including, in a polymer composition, carbon nanotubes associated, so as to form aggregations of less than 30 μm, with particles having a core made of totally or partially crosslinked elastomer and at least one thermoplastic shell, in a weight ratio of the particles of core-shell structure to the nanotubes of between 0.5:1 and 2.5:1. Also, a method for preparing said material, as well as to the use thereof for imparting various properties to polymeric matrices. | 01-16-2014 |