Patent application number | Description | Published |
20090106723 | SEMICONDUCTOR DEVICE METAL PROGRAMMABLE POOLING AND DIES - A pool of die designs includes die designs having metal programmable base layers. Die designs from the pool are selected for use in fabricating dies. Die designs are added to the pool by customization of die designs already in the pool or by preparing custom die designs that incorporate a metal programmable base layer. In some embodiments multi-tile dies are provided with I/O slots configurable for either inter tile communication or inter die communication. | 04-23-2009 |
20100073026 | DIE APPARATUS HAVING CONFIGURABLE INPUT/OUTPUT AND CONTROL METHOD THEREOF - A metal configurable I/O structure for an integrated circuit is disclosed. The metal configurable I/O structure may be configured for one of any of a plurality of I/O specifications. Preferably a common voltage reference and a common current reference is generated for provision to a plurality of I/O structures. | 03-25-2010 |
20110121467 | SEMICONDUCTOR DEVICE METAL PROGRAMMABLE POOLING AND DIES - A pool of die designs includes die designs having metal programmable base layers. Die designs from the pool are selected for use in fabricating dies. Die designs are added to the pool by customization of die designs already in the pool or by preparing custom die designs that incorporate a metal programmable base layer. In some embodiments multi-tile dies are provided with I/O slots configurable for either inter tile communication or inter die communication. | 05-26-2011 |
20140061642 | METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCONNECTS - Various aspects of an approach for routing die signals in an interior portion of a die using external interconnects are described herein. The approach provides for contacts coupled to circuits in the interior portion of the die, where the contacts are exposed to an exterior portion of the die. The external interconnects are configured to couple these contacts so that signals from the circuits in the interior portion of the die may be routed externally to the die. In various aspects of the disclosed approach, the external interconnects are protected by a packaging for the die. | 03-06-2014 |
20140253228 | INTEGRATED CIRCUIT FLOORPLAN FOR COMPACT CLOCK DISTRIBUTION - An integrated circuit includes core logic and a plurality of interface blocks disposed about a periphery of the core logic. A plurality of input or output (I/O) circuits is assigned to one of the plurality of interface blocks. The I/O circuits include external I/O circuits coupled to a device other than the integrated circuit and internal I/O circuits coupled to the integrated circuit. Each interface block includes a first plurality of I/O circuits disposed on a first side of the interface block and a second plurality of I/O circuits disposed on a second side of the interface block. Each interface block also includes interface logic for the interface block between the first plurality of I/O circuits and the second plurality of I/O circuits, and a logic hub that includes a clock distribution of minimal length that drives launch logic and capture logic to form the I/O circuits of the interface block. | 09-11-2014 |
20140266357 | Measure-Based Delay Circuit - A master measure circuit is disclosed that may select from various nodes on a delay path carrying a signal. The master measure circuit measures the delay for propagation of the signal from one selected node to another selected node and controls an adjustable delay circuit in the delay path accordingly. | 09-18-2014 |
20150194197 | DYNAMIC RANDOM ACCESS MEMORY (DRAM) BACKCHANNEL COMMUNICATION SYSTEMS AND METHODS - Dynamic random access memory (DRAM) backchannel communication systems and methods are disclosed. In one aspect, a backchannel communication system allows a DRAM to communicate error correction information and refresh alert information to a System on a Chip (SoC), applications processor (AP), or other memory controller. | 07-09-2015 |
20150206854 | PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A REDISTRIBUTION LAYER - Some features pertain to an integrated device that includes a first package, a set of interconnects, and a second package. The first package includes a first substrate comprising a first surface and a second surface. The first package includes a redistribution portion comprising a redistribution layer. The first package includes a first die coupled to the first surface of the first substrate. The set of interconnects is coupled to the redistribution portion of the first package. The second package is coupled to the first package through the set of interconnects. The second package includes a second substrate comprising a first surface and a second surface; and a second die coupled to the first surface of the second substrate, where the second die is electrically coupled to the first die through the second substrate of the second package, the set of interconnects, and the redistribution portion of the first package. | 07-23-2015 |