Patent application number | Description | Published |
20090084760 | METHOD FOR REMOVING MATERIAL FROM SOLIDS AND USE THEREOF - The invention relates to a method for material removal on solid bodies, in particular for microstructuring and cutting, by means of liquid jet-guided laser etching, the removed material just as the non-reacted etching components being recycled to a high degree. In this way, silicon with high purity can be recovered either in a polycrystalline manner or be deposited epitaxially on other substrates in the same process chain. | 04-02-2009 |
20090212020 | Method for Microstructuring Solid Surfaces - The invention relates to a method for microstructuring solid surfaces by chemical or electrochemical etching, in which the solid surface is treated with an etching fluid with formation of intermediate products which are insoluble or low-soluble in the etching fluid. By additional use of a particle stream, these intermediate products can be removed in a simple manner. Associated herewith is the advantage that low damage microstructuring of solid bodies is made possible. | 08-27-2009 |
20100144079 | METHOD FOR THE PRECISION PROCESSING OF SUBSTRATES - The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, local dopant introduction and also local application of a metal nucleation layer in which a liquid-assisted laser, i.e. laser irradiation of a substrate which is covered in the regions to be processed by a suitable reactive liquid, is implemented. | 06-10-2010 |
20100167510 | METHODS OF USING A SET OF SILICON NANOPARTICLE FLUIDS TO CONTROL IN SITU A SET OF DOPANT DIFFUSION PROFILES - A method of forming a multi-doped junction is disclosed. The method includes providing a first substrate and a second substrate. The method also includes depositing a first ink on a first surface of each of the first substrate and the second substrate, the first ink comprising a first set of nanoparticles and a first set of solvents, the first set of nanoparticles comprising a first concentration of a first dopant. The method further includes depositing a second ink on a second surface of each of the first substrate and the second substrate, the second ink comprising a second set of nanoparticles and a second set of solvents, the second set of nanoparticles comprising a second concentration of a second dopant. The method also includes placing the first substrate and the second substrate in a back to back configuration; and heating the first substrate and the second substrate in a first drive-in ambient to a first temperature and for a first time period. The method further includes exposing the first substrate and the second substrate in the back to back configuration to a deposition ambient, the deposition ambient comprising POCl | 07-01-2010 |
20100213166 | Process and Device for The Precision-Processing Of Substrates by Means of a Laser Coupled Into a Liquid Stream, And Use of Same - The invention relates to a method for precision processing of substrates in which a liquid jet which is directed towards a substrate surface and contains a processing reagent is guided over the regions of the substrate to be processed, a laser beam being coupled into the liquid jet. Likewise, a device which is suitable for implementation of the method is described. The method is used for different process steps in the production of solar cells. | 08-26-2010 |
20110092074 | Texturing and cleaning agent for the surface treatment of wafers and use thereof - A liquid agent for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and also at least one low-volatile organic compound. Systems of this type can be used both for the cleaning, damage etch and texturing of wafer surfaces in a single etching step and exclusively for the texturing of silicon wafers with different surface quality, whether it now be wire-sawn wafers with high surface damage or chemically polished surfaces with minimum damage density. | 04-21-2011 |
20120055541 | FRONT-AND-BACK CONTACT SOLAR CELLS, AND METHOD FOR THE PRODUCTION THEREOF - The invention relates to a method for the production of solar cells which are contacted on both sides, which method is based on micro structuring of a wafer provided with a dielectric layer and doping of the microstructured regions. Subsequently, deposition of a metal-containing nucleation layer and also a galvanic reinforcement of the contactings is effected. The invention relates likewise to solar cells which can be produced in this way. | 03-08-2012 |
20120058632 | METHODS OF FORMING A METAL CONTACT ON A SILICON SUBSTRATE - A method of forming a metal contact on a silicon substrate is disclosed. The method includes depositing a nanoparticle ink on a substrate surface in a pattern, the nanoparticle ink comprising set of nanoparticles and a set of solvents. The method also includes heating the substrate in a baking ambient to a first temperature and for a first time period in order to create a densified nanoparticle layer with a nanoparticle layer thickness of greater than about 50 nm. The method further includes depositing an SiN | 03-08-2012 |
20120138138 | Solar cells with back side contacting and also method for production thereof - A method for producing solar cells with back side contacting, which is based on a microstructuring of a wafer provided with a dielectric layer and a doping of the microstructured regions on the back side and also an emitter diffusion on the front side. Subsequently, the deposition of a metal-containing nucleation layer and also a galvanic reinforcement of the contactings on the back side is effected. Solar cells which can be produced in accordance with the foregoing method. | 06-07-2012 |