Daewook
Daewook Byun, Seoul KR
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20150023319 | METHOD AND APPARATUS FOR TRANSMITTING USER EQUIPMENT GROUP INFORMATION IN WIRELESS COMMUNICATION SYSTEM - A method and apparatus for transmitting user equipment (UE) group information in a wireless communication system is provided. A source eNodeB (eNB) of a handover procedure transmits a handover request message including UE group information to a target eNB of the handover procedure when the source eNB hands over a UE to the target eNB. The UE group information is included in a UE history information IE (information element) of the handover request message. | 01-22-2015 |
Daewook Kim, Hwaseong-Si KR
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20110237005 | Layout Testing Method and Wafer Manufacturing Method - A product layout testing method includes testing and correcting one or more patterns of a product layout, detecting and correcting electrical characteristic changes of transistors of the product layout, and testing whether a product characteristic predicted from the product layout is equal to that predicted from a designed circuit view. Weak points with respect to the pattern may be detected and corrected, electrical characteristic changes depending on layout parameters may be detected and corrected, and whether a circuit operation depending on parasitic components is normal may be checked. | 09-29-2011 |
Daewook Kim, Seoul KR
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20130179659 | DATA STORAGE DEVICE WITH SELECTIVE DATA COMPRESSION - A memory controller comprises a host interface block comprising a compression ratio calculator configured to determine whether a compression ratio of input data exceeds a predetermined compression ratio, and a compression block configured to compress the input data as a consequence of the host compression ratio calculator determining that the compression ratio exceeds the predetermined compression ratio. | 07-11-2013 |
Daewook Yang, Pyoungtaek-Si KR
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20100038804 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLD GATE - An integrated circuit package system includes: providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization over the conductive layer; and attaching an integrated circuit over the substrate adjacent the mold gate layer. | 02-18-2010 |
20100320587 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a device having a conductor with ends exposed on opposite sides of the device; forming a first surface depression on the device around the conductor; connecting a first component over the conductor and surrounded by the first surface depression; and applying a first underfill between the first component and the device, the first underfill substantially filled within a perimeter of the first surface depression. | 12-23-2010 |
Daewook Yang, Kyunggi-Do KR
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20120056334 | Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Mounting - A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting. | 03-08-2012 |
20130200527 | Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Molding - A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting. | 08-08-2013 |
Daewook Yang, Gyeonggi-Do KR
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20130249079 | Semiconductor Device and Method of Singulating Semiconductor Wafer along Modified Region within Non-Active Region Formed by Irradiating Energy through Mounting Tape - A semiconductor device has a semiconductor wafer with a plurality of semiconductor die separated by a non-active region. The semiconductor die can be circular or polygonal with three or more sides. A plurality of bumps is formed over the semiconductor die. A portion of semiconductor wafer is removed to thin the semiconductor wafer. A wafer ring is mounted to mounting tape. The semiconductor wafer is mounted to the mounting tape within the wafer ring. The mounting tape includes translucent or transparent material. A penetrable layer is applied over the bumps formed over the semiconductor wafer. An irradiated energy from a laser is applied through the mounting tape to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. | 09-26-2013 |