Patent application number | Description | Published |
20130120900 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes, wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%. | 05-16-2013 |
20130229748 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by T | 09-05-2013 |
20130314843 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes each formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes respectively including first and second lead parts extended therefrom to be exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element, and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively, wherein a ratio of a width of the first or second lead part to a width of the first or second external electrode is | 11-28-2013 |
Patent application number | Description | Published |
20110273395 | TOUCH SCREEN AND METHOD FOR CONTROLLING THE SAME - Disclosed herein are a touch screen and a method for controlling the same. The touch screen includes: two sheets of transparent substrates; transparent electrodes each formed on one surface of the two sheets of transparent substrates and sensing the change in capacitance at the time of a user input; and a spacer bonding one surface of the two sheets of transparent substrates to each other, wherein the coordinates of the input are measured by detecting the change in capacitance sensed by the transparent electrodes and lowering sensitivity when the capacitance becomes larger. The embodiments provide the touch screen that can accurately measure the coordinates by controlling the sensitivity based on the change in capacitance, and the method for controlling the same. | 11-10-2011 |
20110273396 | TOUCH SCREEN DEVICE - Disclosed herein is a touch screen device, including: a touch panel; a display panel that is installed under the touch panel; and a plurality of pressure-sensitive sensors that are formed to be spaced from each other on the outer sides between the touch panel and the display panel and include an insulating substrate, electrodes that include anode electrodes and cathode electrodes formed to be spaced from each other on the insulating substrate, and piezo resistors that are formed on the insulating substrate on which the electrodes are formed and have resistance values varied depending on the pressure to be applied. The touch screen device can measure the strength of the contact input as well as the 2D coordinates using the piezo resistors of the pressure-sensitive sensor. | 11-10-2011 |
20110291821 | HAPTIC DEVICE - Disclosed herein is a haptic device | 12-01-2011 |
20120013566 | PRESSURE SENSING MODULE OF TOUCH MODULE AND METHOD OF OPERATING THE SAME - Disclosed herein is a pressure sensing module of a touch panel, including: an input unit | 01-19-2012 |
20120013576 | PIEZO-TYPE SCANNING APPARATUS AND TOUCH SCREEN USING THE SAME - Disclosed herein are a piezo-type scanning apparatus and a touch screen using the same. The preferred embodiments of the present invention provides the scanning apparatus including a light source; an optical fiber of which one end is connected to the light source to provide a transmission line; a support that supports the side surface of the optical fiber; and a driving body that is positioned between the support and the light source to provide driving force rotating the optical fiber using piezoelectric force, and the touch screen using the same. | 01-19-2012 |
20120017433 | METHOD OF MANUFACTURING TOUCH SCREEN - Disclosed herein is a method of manufacturing a touch screen, including: (A) preparing a transparent substrate; (B) forming a patterned transparent electrode including a conductive polymer on the transparent substrate and allowing patterns of the transparent electrode in different columns to be connected by a connection part; and (C) removing the connection part of the transparent electrode. The method of manufacturing a touch screen forms the transparent electrode so that the patterns in different columns are definitely spaced apart from each other to accurately detect touched positions. | 01-26-2012 |
Patent application number | Description | Published |
20110008716 | FUEL CELL INCLUDING SUPPORT HAVING MESH STRUCTURE - Disclosed is a solid oxide fuel cell, which includes a support having a mesh structure, an anode layer formed on an outer surface of the support, an electrolyte layer formed on an outer surface of the anode layer, and a cathode layer formed on an outer surface of the electrolyte layer and also which is lightweight and enables current collection. | 01-13-2011 |
20110014539 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell comprising a support including hollow porous bodies. | 01-20-2011 |
20110027682 | PORTABLE ELECTRONIC DEVICE COMPRISING FUEL CELL POWER SYSTEM - Disclosed herein is a portable electronic device including a fuel cell power system, including: a fuel storage tank for supplying fuel; a flat stack for generating electric energy using the fuel supplied from the fuel storage tank; a pressure control unit for controlling the pressure of the fuel supplied to the flat stack; a converter for converting the voltage of the electric energy generated from the flat stack; and a connector for transferring the electric energy converted through the converter to power terminals of the portable electronic device. The portable electronic device has optimal efficiency and is compatible with conventional portable electronic devices. | 02-03-2011 |
