Patent application number | Description | Published |
20080251757 | Latent Hardener For Epoxy Resin and Epoxy Resin Composition - A subject of the present invention is to provide a one-pot type epoxy resin composition having both high curability and storage stability and a latent hardener for obtaining the same, and to provide anisotropic conductive materials, conductive adhesive materials, insulating adhesive materials, sealing materials, and the like which have high storage stability, solvent resistance and humidity resistance and can provide high connection reliability, adhesive strength and high sealing properties even under curing conditions such as low temperatures or short periods of time. The present invention relates to a latent hardener for epoxy resins in which a hardener (A) for epoxy resins is covered with a film (c1) obtained by reacting an isocyanate component (b1) comprising a low molecular bifunctional aliphatic isocyanate compound in an amount of 1% by mass or more and 95% by mass or less with an active hydrogen compound (b2), and to a one-pot type epoxy resin composition using the same. | 10-16-2008 |
20090186962 | Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good - Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm | 07-23-2009 |
20090261298 | High-Stability Microencapsulated Hardened for Epoxy Resin and Epoxy Resin Composition - A microencapsulated latent hardener for epoxy resins which comprises cores (C) and shells (S) with which the cores are covered, characterized in that the cores (C) are ones formed from, as a starking material, particles of an epoxy resin hardener (H) comprising an amine adduct (A) and a low-molecular amine compound (B) as major ingredients and that the shells (S) have on the surface thereof connecting groups (x), (y), and (z) which absorb infrared. Also provided is an epoxy resin composition containing the hardener. | 10-22-2009 |