Patent application number | Description | Published |
20090009976 | MEMORY CARD - Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board. | 01-08-2009 |
20090009979 | Substrate Joining Member and Three-Dimensional Structure Using the Same - Three-dimensional structure ( | 01-08-2009 |
20090166064 | CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME - The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component. | 07-02-2009 |
20090321122 | RELAY SUBSTRATE, METHOD FOR MANUFACTURING THE RELAY SUBSTRATE AND THREE-DIMENSIONAL CIRCUIT DEVICE USING THE RELAY SUBSTRATE - Relay substrate ( | 12-31-2009 |
20100025847 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOUNTED METHOD - A recess portion is formed on a board surface at a position facing a peripheral end portion of a semiconductor device so as to place a sealing-bonding use resin partially inside the recess portion. Thereby, increases of a placement area for a fillet portion (foot spreading portion) of the sealing-bonding use resin are suppressed while its inclination angle is increased. Thus, stress loads that occur to peripheral portions of the semiconductor device due to thermal expansion differences and thermal contraction differences among individual members caused by heating process and cooling process in mounting operation are relaxed, by which internal breakdown of the semiconductor device mounted structure is avoided. | 02-04-2010 |
20100080912 | PASTE APPLICATOR AND PASTE APPLICATION METHOD | 04-01-2010 |
20100084762 | MEMORY CARD - Memory card ( | 04-08-2010 |
20100090781 | SHEET-LIKE COMPOSITE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME - To provide a configuration including a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component. | 04-15-2010 |
20100148302 | CAPACITOR-EQUIPPED SEMICONDUCTOR DEVICE - A capacitor-equipped semiconductor device includes a semiconductor chip having a plurality of electrode terminals; a sheet-like substrate at least having a film capacitor; and a mounting substrate. The mounting substrate is provided on one side thereof with chip connection terminals and ground terminals. The chip connection terminals are disposed to correspond to the electrode terminals of the semiconductor chip. The ground terminals are disposed to correspond to the one electrode terminals of the film capacitor of the sheet-like substrate. The mounting substrate is provided on the other side thereof with external connection terminals connected to the chip connection terminals and the ground terminals and used to mount the mounting substrate on an external substrate. | 06-17-2010 |
20130010436 | CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME - The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component. | 01-10-2013 |