Patent application number | Description | Published |
20090067151 | LIGHT GUIDE WITH FLEXIBILITY AND DURABILITY - A flexible light guide including a material having a tensile modulus of about 1 MPa to about 70 MPa, a T | 03-12-2009 |
20090118389 | Hardenable dental compositions with low polymerization shrinkage - The present invention features a hardenable dental composition that contains: (1) at least one cyclic allylic compound having at least one sulfur atom in the ring, and (2) at least one at least one ethylenically unsaturated compound, such as a substituted (meth)acryloyl compound. The compositions also typically comprise an initiator system, preferably a photoinitator system containing at least 0.08 wt-% of one or more photosensitizers. | 05-07-2009 |
20100056725 | DICING AND DIE ATTACH ADHESIVE - Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt. | 03-04-2010 |
20100090157 | ADHESIVE COMPOSITION FOR HARD TISSUE - An adhesive composition including an etchant for a hard tissue surface, at least one multifunctional crosslinkable (meth)acrylate monomer with a functionality greater than 4, and water. The adhesive composition is a water-in-oil emulsion. | 04-15-2010 |
20110064948 | DICING TAPE AND DIE ATTACH ADHESIVE WITH PATTERNED BACKING - Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern. | 03-17-2011 |
20110245077 | CURABLE HYDROPHILIC COMPOSITIONS - A curable composition is described, including a gel material derived from the curable composition, and medical articles including such material, wherein the transparent gel material includes a polymerized monofunctional poly(alkylene oxide) macromonomer component and a surface modified nanoparticle component. | 10-06-2011 |
20130333838 | LOW TEMPERATURE CURABLE EPOXY TAPE AND METHOD OF MAKING SAME - A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided. | 12-19-2013 |