Patent application number | Description | Published |
20120075833 | LED LAMP - A thermal isolation arrangement for an LED lamp is disclosed. Embodiments of the invention provide thermal isolation between the power supply and the LED assembly of an LED lamp, in most cases allowing the power supply to operate in a lower temperature range than would otherwise be possible. At least one contact feature is provided between the power supply and the LED assembly to maintain a thermal transfer gap between the power supply and the LED assembly. A contact feature can be, for example, a triangular ridge or a conical protrusion. In some embodiments, a thermal isolation device provides the contact feature or contact features. An LED lamp according to example embodiments of the invention can have a modular design and/or can include an Edison base and/or an optical element or optical elements disposed to emit light from the LED lamp. | 03-29-2012 |
20120268936 | HEAT SINK STRUCTURES, LIGHTING ELEMENTS AND LAMPS INCORPORATING SAME, AND METHODS OF MAKING SAME - In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures. | 10-25-2012 |
20120327670 | Hybrid Solid State Emitter Printed Circuit Board for Use in a Solid State Directional Lamp - An assembly for use in a solid state directional lamp is disclosed. The assembly includes a multilayer FR4 printed circuit board and a metal heat spreader assembled with the multilayer FR4 printed circuit board. The assembly is configured to mount a plurality of solid state light emitters. The multilayer FR4 printed circuit board defines an aperture and a least a portion of the metal heat spreader is positioned in the aperture of the multilayer FR4 printed circuit board. The portion of the heat spreader positioned in the aperture of the multilayer FR4 printed circuit board is in communication with heat dissipation means. | 12-27-2012 |
20130016508 | VARIABLE THICKNESS GLOBEAANM PROGL; CURTAACI RaleighAAST NCAACO USAAGP PROGL; CURT Raleigh NC USAANM DIXON; MARKAACI MorrisvilleAAST NCAACO USAAGP DIXON; MARK Morrisville NC US - A variable thickness globe for a lighting device comprises a wall including a curved outer surface and an inner surface. A thickness of the wall between the curved outer surface and the inner surface varies over a predetermined extent of the wall. | 01-17-2013 |
20130113358 | LAMP WITH REMOTE LED LIGHT SOURCE AND HEAT DISSIPATING ELEMENTS - LED based lamps and bulbs are disclosed that comprise an elevating element to arrange. LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements. | 05-09-2013 |
20130193850 | REMOTE THERMAL COMPENSATION ASSEMBLY - A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided. | 08-01-2013 |
20130194796 | LAMP STRUCTURE WITH REMOTE LED LIGHT SOURCE - LED based lamps and bulbs are disclosed that comprise an elevating element to arrange LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so that at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. In some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. | 08-01-2013 |
20130201679 | LIGHTING DEVICE AND METHOD OF INSTALLING LIGHT EMITTER - A lighting device comprising a junction box, a trim element and a solid state light emitter, at least a portion of a space defined by regions of the trim element within a space defined by regions of the junction box, the light emitter within the trim element space. A lighting device comprising a trim element (with at least two regions) and a solid state light emitter, in which at least a first part of the first region can be positioned in a first space with the second region outside the first space, the light emitter within the first part. A lighting device, comprising a trim element (which comprises at least two regions), part of an exterior of which defines a first space, at least a first part of the first region within the first space, a solid state light emitter within the first part. Methods of installing a light emitter. | 08-08-2013 |
20130208469 | LIGHTING DEVICE COMPRISING SHIELD ELEMENT, AND SHIELD ELEMENT - A lighting device, comprising a shield element and at least a first light source, the first light source within a space defined by portions of the shield element, the shield element comprising at least one vent, the shield element blocking the first light source from direct view from locations outside the shield element. Also, a lighting device, comprising a shield element and at least a first light source, the shield element comprising regions that define an opening, the first light source within a space defined by portions of the shield element and the opening. Also, a shield element. | 08-15-2013 |
20130265750 | LIGHTING DEVICE AND METHOD OF INSTALLING LIGHT EMITTER - A lighting device configured to be held relative to a space extending from an opening in a first surface. A distance between first and second emitters and/or a dimension of a lens is/are larger than a largest dimension of the opening and/or a largest dimension of a power supply. Also, a bracket comprising a body member and at least two mounting clips, the body member configured to be attached to a lighting device, each mounting clip pivotable about respective pivot axes at least from a first position, where a first end region of the clip does not extend farther from an axis of the body member than all portions of the body member, to a second position, where the first end region of the clip extends farther from the axis of the body member than all portions of the body member. Also, a lighting device comprising a removable bracket. | 10-10-2013 |
20130271981 | LED LAMP - A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base. | 10-17-2013 |
20130271987 | GAS COOLED LED LAMP - A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the LED assembly is mounted on a glass stem. In some embodiments a thermal resistant path is created that prevents overtemperature of the LED array during the making of the lamp. In some embodiments the LED assembly comprises a lead frame and/or metal core board that is bent into a three-dimensional shape to create a desired light pattern in the enclosure or an extruded submount formed into a three-dimensional shape. | 10-17-2013 |
20130271989 | GAS COOLED LED LAMP - In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen. | 10-17-2013 |
20130271990 | GAS COOLED LED LAMP - In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen. | 10-17-2013 |
20130271991 | LED LAMP - A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base. | 10-17-2013 |
20130279175 | LED LAMP - A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp that extends from the base to the free end of the enclosure. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly includes LEDs operable to emit light when energized through an electrical path from the base. The LED assembly is arranged such that the plurality of LEDs face perpendicularly to the longitudinal axis of the lamp. The emission profile of the LEDs being at least 120 degrees FWHM. | 10-24-2013 |
20130294092 | LED LAMP - A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower. | 11-07-2013 |
20130301252 | GAS COOLED LED LAMP - In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. A board supports lamp electronics for the lamp and is located in the enclosure. The LED array is mounted to the board and LEDs are mounted on a submount formed to have a three dimensional shape. The board is electrically coupled to the LED array and the submount may be thermally coupled to the gas for dissipating heat from the plurality of LEDs. | 11-14-2013 |
20140036497 | LED LAMP - A lamp comprises an enclosure comprising a reflector and a lens where the reflector is made of thermally conductive material. A base is coupled to the enclosure. An LED is located in the enclosure and emits light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion that may be at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the LED. The reflector is thermally coupled to the heat sink and is exposed to the exterior of the lamp such that heat from the heat sink may be dissipated to the ambient environment at least partially through the reflector. | 02-06-2014 |
20140239794 | GAS COOLED LED LAMP - In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen. | 08-28-2014 |
20140268826 | LED LAMP AND HEAT SINK - A lamp has an optically transmissive enclosure and a base. At least one LED is located in the enclosure and are operable to emit light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion having a first part that is located inside of the enclosure and that is thermally coupled to the LED and a second part that is exposed to the ambient environment. The second part comprises a plurality of stems connected to the first part where each stem supports a first overhang that extends over a portion of the enclosure and a second overhang that extends over a portion of the base. | 09-18-2014 |
20150062909 | LED LAMP - A LED lamp includes an at least partially optically transmissive enclosure and a base. A LED assembly comprising at least one LED is located in the enclosure and is operable to emit light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the at least one LED. The heat sink is connected to the base by a snap fit connector comprising a deformable first member on one of the base or heat sink engaging a second member on the other one of the heat sink and the base. A retention member holds the first member in engagement with the second member. A seal is positioned between the heat sink and the base, the seal being compressed between the heat sink and the base. | 03-05-2015 |