20110033780 | FUEL CELL HAVING CURRENT - COLLECTABLE MANIFOLD - A fuel cell includes a cell unit and a manifold capable of collecting electric current. The cell unit includes a tube support composed of a conductive material, a unit cell laminated on an outer surface of the tube support, and a current collection layer laminated on an outer surface of the unit cell. The manifold includes an inner tube supplying gas into and electrically connected with the tube support, and an outer tube provided outside the inner tube and electrically connected with the current collection layer. By the provision of a current-collectable manifold, a separate metal form or metal wire for current collection is not | 02-10-2011 |
20110053045 | SOLID OXIDE FUEL CELL AND METHOD OF MANUFACTURING THE SAME - Disclosed is a solid oxide fuel cell, including a polygonal tubular support an outer surface of which has a plurality of planes, a plurality of unit cells respectively formed on the plurality of planes of the tubular support, inner connectors for connecting the plurality of unit cells in series, and a pair of outer connectors for connecting the plurality of unit cells connected in series to a current collector, so that respective unit cells are connected in series on the planes of the tubular support, thus exhibiting excellent cell performance and high power density per unit volume, and maintaining high voltage upon collection of current to thereby reduce power loss due to electrical resistance. A method of manufacturing the solid oxide fuel cell is also provided. | 03-03-2011 |
20120088178 | FUEL CELL AND MANUFACTURING METHOD THEREOF - There are provided a fuel cell and a manufacturing method thereof. The manufacturing method of a fuel cell includes: providing a support for a fuel cell; and forming an interconnecting member layer including metal-glass and interconnecting unit cells on the support. According to the present invention, since an interconnecting member having high durability, chemical resistance properties and improved electrical conductivity is provided, a fuel cell having improved electrical characteristics and an improved durability may be provided. | 04-12-2012 |
20120178012 | SEALING MEMBER FOR SOLID OXIDE FUEL CELL AND SOLID OXIDE FUEL CELL EMPLOYING THE SAME - Disclosed herein are a sealing member for a solid oxide fuel cell and a solid oxide fuel cell employing the same. The sealing member for a solid oxide fuel cell includes: a glass sheet; and mica layers formed on both surfaces of the glass sheet. The sealing member can have excellent airtightness and bonding capability, proper flow characteristics, and high electric resistivity, by constituting the sealing member of the glass sheet and the mica layers. | 07-12-2012 |
20130078546 | SOLID OXIDE FUEL CELL AND SOLID OXIDE FUEL CELL MODULE - Disclosed herein are a solid oxide fuel cell and a solid oxide fuel cell module. The solid oxide fuel cell includes: a unit cell including an anode, an electrolyte formed to surround the outer circumference of the anode and having a first opening part exposing the anode in a longitudinal direction, a cathode formed to surround the outer circumference of the electrolyte and having a second opening part corresponding to the first opening part, and a connector formed to cover the first opening part; a first current collecting member formed to be contacted with the anode; an insulating member formed to cover the first current collecting member; a second current collecting member formed to be contacted with the cathode; and a fixing unit integrating and fixing the first current collecting member, the insulating member, and the second current collecting member with the unit cell. | 03-28-2013 |
20130137013 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell, including: a unit cell; a current collector formed in a flat shape having a first surface and a second surface, the first surface including a groove formed in a thickness direction so as to receive the unit cell therein; and a circular support member formed between the first surface and the second surface of the current collector, wherein the support member is provided in plural, and the support members for respective regions have different diameters. | 05-30-2013 |
20130143140 | SOLID OXIDE FUEL CELL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a solid oxide fuel cell. The solid oxide fuel cell includes cylindrical fuel cells and a current collector. The fuel cells are inserted into the current collector so that the fuel cells are connected in parallel to each other. The current collector includes an upper plate and a lower plate. The upper plate includes protruding parts each having a slot. An upper connection part connects the protruding parts in parallel to each other. The lower plate has a mesh structure and has semicircular support parts corresponding to the respective protruding parts. A lower connection part connects the semicircular support parts in parallel to each other. The solid oxide fuel cell unitizes connection between the fuel cells and current collection, thus simplifying a current collecting process, and minimizing a connection loss that may be induced in connection between the fuel cells. | 06-06-2013 |
20130164651 | SOLID OXIDE FUEL CELL AND CURRENT COLLECTING METHOD THEREOF - Disclosed herein is a solid oxide fuel cell including a cylindrical fuel cell and a current collector inserted with the cylindrical fuel cell and herein, the current collector is constituted by the semicircular mesh structure inserted with the cylindrical fuel cell and at least one metal connection plate connected with both ends of an opened part of the mesh structure and having an inner surface contacting a lower part of the mesh structure. According to the present invention, serial and parallel connections between cells of the fuel cell can be arbitrarily constructed with a metal connection plate and a current collector having a mesh structure as one unit module. | 06-27-2013 |
20130171539 | TUBULAR SOLID OXIDE FUEL CELL MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a tubular solid oxide fuel cell module including an anode layer, an electrolyte layer, a cathode layer divided into two parts or more, a conductive mesh structure and a conductive wire, and a method of manufacturing the same. The tubular solid oxide fuel cell is advantageous in that the cathode is divided into two parts or more, so that the moving distance of electric charges is decreased, with the result that resistance loss can be minimized, thereby increasing the efficiency of collecting electric charges. | 07-04-2013 |
20130171544 | FUEL CELL MODULE - Disclosed herein is a fuel cell module. The fuel cell module according to preferred embodiments of the present invention includes: a first support part including a first body part surrounding one side of an outer peripheral surface of a fuel cell and a first connection part formed on one side of the first body part in a longitudinal direction; a second support part including a second body part surrounding the other side of the outer peripheral surface of the fuel cell and the second connection part formed on one side of the second body part in a longitudinal direction; and a fixing part passing through the first connection part and the second connection part to connect and fix the first connection part and the second connection part to each other. | 07-04-2013 |
Patent application number | Description | Published |
20090301766 | Printed circuit board including electronic component embedded therein and method of manufacturing the same - Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified. | 12-10-2009 |
20090310323 | Printed circuit board including electronic component embedded therein and method of manufacturing the same - The present invention relates to a printed circuit board including an electronic component embedded therein and a method of manufacturing the board, which electrically connect electrode terminals of the electronic component to the internal circuit layers using connecting parts, thus the circuit density is dispersed | 12-17-2009 |
20090315194 | Semiconductor chip having alignment mark and method of manufacturing the same - Disclosed is a semiconductor chip having an alignment mark which is formed on the surface of the semiconductor chip where no external connection bump is formed, and which has the position information of the external connection bump. A method of manufacturing the semiconductor chip having an alignment mark is also provided. Because the semiconductor chip includes the alignment mark having the position information of the external connection bump, the external connection bump is matched with a via which is formed in the external circuit layer of a printed circuit board including the semiconductor chip, thus improving electrical connection with the printed circuit board, and increasing the reliability of the printed circuit board including the semiconductor chip. | 12-24-2009 |
20110314667 | Method of manufacturing printed circuit board including electronic component embedded therein - A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed | 12-29-2011 |
20120160549 | PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a printed circuit board having an embedded electronic component, including a metal substrate having a first cavity formed in a thickness direction and a support plate integrated with one side of the metal substrate and formed in the first cavity. Thereby, a method of manufacturing such a printed circuit board is also provided. When manufacturing the printed circuit board having an embedded electronic component, there is no need for an additional member including support tape to seat the electronic component, thus simplifying the manufacturing process and reducing lead time, thereby improving productivity. | 06-28-2012 |
20130320516 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings. | 12-05-2013 |